View source for Category:Akshay N. Singh of Boise ID US

= Akshay N. Singh =

Akshay N. Singh from Boise ID US has applied for patents in technology areas such as [[:Category:H01L23/00|H01L23/00]], [[:Category:H01L21/304|H01L21/304]], [[:Category:H01L21/683|H01L21/683]] with [[:Category:micron technology, inc.|micron technology, inc.]].

== Patents ==

* [[micron technology, inc. (20250096171). METHODS FOR BONDING WAFERS OF KNOWN GOOD DIES, AND ASSEMBLIES RESULTING FROM SUCH METHODS|METHODS FOR BONDING WAFERS OF KNOWN GOOD DIES, AND ASSEMBLIES RESULTING FROM SUCH METHODS (20250096171)]]

[[Category:Inventors]]
[[Category:micron technology, inc.]]
[[Category:H01L23/00]]
[[Category:H01L21/304]]
[[Category:H01L21/683]]
[[Category:H01L23/48]]
[[Category:H01L23/544]]
[[Category:H01L25/065]]
[[Category:H10B80/00]]