View source for Category:Yulin FENG

== Yulin FENG ==

=== Executive Summary ===
Yulin FENG is an inventor who has filed 5 patents. Their primary areas of innovation include Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers  (shape of the substrate (3 patents), Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups (2 patents), {Via connections through the substrates, e.g. pins going through the substrate, coaxial cables  ( (2 patents), and they have worked with companies such as Beijing BOE Optoelectronics Technology Co., Ltd. (5 patents). Their most frequent collaborators include [[Category:Yifan WU|Yifan WU]] (5 collaborations), [[Category:Yue LI|Yue LI]] (5 collaborations), [[Category:Yuelei XIAO|Yuelei XIAO]] (5 collaborations).

=== Patent Filing Activity ===
[[File:Yulin_FENG_Monthly_Patent_Applications.png|border|800px]]

=== Technology Areas ===
[[File:Yulin_FENG_Top_Technology_Areas.png|border|800px]]

==== List of Technology Areas ====
* [[:Category:CPC_H01L23/49838|H01L23/49838]] (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers  (shape of the substrate): 3 patents
* [[:Category:CPC_H01L21/486|H01L21/486]] (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 2 patents
* [[:Category:CPC_H01L23/49827|H01L23/49827]] ({Via connections through the substrates, e.g. pins going through the substrate, coaxial cables  (): 2 patents
* [[:Category:CPC_H01L24/16|H01L24/16]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
* [[:Category:CPC_H01L2224/16227|H01L2224/16227]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
* [[:Category:CPC_H01L23/15|H01L23/15]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
* [[:Category:CPC_H05K2201/10015|H05K2201/10015]] (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 2 patents
* [[:Category:CPC_H05K2201/1003|H05K2201/1003]] (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 2 patents
* [[:Category:CPC_H01L21/568|H01L21/568]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L23/3121|H01L23/3121]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L23/49833|H01L23/49833]] (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers  (shape of the substrate): 1 patents
* [[:Category:CPC_H01L21/4857|H01L21/4857]] (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 1 patents
* [[:Category:CPC_H01L23/49816|H01L23/49816]] (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers  (shape of the substrate): 1 patents
* [[:Category:CPC_H01L23/49822|H01L23/49822]] ({Multilayer substrates  (multilayer metallisation on monolayer substrate): 1 patents
* [[:Category:CPC_H01L2224/16237|H01L2224/16237]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2924/1511|H01L2924/1511]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H05K1/181|H05K1/181]] (Printed circuits structurally associated with non-printed electric components  ({): 1 patents
* [[:Category:CPC_H05K2201/10378|H05K2201/10378]] (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
* [[:Category:CPC_H05K1/182|H05K1/182]] (Printed circuits structurally associated with non-printed electric components  ({): 1 patents
* [[:Category:CPC_H03H9/542|H03H9/542]] (IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS  (measuring, testing): 1 patents
* [[:Category:CPC_H03H3/02|H03H3/02]] (IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS  (measuring, testing): 1 patents
* [[:Category:CPC_H03H9/133|H03H9/133]] (IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS  (measuring, testing): 1 patents
* [[:Category:CPC_H03H9/17|H03H9/17]] (IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS  (measuring, testing): 1 patents
* [[:Category:CPC_H01L23/645|H01L23/645]] ({Inductive arrangements  (): 1 patents
* [[:Category:CPC_H05K1/0306|H05K1/0306]] (Use of materials for the substrate): 1 patents
* [[:Category:CPC_H05K1/115|H05K1/115]] (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
* [[:Category:CPC_H05K3/4038|H05K3/4038]] (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
* [[:Category:CPC_H05K2201/09509|H05K2201/09509]] (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents

=== Companies ===
[[File:Yulin_FENG_Top_Companies.png|border|800px]]

==== List of Companies ====
* Beijing BOE Optoelectronics Technology Co., Ltd.: 5 patents

=== Collaborators ===
* [[:Category:Yifan WU|Yifan WU]][[Category:Yifan WU]] (5 collaborations)
* [[:Category:Yue LI|Yue LI]][[Category:Yue LI]] (5 collaborations)
* [[:Category:Yuelei XIAO|Yuelei XIAO]][[Category:Yuelei XIAO]] (5 collaborations)
* [[:Category:Qichang AN|Qichang AN]][[Category:Qichang AN]] (5 collaborations)
* [[:Category:Kidong HAN|Kidong HAN]][[Category:Kidong HAN]] (4 collaborations)
* [[:Category:Jingshu ZHANG|Jingshu ZHANG]][[Category:Jingshu ZHANG]] (3 collaborations)
* [[:Category:Biqi LI|Biqi LI]][[Category:Biqi LI]] (3 collaborations)
* [[:Category:Huiying LI|Huiying LI]][[Category:Huiying LI]] (3 collaborations)
* [[:Category:Zijian WANG|Zijian WANG]][[Category:Zijian WANG]] (2 collaborations)
* [[:Category:Xiaodong LI|Xiaodong LI]][[Category:Xiaodong LI]] (2 collaborations)
* [[:Category:Xue CAO|Xue CAO]][[Category:Xue CAO]] (2 collaborations)
* [[:Category:Shuai XU|Shuai XU]][[Category:Shuai XU]] (1 collaborations)
* [[:Category:Bin ZHAO|Bin ZHAO]][[Category:Bin ZHAO]] (1 collaborations)
* [[:Category:Yingwei LIU|Yingwei LIU]][[Category:Yingwei LIU]] (1 collaborations)
* [[:Category:Rui MA|Rui MA]][[Category:Rui MA]] (1 collaborations)
* [[:Category:Quanyue LI|Quanyue LI]][[Category:Quanyue LI]] (1 collaborations)
* [[:Category:Song CHEN|Song CHEN]][[Category:Song CHEN]] (1 collaborations)
* [[:Category:Qianyu GUO|Qianyu GUO]][[Category:Qianyu GUO]] (1 collaborations)
* [[:Category:Lihui WANG|Lihui WANG]][[Category:Lihui WANG]] (1 collaborations)
* [[:Category:Qiuxu WEI|Qiuxu WEI]][[Category:Qiuxu WEI]] (1 collaborations)
* [[:Category:Yanfei REN|Yanfei REN]][[Category:Yanfei REN]] (1 collaborations)
* [[:Category:Wenbo CHANG|Wenbo CHANG]][[Category:Wenbo CHANG]] (1 collaborations)
* [[:Category:Yi ZHOU|Yi ZHOU]][[Category:Yi ZHOU]] (1 collaborations)
* [[:Category:Feng QU|Feng QU]][[Category:Feng QU]] (1 collaborations)

[[Category:Yulin FENG]]
[[Category:Inventors]]
[[Category:Inventors filing patents with Beijing BOE Optoelectronics Technology Co., Ltd.]]