View source for Category:Shunsuke TERANISHI

== Shunsuke TERANISHI ==

=== Executive Summary ===
Shunsuke TERANISHI is an inventor who has filed 4 patents. Their primary areas of innovation include Mechanical treatment, e.g. grinding, polishing, cutting {( (2 patents), {Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected} (2 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (2 patents), and they have worked with companies such as DISCO CORPORATION (4 patents). Their most frequent collaborators include [[Category:Kai MINAMIZAKI|Kai MINAMIZAKI]] (2 collaborations), [[Category:Akira MIZUTANI|Akira MIZUTANI]] (2 collaborations), [[Category:Naoko YAMAMOTO|Naoko YAMAMOTO]] (1 collaborations).

=== Patent Filing Activity ===
[[File:Shunsuke_TERANISHI_Monthly_Patent_Applications.png|border|800px]]

=== Technology Areas ===
[[File:Shunsuke_TERANISHI_Top_Technology_Areas.png|border|800px]]

==== List of Technology Areas ====
* [[:Category:CPC_H01L21/304|H01L21/304]] (Mechanical treatment, e.g. grinding, polishing, cutting {(): 2 patents
* [[:Category:CPC_H01L24/80|H01L24/80]] ({Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected}): 2 patents
* [[:Category:CPC_H01L24/94|H01L24/94]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
* [[:Category:CPC_H10B80/00|H10B80/00]] (Assemblies of multiple devices comprising at least one memory device covered by this subclass): 2 patents
* [[:Category:CPC_H01L2224/80013|H01L2224/80013]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
* [[:Category:CPC_H01L2224/8023|H01L2224/8023]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
* [[:Category:CPC_H01L2224/80894|H01L2224/80894]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
* [[:Category:CPC_H01L2224/80948|H01L2224/80948]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
* [[:Category:CPC_H01L2224/94|H01L2224/94]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
* [[:Category:CPC_H01L21/6836|H01L21/6836]] ({Wafer tapes, e.g. grinding or dicing support tapes  (adhesive tapes in general): 2 patents
* [[:Category:CPC_H01L21/78|H01L21/78]] (with subsequent division of the substrate into plural individual devices  (cutting to change the surface-physical characteristics or shape of semiconductor bodies): 1 patents
* [[:Category:CPC_H01L23/544|H01L23/544]] (Marks applied to semiconductor devices {or parts}, e.g. registration marks, {alignment structures, wafer maps  (test patterns for characterising or monitoring manufacturing processes): 1 patents
* [[:Category:CPC_H01L21/02076|H01L21/02076]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L21/268|H01L21/268]] (Bombardment with radiation {(): 1 patents
* [[:Category:CPC_H01L2223/5446|H01L2223/5446]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2221/68327|H01L2221/68327]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2221/68386|H01L2221/68386]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L21/02315|H01L21/02315]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2221/68381|H01L2221/68381]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents

=== Companies ===
[[File:Shunsuke_TERANISHI_Top_Companies.png|border|800px]]

==== List of Companies ====
* DISCO CORPORATION: 4 patents

=== Collaborators ===
* [[:Category:Kai MINAMIZAKI|Kai MINAMIZAKI]][[Category:Kai MINAMIZAKI]] (2 collaborations)
* [[:Category:Akira MIZUTANI|Akira MIZUTANI]][[Category:Akira MIZUTANI]] (2 collaborations)
* [[:Category:Naoko YAMAMOTO|Naoko YAMAMOTO]][[Category:Naoko YAMAMOTO]] (1 collaborations)

[[Category:Shunsuke TERANISHI]]
[[Category:Inventors]]
[[Category:Inventors filing patents with DISCO CORPORATION]]