View source for Category:Seungwon IM

== Seungwon IM ==

=== Executive Summary ===
Seungwon IM is an inventor who has filed 15 patents. Their primary areas of innovation include SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (5 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (4 patents), by flowing liquids {( (3 patents), and they have worked with companies such as SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC (15 patents). Their most frequent collaborators include [[Category:Oseob JEON|Oseob JEON]] (12 collaborations), [[Category:Dongwook KANG|Dongwook KANG]] (4 collaborations), [[Category:Jihwan KIM|Jihwan KIM]] (4 collaborations).

=== Patent Filing Activity ===
[[File:Seungwon_IM_Monthly_Patent_Applications.png|border|800px]]

=== Technology Areas ===
[[File:Seungwon_IM_Top_Technology_Areas.png|border|800px]]

==== List of Technology Areas ====
* [[:Category:CPC_H01L21/56|H01L21/56]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 5 patents
* [[:Category:CPC_H01L24/32|H01L24/32]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents
* [[:Category:CPC_H01L23/473|H01L23/473]] (by flowing liquids {(): 3 patents
* [[:Category:CPC_H01L23/49861|H01L23/49861]] ({Lead-frames fixed on or encapsulated in insulating substrates  (): 3 patents
* [[:Category:CPC_H01L23/3121|H01L23/3121]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
* [[:Category:CPC_H01L23/3107|H01L23/3107]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
* [[:Category:CPC_H01L23/3672|H01L23/3672]] ({Foil-like cooling fins or heat sinks  (being part of lead-frames): 3 patents
* [[:Category:CPC_H01L23/49822|H01L23/49822]] ({Multilayer substrates  (multilayer metallisation on monolayer substrate): 3 patents
* [[:Category:CPC_H01L24/48|H01L24/48]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
* [[:Category:CPC_H01L24/73|H01L24/73]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
* [[:Category:CPC_H01L2224/48225|H01L2224/48225]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
* [[:Category:CPC_H01L23/49811|H01L23/49811]] ({Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads  (): 3 patents
* [[:Category:CPC_H01L23/433|H01L23/433]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
* [[:Category:CPC_H01L23/49568|H01L23/49568]] (Lead-frames {or other flat leads  (): 2 patents
* [[:Category:CPC_H05K1/18|H05K1/18]] (Printed circuits structurally associated with non-printed electric components  ({): 2 patents
* [[:Category:CPC_H05K1/11|H05K1/11]] (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 2 patents
* [[:Category:CPC_H05K2201/10166|H05K2201/10166]] (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 2 patents
* [[:Category:CPC_H01L23/49555|H01L23/49555]] (Lead-frames {or other flat leads  (): 2 patents
* [[:Category:CPC_H01L2224/32245|H01L2224/32245]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
* [[:Category:CPC_H01L25/0652|H01L25/0652]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
* [[:Category:CPC_H01L25/50|H01L25/50]] ({Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group): 2 patents
* [[:Category:CPC_H01L21/4853|H01L21/4853]] (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 2 patents
* [[:Category:CPC_H01L23/49833|H01L23/49833]] (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers  (shape of the substrate): 2 patents
* [[:Category:CPC_H01L2224/32225|H01L2224/32225]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
* [[:Category:CPC_H01L2224/48175|H01L2224/48175]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
* [[:Category:CPC_H01L2924/13055|H01L2924/13055]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
* [[:Category:CPC_H01L23/13|H01L23/13]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L23/4334|H01L23/4334]] ({Auxiliary members in encapsulations  (): 1 patents
* [[:Category:CPC_H01L25/0657|H01L25/0657]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L23/24|H01L23/24]] (solid or gel at the normal operating temperature of the device {(): 1 patents
* [[:Category:CPC_H01L2224/33|H01L2224/33]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L23/367|H01L23/367]] (Cooling facilitated by shape of device {(): 1 patents
* [[:Category:CPC_H01L23/373|H01L23/373]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L21/4846|H01L21/4846]] (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 1 patents
* [[:Category:CPC_H01L21/4882|H01L21/4882]] (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 1 patents
* [[:Category:CPC_H01L23/3735|H01L23/3735]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L23/42|H01L23/42]] (Fillings or auxiliary members in containers {or encapsulations} selected or arranged to facilitate heating or cooling): 1 patents
* [[:Category:CPC_H01L23/49503|H01L23/49503]] (Lead-frames {or other flat leads  (): 1 patents
* [[:Category:CPC_H01L25/071|H01L25/071]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L25/18|H01L25/18]] (the devices being of types provided for in two or more different subgroups of the same main group of groups): 1 patents
* [[:Category:CPC_H01L23/49562|H01L23/49562]] (Lead-frames {or other flat leads  (): 1 patents
* [[:Category:CPC_H01L23/5386|H01L23/5386]] (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates  ({): 1 patents
* [[:Category:CPC_H01L24/40|H01L24/40]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2224/40225|H01L2224/40225]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2224/73221|H01L2224/73221]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L21/486|H01L21/486]] (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 1 patents
* [[:Category:CPC_H01L21/565|H01L21/565]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2224/48011|H01L2224/48011]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2224/48091|H01L2224/48091]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2224/48095|H01L2224/48095]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2924/13091|H01L2924/13091]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2924/1815|H01L2924/1815]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2924/182|H01L2924/182]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2924/183|H01L2924/183]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2924/186|H01L2924/186]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L23/15|H01L23/15]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L21/4825|H01L21/4825]] (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 1 patents
* [[:Category:CPC_H01L21/4839|H01L21/4839]] (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 1 patents
* [[:Category:CPC_H01L23/49844|H01L23/49844]] (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers  (shape of the substrate): 1 patents
* [[:Category:CPC_H01L25/162|H01L25/162]] (the devices being of types provided for in two or more different main groups of groups): 1 patents
* [[:Category:CPC_H01L2224/48139|H01L2224/48139]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2224/48145|H01L2224/48145]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2224/73265|H01L2224/73265]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2924/12036|H01L2924/12036]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L25/0655|H01L25/0655]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01R12/585|H01R12/585]] (terminals for insertion into holes): 1 patents

