View source for Category:Takehisa TAKADA

== Takehisa TAKADA ==

=== Executive Summary ===
Takehisa TAKADA is an inventor who has filed 2 patents. Their primary areas of innovation include Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups (2 patents), {Via connections through the substrates, e.g. pins going through the substrate, coaxial cables  ( (2 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (1 patents), and they have worked with companies such as TOPPAN INC. (2 patents). Their most frequent collaborators include [[Category:Yuki UMEMURA|Yuki UMEMURA]] (2 collaborations), [[Category:Tomoyuki ISHII|Tomoyuki ISHII]] (2 collaborations).

=== Patent Filing Activity ===
[[File:Takehisa_TAKADA_Monthly_Patent_Applications.png|border|800px]]

=== Technology Areas ===
[[File:Takehisa_TAKADA_Top_Technology_Areas.png|border|800px]]

==== List of Technology Areas ====
* [[:Category:CPC_H01L21/486|H01L21/486]] (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 2 patents
* [[:Category:CPC_H01L23/49827|H01L23/49827]] ({Via connections through the substrates, e.g. pins going through the substrate, coaxial cables  (): 2 patents
* [[:Category:CPC_H01L28/40|H01L28/40]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L23/49822|H01L23/49822]] ({Multilayer substrates  (multilayer metallisation on monolayer substrate): 1 patents
* [[:Category:CPC_H01L23/544|H01L23/544]] (Marks applied to semiconductor devices {or parts}, e.g. registration marks, {alignment structures, wafer maps  (test patterns for characterising or monitoring manufacturing processes): 1 patents
* [[:Category:CPC_H05K1/181|H05K1/181]] (Printed circuits structurally associated with non-printed electric components  ({): 1 patents
* [[:Category:CPC_H05K1/115|H05K1/115]] (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
* [[:Category:CPC_H05K1/0266|H05K1/0266]] ({Spark gaps}): 1 patents
* [[:Category:CPC_H05K1/0306|H05K1/0306]] (Use of materials for the substrate): 1 patents
* [[:Category:CPC_H05K3/4038|H05K3/4038]] (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
* [[:Category:CPC_H05K3/0026|H05K3/0026]] (Apparatus or processes for manufacturing printed circuits): 1 patents
* [[:Category:CPC_H01L2223/54426|H01L2223/54426]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H05K2203/107|H05K2203/107]] (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
* [[:Category:CPC_H01L25/16|H01L25/16]] (the devices being of types provided for in two or more different main groups of groups): 1 patents
* [[:Category:CPC_H01L27/01|H01L27/01]] (comprising only passive thin-film or thick-film elements formed on a common insulating substrate {(passive two-terminal components without a potential-jump or surface barrier for integrated circuits, details thereof and multistep manufacturing processes therefor): 1 patents
* [[:Category:CPC_H01L24/16|H01L24/16]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents

=== Companies ===
[[File:Takehisa_TAKADA_Top_Companies.png|border|800px]]

==== List of Companies ====
* TOPPAN INC.: 2 patents

=== Collaborators ===
* [[:Category:Yuki UMEMURA|Yuki UMEMURA]][[Category:Yuki UMEMURA]] (2 collaborations)
* [[:Category:Tomoyuki ISHII|Tomoyuki ISHII]][[Category:Tomoyuki ISHII]] (2 collaborations)

[[Category:Takehisa TAKADA]]
[[Category:Inventors]]
[[Category:Inventors filing patents with TOPPAN INC.]]