View source for Category:Dun-Nian Yaung

== Dun-Nian Yaung ==

=== Executive Summary ===
Dun-Nian Yaung is an inventor who has filed 16 patents. Their primary areas of innovation include {Interconnect structures} (10 patents), {Pixel isolation structures} (8 patents), {Assemblies, i.e. Hybrid structures} (6 patents), and they have worked with companies such as Taiwan Semiconductor Manufacturing Company, Ltd. (16 patents). Their most frequent collaborators include [[Category:Jen-Cheng Liu|Jen-Cheng Liu]] (8 collaborations), [[Category:Feng-Chi Hung|Feng-Chi Hung]] (6 collaborations), [[Category:Tzu-Jui Wang|Tzu-Jui Wang]] (5 collaborations).

=== Patent Filing Activity ===
[[File:Dun-Nian_Yaung_Monthly_Patent_Applications.png|border|800px]]

=== Technology Areas ===
[[File:Dun-Nian_Yaung_Top_Technology_Areas.png|border|800px]]

==== List of Technology Areas ====
* [[:Category:CPC_H01L27/14636|H01L27/14636]] ({Interconnect structures}): 10 patents
* [[:Category:CPC_H01L27/1463|H01L27/1463]] ({Pixel isolation structures}): 8 patents
* [[:Category:CPC_H01L27/14634|H01L27/14634]] ({Assemblies, i.e. Hybrid structures}): 6 patents
* [[:Category:CPC_H01L27/14683|H01L27/14683]] ({Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof  (not peculiar thereto): 4 patents
* [[:Category:CPC_H01L27/14643|H01L27/14643]] ({Photodiode arrays; MOS imagers}): 4 patents
* [[:Category:CPC_H01L27/14689|H01L27/14689]] ({MOS based technologies}): 4 patents
* [[:Category:CPC_H01L27/1469|H01L27/1469]] ({Assemblies, i.e. hybrid integration}): 4 patents
* [[:Category:CPC_H01L24/08|H01L24/08]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
* [[:Category:CPC_H01L25/0657|H01L25/0657]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
* [[:Category:CPC_H01L23/5226|H01L23/5226]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
* [[:Category:CPC_H01L27/1464|H01L27/1464]] ({Back illuminated imager structures}): 2 patents
* [[:Category:CPC_H01L24/80|H01L24/80]] ({Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected}): 2 patents
* [[:Category:CPC_H01L2224/08145|H01L2224/08145]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
* [[:Category:CPC_H01L2224/80895|H01L2224/80895]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
* [[:Category:CPC_H01L2224/80896|H01L2224/80896]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
* [[:Category:CPC_H01L23/5223|H01L23/5223]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
* [[:Category:CPC_H01L24/03|H01L24/03]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L24/09|H01L24/09]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2224/03848|H01L2224/03848]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2224/08054|H01L2224/08054]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2224/08056|H01L2224/08056]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2224/08112|H01L2224/08112]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2224/08147|H01L2224/08147]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2224/0903|H01L2224/0903]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2924/12043|H01L2924/12043]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2924/1431|H01L2924/1431]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2924/1434|H01L2924/1434]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L21/76224|H01L21/76224]] ({using trench refilling with dielectric materials  (trench filling with polycristalline silicon): 1 patents
* [[:Category:CPC_H01L27/14621|H01L27/14621]] ({Colour filter arrangements}): 1 patents
* [[:Category:CPC_H01L27/14627|H01L27/14627]] ({Microlenses}): 1 patents
* [[:Category:CPC_H01L27/14632|H01L27/14632]] ({Wafer-level processed structures}): 1 patents
* [[:Category:CPC_H01L21/76256|H01L21/76256]] (Dielectric regions {, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers}): 1 patents
* [[:Category:CPC_H01L27/14687|H01L27/14687]] ({Wafer level processing}): 1 patents
* [[:Category:CPC_H04N25/75|H04N25/75]] (Circuitry for providing, modifying or processing image signals from the pixel array): 1 patents
* [[:Category:CPC_H01L27/1461|H01L27/1461]] ({characterised by the photosensitive area}): 1 patents
* [[:Category:CPC_H01L28/91|H01L28/91]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L28/87|H01L28/87]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L27/14603|H01L27/14603]] ({Special geometry or disposition of pixel-elements, address-lines or gate-electrodes}): 1 patents
* [[:Category:CPC_H01L23/481|H01L23/481]] (Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements {; Selection of materials therefor}): 1 patents
* [[:Category:CPC_H01L21/76898|H01L21/76898]] ({formed through a semiconductor substrate}): 1 patents
* [[:Category:CPC_H01L24/00|H01L24/00]] ({Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto}): 1 patents
* [[:Category:CPC_H01L21/78|H01L21/78]] (with subsequent division of the substrate into plural individual devices  (cutting to change the surface-physical characteristics or shape of semiconductor bodies): 1 patents
* [[:Category:CPC_H01L23/5283|H01L23/5283]] ({Geometry or} layout of the interconnection structure {(): 1 patents
* [[:Category:CPC_H01L25/50|H01L25/50]] ({Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group): 1 patents
* [[:Category:CPC_H01L23/53223|H01L23/53223]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_G02B6/4202|G02B6/4202]] (Coupling light guides with opto-electronic elements): 1 patents
* [[:Category:CPC_G02B6/43|G02B6/43]] (Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections): 1 patents
* [[:Category:CPC_H01L21/486|H01L21/486]] (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 1 patents
* [[:Category:CPC_H01L23/5386|H01L23/5386]] (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates  ({): 1 patents