=== Companies ===
[[File:Seungwon_IM_Top_Companies.png|border|800px]]

==== List of Companies ====
* SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC: 15 patents

=== Collaborators ===
* [[:Category:Oseob JEON|Oseob JEON]][[Category:Oseob JEON]] (12 collaborations)
* [[:Category:Dongwook KANG|Dongwook KANG]][[Category:Dongwook KANG]] (4 collaborations)
* [[:Category:Jihwan KIM|Jihwan KIM]][[Category:Jihwan KIM]] (4 collaborations)
* [[:Category:Byoungok LEE|Byoungok LEE]][[Category:Byoungok LEE]] (3 collaborations)
* [[:Category:Rajani Kumar THIRUKOLURI|Rajani Kumar THIRUKOLURI]][[Category:Rajani Kumar THIRUKOLURI]] (3 collaborations)
* [[:Category:Roveendra PAUL of Dublin CA (US)|Roveendra PAUL of Dublin CA (US)]][[Category:Roveendra PAUL of Dublin CA (US)]] (3 collaborations)
* [[:Category:Yoonsoo LEE|Yoonsoo LEE]][[Category:Yoonsoo LEE]] (2 collaborations)
* [[:Category:Dukyong LEE|Dukyong LEE]][[Category:Dukyong LEE]] (2 collaborations)
* [[:Category:Jeonghyuk PARK|Jeonghyuk PARK]][[Category:Jeonghyuk PARK]] (2 collaborations)
* [[:Category:Keunhyuk LEE|Keunhyuk LEE]][[Category:Keunhyuk LEE]] (2 collaborations)
* [[:Category:Jerome TEYSSEYRE|Jerome TEYSSEYRE]][[Category:Jerome TEYSSEYRE]] (2 collaborations)
* [[:Category:Joonseo SON|Joonseo SON]][[Category:Joonseo SON]] (1 collaborations)
* [[:Category:Changyoung PARK|Changyoung PARK]][[Category:Changyoung PARK]] (1 collaborations)
* [[:Category:Paolo BILARDO|Paolo BILARDO]][[Category:Paolo BILARDO]] (1 collaborations)
* [[:Category:Jooyang EOM|Jooyang EOM]][[Category:Jooyang EOM]] (1 collaborations)
* [[:Category:Inpil YOO|Inpil YOO]][[Category:Inpil YOO]] (1 collaborations)
* [[:Category:Jeungdae KIM|Jeungdae KIM]][[Category:Jeungdae KIM]] (1 collaborations)
* [[:Category:Heejo CHI|Heejo CHI]][[Category:Heejo CHI]] (1 collaborations)
* [[:Category:Jonghwan BAEK|Jonghwan BAEK]][[Category:Jonghwan BAEK]] (1 collaborations)
* [[:Category:Chee Hiong CHEW|Chee Hiong CHEW]][[Category:Chee Hiong CHEW]] (1 collaborations)

[[Category:Seungwon IM]]
[[Category:Inventors]]
[[Category:Inventors filing patents with SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC]]