View source for Category:H. Jim FULFORD of Marianna FL (US)

== H. Jim FULFORD of Marianna FL (US) ==

=== Executive Summary ===
H. Jim FULFORD of Marianna FL (US) is an inventor who has filed 4 patents. Their primary areas of innovation include No explanation available (2 patents), No explanation available (2 patents), Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers  (shape of the substrate (1 patents), and they have worked with companies such as Tokyo Electron Limited (4 patents). Their most frequent collaborators include [[Category:Mark I. GARDNER of Cedar Creek TX (US)|Mark I. GARDNER of Cedar Creek TX (US)]] (3 collaborations), [[Category:Arya BHATTACHERJEE of Livermore CA (US)|Arya BHATTACHERJEE of Livermore CA (US)]] (1 collaborations), [[Category:Partha MUKHOPADHDYAY of Jacksonville FL (US)|Partha MUKHOPADHDYAY of Jacksonville FL (US)]] (1 collaborations).

=== Patent Filing Activity ===
[[File:H._Jim_FULFORD_of_Marianna_FL_(US)_Monthly_Patent_Applications.png|border|800px]]

=== Technology Areas ===
[[File:H._Jim_FULFORD_of_Marianna_FL_(US)_Top_Technology_Areas.png|border|800px]]

==== List of Technology Areas ====
* [[:Category:CPC_H10D62/122|H10D62/122]] (No explanation available): 2 patents
* [[:Category:CPC_H10D84/83|H10D84/83]] (No explanation available): 2 patents
* [[:Category:CPC_H01L23/49833|H01L23/49833]] (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers  (shape of the substrate): 1 patents
* [[:Category:CPC_H01L21/4853|H01L21/4853]] (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 1 patents
* [[:Category:CPC_H01L21/486|H01L21/486]] (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 1 patents
* [[:Category:CPC_H01L23/49838|H01L23/49838]] (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers  (shape of the substrate): 1 patents
* [[:Category:CPC_H01L23/147|H01L23/147]] ({Semiconductor insulating substrates  (semiconductor conductive substrates): 1 patents
* [[:Category:CPC_H01L23/49866|H01L23/49866]] ({characterised by the materials  (materials of the substrates): 1 patents
* [[:Category:CPC_H01L21/823885|H01L21/823885]] ({with a particular manufacturing method of vertical transistor structures, i.e. with channel vertical to the substrate surface  (with a current flow parallel to the substrate surface): 1 patents
* [[:Category:CPC_H01L21/8221|H01L21/8221]] ({Three dimensional integrated circuits stacked in different levels}): 1 patents
* [[:Category:CPC_H01L21/823814|H01L21/823814]] (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents
* [[:Category:CPC_H01L21/823871|H01L21/823871]] (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents
* [[:Category:CPC_H01L27/092|H01L27/092]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L29/7827|H01L29/7827]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H10D62/121|H10D62/121]] (No explanation available): 1 patents
* [[:Category:CPC_H10D30/014|H10D30/014]] (No explanation available): 1 patents
* [[:Category:CPC_H10D30/43|H10D30/43]] (No explanation available): 1 patents
* [[:Category:CPC_H10D30/6735|H10D30/6735]] (No explanation available): 1 patents
* [[:Category:CPC_H10D30/6757|H10D30/6757]] (No explanation available): 1 patents
* [[:Category:CPC_H10D62/151|H10D62/151]] (No explanation available): 1 patents
* [[:Category:CPC_H10D64/017|H10D64/017]] (No explanation available): 1 patents
* [[:Category:CPC_H10D84/0167|H10D84/0167]] (No explanation available): 1 patents
* [[:Category:CPC_H10D84/017|H10D84/017]] (No explanation available): 1 patents
* [[:Category:CPC_H10D84/0172|H10D84/0172]] (No explanation available): 1 patents
* [[:Category:CPC_H10D84/038|H10D84/038]] (No explanation available): 1 patents
* [[:Category:CPC_H01L21/308|H01L21/308]] (using masks  (): 1 patents
* [[:Category:CPC_H01L21/31144|H01L21/31144]] ({using masks}): 1 patents
* [[:Category:CPC_H10D30/025|H10D30/025]] (No explanation available): 1 patents
* [[:Category:CPC_H10D30/477|H10D30/477]] (No explanation available): 1 patents
* [[:Category:CPC_H10D62/235|H10D62/235]] (No explanation available): 1 patents

=== Companies ===
[[File:H._Jim_FULFORD_of_Marianna_FL_(US)_Top_Companies.png|border|800px]]

==== List of Companies ====
* Tokyo Electron Limited: 4 patents

=== Collaborators ===
* [[:Category:Mark I. GARDNER of Cedar Creek TX (US)|Mark I. GARDNER of Cedar Creek TX (US)]][[Category:Mark I. GARDNER of Cedar Creek TX (US)]] (3 collaborations)
* [[:Category:Arya BHATTACHERJEE of Livermore CA (US)|Arya BHATTACHERJEE of Livermore CA (US)]][[Category:Arya BHATTACHERJEE of Livermore CA (US)]] (1 collaborations)
* [[:Category:Partha MUKHOPADHDYAY of Jacksonville FL (US)|Partha MUKHOPADHDYAY of Jacksonville FL (US)]][[Category:Partha MUKHOPADHDYAY of Jacksonville FL (US)]] (1 collaborations)

[[Category:H. Jim FULFORD of Marianna FL (US)]]
[[Category:Inventors]]
[[Category:Inventors filing patents with Tokyo Electron Limited]]