=== Companies ===
[[File:Dun-Nian_Yaung_Top_Companies.png|border|800px]]

==== List of Companies ====
* Taiwan Semiconductor Manufacturing Company, Ltd.: 16 patents

=== Collaborators ===
* [[:Category:Jen-Cheng Liu|Jen-Cheng Liu]][[Category:Jen-Cheng Liu]] (8 collaborations)
* [[:Category:Feng-Chi Hung|Feng-Chi Hung]][[Category:Feng-Chi Hung]] (6 collaborations)
* [[:Category:Tzu-Jui Wang|Tzu-Jui Wang]][[Category:Tzu-Jui Wang]] (5 collaborations)
* [[:Category:Chen-Jong Wang|Chen-Jong Wang]][[Category:Chen-Jong Wang]] (5 collaborations)
* [[:Category:Min-Feng Kao|Min-Feng Kao]][[Category:Min-Feng Kao]] (4 collaborations)
* [[:Category:Hao-Lin Yang|Hao-Lin Yang]][[Category:Hao-Lin Yang]] (3 collaborations)
* [[:Category:Ching-Chun Wang|Ching-Chun Wang]][[Category:Ching-Chun Wang]] (3 collaborations)
* [[:Category:Wen-Chang Kuo|Wen-Chang Kuo]][[Category:Wen-Chang Kuo]] (3 collaborations)
* [[:Category:Kuan-Chieh Huang|Kuan-Chieh Huang]][[Category:Kuan-Chieh Huang]] (2 collaborations)
* [[:Category:Wei-Cheng Hsu|Wei-Cheng Hsu]][[Category:Wei-Cheng Hsu]] (2 collaborations)
* [[:Category:Hsiao-Hui Tseng|Hsiao-Hui Tseng]][[Category:Hsiao-Hui Tseng]] (2 collaborations)
* [[:Category:Chi-Hsien Chung|Chi-Hsien Chung]][[Category:Chi-Hsien Chung]] (2 collaborations)
* [[:Category:Tzu-Hsuan Hsu|Tzu-Hsuan Hsu]][[Category:Tzu-Hsuan Hsu]] (2 collaborations)
* [[:Category:Sheng-Chau Chen|Sheng-Chau Chen]][[Category:Sheng-Chau Chen]] (2 collaborations)
* [[:Category:Sheng-Chan Li|Sheng-Chan Li]][[Category:Sheng-Chan Li]] (2 collaborations)
* [[:Category:Jhy-Jyi Sze|Jhy-Jyi Sze]][[Category:Jhy-Jyi Sze]] (2 collaborations)
* [[:Category:Ming-Tsong Wang|Ming-Tsong Wang]][[Category:Ming-Tsong Wang]] (2 collaborations)
* [[:Category:Hsing-Chih Lin|Hsing-Chih Lin]][[Category:Hsing-Chih Lin]] (2 collaborations)
* [[:Category:Kuan-Hua Lin|Kuan-Hua Lin]][[Category:Kuan-Hua Lin]] (2 collaborations)
* [[:Category:Wen-I Hsu|Wen-I Hsu]][[Category:Wen-I Hsu]] (2 collaborations)
* [[:Category:Shang-Fu Yeh|Shang-Fu Yeh]][[Category:Shang-Fu Yeh]] (1 collaborations)
