View source for Category:Kohei TANIKAWA

== Kohei TANIKAWA ==

=== Executive Summary ===
Kohei TANIKAWA is an inventor who has filed 11 patents. Their primary areas of innovation include SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (7 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (7 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (6 patents), and they have worked with companies such as ROHM CO., LTD. (10 patents), Rohm Co., Ltd. (1 patents). Their most frequent collaborators include [[Category:Ryosuke FUKUDA|Ryosuke FUKUDA]] (5 collaborations), [[Category:Kenji HAYASHI|Kenji HAYASHI]] (3 collaborations), [[Category:Xiaopeng WU|Xiaopeng WU]] (3 collaborations).

=== Patent Filing Activity ===
[[File:Kohei_TANIKAWA_Monthly_Patent_Applications.png|border|800px]]

=== Technology Areas ===
[[File:Kohei_TANIKAWA_Top_Technology_Areas.png|border|800px]]

==== List of Technology Areas ====
* [[:Category:CPC_H01L24/40|H01L24/40]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 7 patents
* [[:Category:CPC_H01L24/32|H01L24/32]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 7 patents
* [[:Category:CPC_H01L24/48|H01L24/48]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 6 patents
* [[:Category:CPC_H01L2224/32245|H01L2224/32245]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 6 patents
* [[:Category:CPC_H01L23/3121|H01L23/3121]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 5 patents
* [[:Category:CPC_H01L25/072|H01L25/072]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 5 patents
* [[:Category:CPC_H01L24/73|H01L24/73]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 5 patents
* [[:Category:CPC_H01L23/49575|H01L23/49575]] (Lead-frames {or other flat leads  (): 4 patents
* [[:Category:CPC_H01L2224/40137|H01L2224/40137]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents
* [[:Category:CPC_H01L2224/40175|H01L2224/40175]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents
* [[:Category:CPC_H01L2224/73221|H01L2224/73221]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents
* [[:Category:CPC_H01L2224/73263|H01L2224/73263]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents
* [[:Category:CPC_H01L23/49844|H01L23/49844]] (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers  (shape of the substrate): 4 patents
* [[:Category:CPC_H01L2224/73265|H01L2224/73265]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
* [[:Category:CPC_H01L23/49811|H01L23/49811]] ({Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads  (): 3 patents
* [[:Category:CPC_H01L2924/13091|H01L2924/13091]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
* [[:Category:CPC_H01L2924/182|H01L2924/182]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
* [[:Category:CPC_H01L24/37|H01L24/37]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
* [[:Category:CPC_H01L23/49527|H01L23/49527]] (Lead-frames {or other flat leads  (): 2 patents
* [[:Category:CPC_H01L24/05|H01L24/05]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
* [[:Category:CPC_H01L24/06|H01L24/06]] ({of a plurality of bonding areas}): 2 patents
* [[:Category:CPC_H01L24/45|H01L24/45]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
* [[:Category:CPC_H01L2224/05553|H01L2224/05553]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
* [[:Category:CPC_H01L2224/05554|H01L2224/05554]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
* [[:Category:CPC_H01L2224/05639|H01L2224/05639]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
* [[:Category:CPC_H01L2224/0603|H01L2224/0603]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
* [[:Category:CPC_H01L2224/06051|H01L2224/06051]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
* [[:Category:CPC_H01L2224/06181|H01L2224/06181]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
* [[:Category:CPC_H01L2224/37011|H01L2224/37011]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
* [[:Category:CPC_H01L2224/37147|H01L2224/37147]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
* [[:Category:CPC_H01L2224/45124|H01L2224/45124]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
* [[:Category:CPC_H01L2224/45144|H01L2224/45144]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
* [[:Category:CPC_H01L2224/45147|H01L2224/45147]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
* [[:Category:CPC_H01L2224/48227|H01L2224/48227]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
* [[:Category:CPC_H01L23/49517|H01L23/49517]] (Lead-frames {or other flat leads  (): 2 patents
* [[:Category:CPC_H01L23/49562|H01L23/49562]] (Lead-frames {or other flat leads  (): 2 patents
* [[:Category:CPC_H01L2224/48175|H01L2224/48175]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
* [[:Category:CPC_H01L23/3107|H01L23/3107]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
* [[:Category:CPC_H01L24/18|H01L24/18]] ({High density interconnect [HDI] connectors; Manufacturing methods related thereto  (interconnection structure between a plurality of semiconductor chips): 1 patents
* [[:Category:CPC_H01L2224/48247|H01L2224/48247]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L23/49822|H01L23/49822]] ({Multilayer substrates  (multilayer metallisation on monolayer substrate): 1 patents
* [[:Category:CPC_H01L24/08|H01L24/08]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L25/0652|H01L25/0652]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2224/08145|H01L2224/08145]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2224/08155|H01L2224/08155]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2224/48147|H01L2224/48147]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2224/48159|H01L2224/48159]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2924/01029|H01L2924/01029]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L23/31|H01L23/31]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L23/367|H01L23/367]] (Cooling facilitated by shape of device {(): 1 patents
* [[:Category:CPC_H01L23/49838|H01L23/49838]] (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers  (shape of the substrate): 1 patents
* [[:Category:CPC_H01L2924/1207|H01L2924/1207]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L21/565|H01L21/565]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L23/49861|H01L23/49861]] ({Lead-frames fixed on or encapsulated in insulating substrates  (): 1 patents
* [[:Category:CPC_H01L24/29|H01L24/29]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L24/83|H01L24/83]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2224/29575|H01L2224/29575]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2224/40095|H01L2224/40095]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2224/40101|H01L2224/40101]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2224/40139|H01L2224/40139]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2224/40245|H01L2224/40245]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2224/8383|H01L2224/8383]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2924/30107|H01L2924/30107]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2924/35121|H01L2924/35121]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents

=== Companies ===
[[File:Kohei_TANIKAWA_Top_Companies.png|border|800px]]

==== List of Companies ====
* ROHM CO., LTD.: 10 patents
* Rohm Co., Ltd.: 1 patents

=== Collaborators ===
* [[:Category:Ryosuke FUKUDA|Ryosuke FUKUDA]][[Category:Ryosuke FUKUDA]] (5 collaborations)
* [[:Category:Kenji HAYASHI|Kenji HAYASHI]][[Category:Kenji HAYASHI]] (3 collaborations)
* [[:Category:Xiaopeng WU|Xiaopeng WU]][[Category:Xiaopeng WU]] (3 collaborations)
* [[:Category:Hiroto SAKAI|Hiroto SAKAI]][[Category:Hiroto SAKAI]] (1 collaborations)
* [[:Category:Yuta OKAWAUCHI|Yuta OKAWAUCHI]][[Category:Yuta OKAWAUCHI]] (1 collaborations)
* [[:Category:Oji SATO|Oji SATO]][[Category:Oji SATO]] (1 collaborations)

[[Category:Kohei TANIKAWA]]
[[Category:Inventors]]
[[Category:Inventors filing patents with ROHM CO., LTD.]]
[[Category:Inventors filing patents with Rohm Co., Ltd.]]