View source for Category:Saeko OGAWA

== Saeko OGAWA ==

=== Executive Summary ===
Saeko OGAWA is an inventor who has filed 5 patents. Their primary areas of innovation include SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (5 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (4 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (2 patents), and they have worked with companies such as Resonac Corporation (5 patents). Their most frequent collaborators include [[Category:Shogo SOBUE|Shogo SOBUE]] (5 collaborations), [[Category:Daisuke IKEDA|Daisuke IKEDA]] (5 collaborations), [[Category:Keisuke OKAWARA|Keisuke OKAWARA]] (4 collaborations).

=== Patent Filing Activity ===
[[File:Saeko_OGAWA_Monthly_Patent_Applications.png|border|800px]]

=== Technology Areas ===
[[File:Saeko_OGAWA_Top_Technology_Areas.png|border|800px]]

==== List of Technology Areas ====
* [[:Category:CPC_H01L21/561|H01L21/561]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 5 patents
* [[:Category:CPC_H01L21/568|H01L21/568]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents
* [[:Category:CPC_H01L2224/97|H01L2224/97]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
* [[:Category:CPC_H01L24/97|H01L24/97]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
* [[:Category:CPC_H01L24/19|H01L24/19]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
* [[:Category:CPC_H01L24/96|H01L24/96]] ({the devices being encapsulated in a common layer, e.g. neo-wafer or pseudo-wafer, said common layer being separable into individual assemblies after connecting}): 2 patents
* [[:Category:CPC_H01L2224/19|H01L2224/19]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
* [[:Category:CPC_H01L2224/96|H01L2224/96]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
* [[:Category:CPC_H01L23/3135|H01L23/3135]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
* [[:Category:CPC_H01L23/3128|H01L23/3128]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
* [[:Category:CPC_H01L2224/95001|H01L2224/95001]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
* [[:Category:CPC_H01L21/6836|H01L21/6836]] ({Wafer tapes, e.g. grinding or dicing support tapes  (adhesive tapes in general): 1 patents
* [[:Category:CPC_H01L21/60|H01L21/60]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2221/68363|H01L2221/68363]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2221/68327|H01L2221/68327]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2021/6006|H01L2021/6006]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L21/78|H01L21/78]] (with subsequent division of the substrate into plural individual devices  (cutting to change the surface-physical characteristics or shape of semiconductor bodies): 1 patents
* [[:Category:CPC_H01L24/20|H01L24/20]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L24/95|H01L24/95]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L23/295|H01L23/295]] ({containing a filler  (): 1 patents
* [[:Category:CPC_H01L21/6835|H01L21/6835]] ({using temporarily an auxiliary support}): 1 patents
* [[:Category:CPC_H01L2224/214|H01L2224/214]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2221/68359|H01L2221/68359]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2221/68377|H01L2221/68377]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L24/16|H01L24/16]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2224/16225|H01L2224/16225]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2924/15165|H01L2924/15165]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2924/15311|H01L2924/15311]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents

=== Companies ===
[[File:Saeko_OGAWA_Top_Companies.png|border|800px]]

==== List of Companies ====
* Resonac Corporation: 5 patents

=== Collaborators ===
* [[:Category:Shogo SOBUE|Shogo SOBUE]][[Category:Shogo SOBUE]] (5 collaborations)
* [[:Category:Daisuke IKEDA|Daisuke IKEDA]][[Category:Daisuke IKEDA]] (5 collaborations)
* [[:Category:Keisuke OKAWARA|Keisuke OKAWARA]][[Category:Keisuke OKAWARA]] (4 collaborations)
* [[:Category:Hiroaki MATSUBARA|Hiroaki MATSUBARA]][[Category:Hiroaki MATSUBARA]] (3 collaborations)
* [[:Category:Yuki NAKAMURA|Yuki NAKAMURA]][[Category:Yuki NAKAMURA]] (1 collaborations)

[[Category:Saeko OGAWA]]
[[Category:Inventors]]
[[Category:Inventors filing patents with Resonac Corporation]]