View source for Category:YAN-HONG LIU

== YAN-HONG LIU ==

=== Executive Summary ===
YAN-HONG LIU is an inventor who has filed 2 patents. Their primary areas of innovation include Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components {; Apparatus not specifically provided for elsewhere  (processes per se (1 patents), Gas-filled discharge tubes  (heating by discharge (1 patents), {the layer being a laminate, i.e. composed of sublayers, e.g. stacks of alternating high-k metal oxides  (adhesion layers or buffer layers (1 patents), and they have worked with companies such as TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (2 patents). Their most frequent collaborators include [[Category:MING-YING PEI|MING-YING PEI]] (2 collaborations).

=== Patent Filing Activity ===
[[File:YAN-HONG_LIU_Monthly_Patent_Applications.png|border|800px]]

=== Technology Areas ===
[[File:YAN-HONG_LIU_Top_Technology_Areas.png|border|800px]]

==== List of Technology Areas ====
* [[:Category:CPC_H01L21/67069|H01L21/67069]] (Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components {; Apparatus not specifically provided for elsewhere  (processes per se): 1 patents
* [[:Category:CPC_H01J37/32449|H01J37/32449]] (Gas-filled discharge tubes  (heating by discharge): 1 patents
* [[:Category:CPC_H01L21/02274|H01L21/02274]] ({the layer being a laminate, i.e. composed of sublayers, e.g. stacks of alternating high-k metal oxides  (adhesion layers or buffer layers): 1 patents
* [[:Category:CPC_H01L21/0234|H01L21/0234]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L21/67253|H01L21/67253]] (Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components {; Apparatus not specifically provided for elsewhere  (processes per se): 1 patents
* [[:Category:CPC_H01J37/32844|H01J37/32844]] (Gas-filled discharge tubes  (heating by discharge): 1 patents
* [[:Category:CPC_B01D53/0438|B01D53/0438]] ({Cooling or heating systems}): 1 patents
* [[:Category:CPC_B03C3/08|B03C3/08]] (MAGNETIC OR ELECTROSTATIC SEPARATION OF SOLID MATERIALS FROM SOLID MATERIALS OR FLUIDS; SEPARATION BY HIGH-VOLTAGE ELECTRIC FIELDS  (separating isotopes): 1 patents
* [[:Category:CPC_B03C3/12|B03C3/12]] (MAGNETIC OR ELECTROSTATIC SEPARATION OF SOLID MATERIALS FROM SOLID MATERIALS OR FLUIDS; SEPARATION BY HIGH-VOLTAGE ELECTRIC FIELDS  (separating isotopes): 1 patents
* [[:Category:CPC_B03C3/47|B03C3/47]] (flat, e.g. plates, discs, gratings): 1 patents
* [[:Category:CPC_B01D2253/102|B01D2253/102]] (SEPARATION  (separating solids from solids by wet methods): 1 patents
* [[:Category:CPC_B01D2253/1124|B01D2253/1124]] (SEPARATION  (separating solids from solids by wet methods): 1 patents
* [[:Category:CPC_B01D2253/202|B01D2253/202]] (SEPARATION  (separating solids from solids by wet methods): 1 patents
* [[:Category:CPC_B01D2258/0216|B01D2258/0216]] (SEPARATION  (separating solids from solids by wet methods): 1 patents
* [[:Category:CPC_B03C2201/32|B03C2201/32]] (MAGNETIC OR ELECTROSTATIC SEPARATION OF SOLID MATERIALS FROM SOLID MATERIALS OR FLUIDS; SEPARATION BY HIGH-VOLTAGE ELECTRIC FIELDS  (separating isotopes): 1 patents
* [[:Category:CPC_H01J2237/3341|H01J2237/3341]] (ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS  (spark-gaps): 1 patents
* [[:Category:CPC_H01L21/3065|H01L21/3065]] (Plasma etching; Reactive-ion etching): 1 patents
* [[:Category:CPC_H01L21/311|H01L21/311]] (to form insulating layers thereon, e.g. for masking or by using photolithographic techniques  (encapsulating layers): 1 patents
* [[:Category:CPC_H01L21/32135|H01L21/32135]] (Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer): 1 patents

=== Companies ===
[[File:YAN-HONG_LIU_Top_Companies.png|border|800px]]

==== List of Companies ====
* TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.: 2 patents

=== Collaborators ===
* [[:Category:MING-YING PEI|MING-YING PEI]][[Category:MING-YING PEI]] (2 collaborations)

[[Category:YAN-HONG LIU]]
[[Category:Inventors]]
[[Category:Inventors filing patents with TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.]]