View source for Category:Hsiu-Jen Lin

== Hsiu-Jen Lin ==

=== Executive Summary ===
Hsiu-Jen Lin is an inventor who has filed 1 patents. Their primary areas of innovation include {Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group (1 patents), Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups (1 patents), Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups (1 patents), and they have worked with companies such as Taiwan Semiconductor Manufacturning Company, Ltd. (1 patents). Their most frequent collaborators include [[Category:Hao-Jan Pei|Hao-Jan Pei]] (1 collaborations), [[Category:Wei-Yu Chen|Wei-Yu Chen]] (1 collaborations), [[Category:Philip Yu-Shuan Chung|Philip Yu-Shuan Chung]] (1 collaborations).

=== Patent Filing Activity ===
[[File:Hsiu-Jen_Lin_Monthly_Patent_Applications.png|border|800px]]

=== Technology Areas ===
[[File:Hsiu-Jen_Lin_Top_Technology_Areas.png|border|800px]]

==== List of Technology Areas ====
* [[:Category:CPC_H01L25/50|H01L25/50]] ({Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group): 1 patents
* [[:Category:CPC_H01L21/4853|H01L21/4853]] (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 1 patents
* [[:Category:CPC_H01L21/4857|H01L21/4857]] (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 1 patents
* [[:Category:CPC_H01L21/486|H01L21/486]] (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 1 patents
* [[:Category:CPC_H01L21/568|H01L21/568]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L21/6835|H01L21/6835]] ({using temporarily an auxiliary support}): 1 patents
* [[:Category:CPC_H01L23/3128|H01L23/3128]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L23/5384|H01L23/5384]] ({Conductive vias through the substrate with or without pins, e.g. buried coaxial conductors  (): 1 patents
* [[:Category:CPC_H01L23/5389|H01L23/5389]] (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates  ({): 1 patents
* [[:Category:CPC_H01L24/19|H01L24/19]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L24/20|H01L24/20]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L24/96|H01L24/96]] ({the devices being encapsulated in a common layer, e.g. neo-wafer or pseudo-wafer, said common layer being separable into individual assemblies after connecting}): 1 patents
* [[:Category:CPC_H01L25/105|H01L25/105]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2221/68345|H01L2221/68345]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2221/68359|H01L2221/68359]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2221/68381|H01L2221/68381]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2224/0231|H01L2224/0231]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2224/02371|H01L2224/02371]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2224/02379|H01L2224/02379]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2224/211|H01L2224/211]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2225/1035|H01L2225/1035]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2225/1058|H01L2225/1058]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents

=== Companies ===
[[File:Hsiu-Jen_Lin_Top_Companies.png|border|800px]]

==== List of Companies ====
* Taiwan Semiconductor Manufacturning Company, Ltd.: 1 patents

=== Collaborators ===
* [[:Category:Hao-Jan Pei|Hao-Jan Pei]][[Category:Hao-Jan Pei]] (1 collaborations)
* [[:Category:Wei-Yu Chen|Wei-Yu Chen]][[Category:Wei-Yu Chen]] (1 collaborations)
* [[:Category:Philip Yu-Shuan Chung|Philip Yu-Shuan Chung]][[Category:Philip Yu-Shuan Chung]] (1 collaborations)
* [[:Category:Chia-Shen Cheng|Chia-Shen Cheng]][[Category:Chia-Shen Cheng]] (1 collaborations)
* [[:Category:Kuei-Wei Huang|Kuei-Wei Huang]][[Category:Kuei-Wei Huang]] (1 collaborations)
* [[:Category:Ching-Hua Hsieh|Ching-Hua Hsieh]][[Category:Ching-Hua Hsieh]] (1 collaborations)
* [[:Category:Chung-Shi Liu|Chung-Shi Liu]][[Category:Chung-Shi Liu]] (1 collaborations)
* [[:Category:Chen-Hua Yu|Chen-Hua Yu]][[Category:Chen-Hua Yu]] (1 collaborations)

[[Category:Hsiu-Jen Lin]]
[[Category:Inventors]]
[[Category:Inventors filing patents with Taiwan Semiconductor Manufacturning Company, Ltd.]]