View source for Category:Yutaro HIRAI

== Yutaro HIRAI ==

=== Executive Summary ===
Yutaro HIRAI is an inventor who has filed 2 patents. Their primary areas of innovation include PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR (2 patents), PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR (2 patents), PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR (1 patents), and they have worked with companies such as DOWA METALTECH CO., LTD. (2 patents). Their most frequent collaborators include [[Category:Yosuke SATO|Yosuke SATO]] (2 collaborations), [[Category:Kentaro ARAI|Kentaro ARAI]] (2 collaborations).

=== Patent Filing Activity ===
[[File:Yutaro_HIRAI_Monthly_Patent_Applications.png|border|800px]]

=== Technology Areas ===
[[File:Yutaro_HIRAI_Top_Technology_Areas.png|border|800px]]

==== List of Technology Areas ====
* [[:Category:CPC_C25D3/46|C25D3/46]] (PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR): 2 patents
* [[:Category:CPC_C25D5/12|C25D5/12]] (PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR): 2 patents
* [[:Category:CPC_C25D5/10|C25D5/10]] (PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR): 1 patents
* [[:Category:CPC_C25D5/617|C25D5/617]] (PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR): 1 patents
* [[:Category:CPC_C30B29/02|C30B29/02]] (Elements): 1 patents
* [[:Category:CPC_C30B28/04|C30B28/04]] (SINGLE-CRYSTAL GROWTH  (by using ultra-high pressure, e.g. for the formation of diamonds,): 1 patents
* [[:Category:CPC_B32B15/018|B32B15/018]] (all layers being exclusively metallic {(making layered metal workpieces by pressure cladding): 1 patents
* [[:Category:CPC_H01B5/00|H01B5/00]] (Non-insulated conductors or conductive bodies characterised by their form): 1 patents
* [[:Category:CPC_H01R13/03|H01R13/03]] (ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS): 1 patents
* [[:Category:CPC_H01R43/16|H01R43/16]] (for manufacturing contact members, e.g. by punching and by bending): 1 patents
* [[:Category:CPC_H01H1/021|H01H1/021]] (Composite material): 1 patents

=== Companies ===
[[File:Yutaro_HIRAI_Top_Companies.png|border|800px]]

==== List of Companies ====
* DOWA METALTECH CO., LTD.: 2 patents

=== Collaborators ===
* [[:Category:Yosuke SATO|Yosuke SATO]][[Category:Yosuke SATO]] (2 collaborations)
* [[:Category:Kentaro ARAI|Kentaro ARAI]][[Category:Kentaro ARAI]] (2 collaborations)

[[Category:Yutaro HIRAI]]
[[Category:Inventors]]
[[Category:Inventors filing patents with DOWA METALTECH CO., LTD.]]