* [[:Category:Alexander Kalnitsky of San Francisco CA (US)|Alexander Kalnitsky of San Francisco CA (US)]][[Category:Alexander Kalnitsky of San Francisco CA (US)]] (1 collaborations)
* [[:Category:Sin-Yao Huang|Sin-Yao Huang]][[Category:Sin-Yao Huang]] (1 collaborations)
* [[:Category:Shih Pei Chou|Shih Pei Chou]][[Category:Shih Pei Chou]] (1 collaborations)
* [[:Category:Yu-Chun Chen|Yu-Chun Chen]][[Category:Yu-Chun Chen]] (1 collaborations)
* [[:Category:Fu-Sheng Kuo|Fu-Sheng Kuo]][[Category:Fu-Sheng Kuo]] (1 collaborations)
* [[:Category:Wei Long Chen|Wei Long Chen]][[Category:Wei Long Chen]] (1 collaborations)
* [[:Category:Wei Chuang Wu|Wei Chuang Wu]][[Category:Wei Chuang Wu]] (1 collaborations)
* [[:Category:Keng-Yu Chou|Keng-Yu Chou]][[Category:Keng-Yu Chou]] (1 collaborations)
* [[:Category:Yen-Ting Chiang|Yen-Ting Chiang]][[Category:Yen-Ting Chiang]] (1 collaborations)
* [[:Category:Ming-Hsien Yang|Ming-Hsien Yang]][[Category:Ming-Hsien Yang]] (1 collaborations)
* [[:Category:Chun-Yuan Chen|Chun-Yuan Chen]][[Category:Chun-Yuan Chen]] (1 collaborations)
* [[:Category:Jeng-Shyan Lin|Jeng-Shyan Lin]][[Category:Jeng-Shyan Lin]] (1 collaborations)
* [[:Category:Hsun-Ying Huang|Hsun-Ying Huang]][[Category:Hsun-Ying Huang]] (1 collaborations)
* [[:Category:Wei-Chih Weng|Wei-Chih Weng]][[Category:Wei-Chih Weng]] (1 collaborations)
* [[:Category:Yu-Yang Shen|Yu-Yang Shen]][[Category:Yu-Yang Shen]] (1 collaborations)
* [[:Category:Meng-Hsien Lin|Meng-Hsien Lin]][[Category:Meng-Hsien Lin]] (1 collaborations)
* [[:Category:Ko Chun Liu|Ko Chun Liu]][[Category:Ko Chun Liu]] (1 collaborations)
* [[:Category:Chin-Min Lin|Chin-Min Lin]][[Category:Chin-Min Lin]] (1 collaborations)
* [[:Category:Hung-Jen Hsu|Hung-Jen Hsu]][[Category:Hung-Jen Hsu]] (1 collaborations)
* [[:Category:Hsin-Hung Chen|Hsin-Hung Chen]][[Category:Hsin-Hung Chen]] (1 collaborations)

[[Category:Dun-Nian Yaung]]
[[Category:Inventors]]
[[Category:Inventors filing patents with Taiwan Semiconductor Manufacturing Company, Ltd.]]