View source for Category:Lasse Petteri PALM

== Lasse Petteri PALM ==

=== Executive Summary ===
Lasse Petteri PALM is an inventor who has filed 2 patents. Their primary areas of innovation include {of a plurality of bump connectors} (1 patents), Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups (1 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (1 patents), and they have worked with companies such as Huawei Digital Power Technologies Co., Ltd. (2 patents). Their most frequent collaborators include [[Category:Mirko BERNARDONI|Mirko BERNARDONI]] (1 collaborations), [[Category:Gilberto CURATOLA|Gilberto CURATOLA]] (1 collaborations), [[Category:Andreas Munding|Andreas Munding]] (1 collaborations).

=== Patent Filing Activity ===
[[File:Lasse_Petteri_PALM_Monthly_Patent_Applications.png|border|800px]]

=== Technology Areas ===
[[File:Lasse_Petteri_PALM_Top_Technology_Areas.png|border|800px]]

==== List of Technology Areas ====
* [[:Category:CPC_H01L24/14|H01L24/14]] ({of a plurality of bump connectors}): 1 patents
* [[:Category:CPC_H01L21/486|H01L21/486]] (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 1 patents
* [[:Category:CPC_H01L23/3121|H01L23/3121]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L23/3677|H01L23/3677]] (Cooling facilitated by shape of device {(): 1 patents
* [[:Category:CPC_H01L23/49568|H01L23/49568]] (Lead-frames {or other flat leads  (): 1 patents
* [[:Category:CPC_H01L23/49575|H01L23/49575]] (Lead-frames {or other flat leads  (): 1 patents
* [[:Category:CPC_H01L24/16|H01L24/16]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L25/18|H01L25/18]] (the devices being of types provided for in two or more different subgroups of the same main group of groups): 1 patents
* [[:Category:CPC_H01L2224/1403|H01L2224/1403]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2224/14051|H01L2224/14051]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2224/14132|H01L2224/14132]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2224/14133|H01L2224/14133]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2224/14179|H01L2224/14179]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2224/16145|H01L2224/16145]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2225/06513|H01L2225/06513]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2225/06589|H01L2225/06589]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2924/1815|H01L2924/1815]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L24/80|H01L24/80]] ({Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected}): 1 patents
* [[:Category:CPC_H05K1/185|H05K1/185]] (Printed circuits structurally associated with non-printed electric components  ({): 1 patents
* [[:Category:CPC_H05K3/462|H05K3/462]] (Manufacturing multilayer circuits): 1 patents
* [[:Category:CPC_H01L24/08|H01L24/08]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L25/073|H01L25/073]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2224/08145|H01L2224/08145]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2224/8084|H01L2224/8084]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2224/80895|H01L2224/80895]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2224/80896|H01L2224/80896]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2224/80986|H01L2224/80986]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2924/13091|H01L2924/13091]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H05K2201/10166|H05K2201/10166]] (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
* [[:Category:CPC_H05K2203/1131|H05K2203/1131]] (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents

=== Companies ===
[[File:Lasse_Petteri_PALM_Top_Companies.png|border|800px]]

==== List of Companies ====
* Huawei Digital Power Technologies Co., Ltd.: 2 patents

=== Collaborators ===
* [[:Category:Mirko BERNARDONI|Mirko BERNARDONI]][[Category:Mirko BERNARDONI]] (1 collaborations)
* [[:Category:Gilberto CURATOLA|Gilberto CURATOLA]][[Category:Gilberto CURATOLA]] (1 collaborations)
* [[:Category:Andreas Munding|Andreas Munding]][[Category:Andreas Munding]] (1 collaborations)

[[Category:Lasse Petteri PALM]]
[[Category:Inventors]]
[[Category:Inventors filing patents with Huawei Digital Power Technologies Co., Ltd.]]