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| === Executive Summary === | | === Executive Summary === |
| Yu-Cheng Tung is an inventor who has filed 12 patents. Their primary areas of innovation include ELECTRONIC MEMORY DEVICES (5 patents), ELECTRONIC MEMORY DEVICES (4 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (2 patents), and they have worked with companies such as Fujian Jinhua Integrated Circuit Co., Ltd. (12 patents). Their most frequent collaborators include [[Category:Janbo Zhang|Janbo Zhang]] (7 collaborations), [[Category:Yifei Yan|Yifei Yan]] (3 collaborations), [[Category:Yi-Wang Jhan|Yi-Wang Jhan]] (2 collaborations). | | Yu-Cheng Tung is an inventor who has filed 3 patents. Their primary areas of innovation include SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (1 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (1 patents), ELECTRONIC MEMORY DEVICES (1 patents), and they have worked with companies such as Fujian Jinhua Integrated Circuit Co., Ltd. (3 patents). Their most frequent collaborators include [[Category:Janbo Zhang|Janbo Zhang]] (2 collaborations), [[Category:Bingxing Wu|Bingxing Wu]] (1 collaborations), [[Category:Jung-Hua Chen|Jung-Hua Chen]] (1 collaborations). |
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| === Patent Filing Activity === | | === Patent Filing Activity === |
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| ==== List of Technology Areas ==== | | ==== List of Technology Areas ==== |
| * [[:Category:CPC_H10B12/315|H10B12/315]] (ELECTRONIC MEMORY DEVICES): 5 patents
| | * [[:Category:CPC_H01L28/91|H01L28/91]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents |
| * [[:Category:CPC_H10B12/0335|H10B12/0335]] (ELECTRONIC MEMORY DEVICES): 4 patents
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| * [[:Category:CPC_H01L28/91|H01L28/91]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents | |
| * [[:Category:CPC_H01L27/10823|H01L27/10823]] (including a plurality of individual components in a repetitive configuration): 2 patents
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| * [[:Category:CPC_H10B12/482|H10B12/482]] (ELECTRONIC MEMORY DEVICES): 2 patents
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| * [[:Category:CPC_G11C5/063|G11C5/063]] (STATIC STORES (semiconductor memory devices): 2 patents
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| * [[:Category:CPC_H10B12/033|H10B12/033]] (ELECTRONIC MEMORY DEVICES): 2 patents
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| * [[:Category:CPC_H01L28/75|H01L28/75]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | | * [[:Category:CPC_H01L28/75|H01L28/75]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents |
| | * [[:Category:CPC_H10B12/0335|H10B12/0335]] (ELECTRONIC MEMORY DEVICES): 1 patents |
| | * [[:Category:CPC_H10B12/31|H10B12/31]] (ELECTRONIC MEMORY DEVICES): 1 patents |
| * [[:Category:CPC_H10B12/03|H10B12/03]] (ELECTRONIC MEMORY DEVICES): 1 patents | | * [[:Category:CPC_H10B12/03|H10B12/03]] (ELECTRONIC MEMORY DEVICES): 1 patents |
| * [[:Category:CPC_H10B12/09|H10B12/09]] (ELECTRONIC MEMORY DEVICES): 1 patents | | * [[:Category:CPC_H10B12/482|H10B12/482]] (ELECTRONIC MEMORY DEVICES): 1 patents |
| * [[:Category:CPC_H10B12/34|H10B12/34]] (ELECTRONIC MEMORY DEVICES): 1 patents
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| * [[:Category:CPC_H01L27/10876|H01L27/10876]] (including a plurality of individual components in a repetitive configuration): 1 patents
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| * [[:Category:CPC_H01L27/10885|H01L27/10885]] (including a plurality of individual components in a repetitive configuration): 1 patents
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| * [[:Category:CPC_H01L27/10888|H01L27/10888]] (including a plurality of individual components in a repetitive configuration): 1 patents
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| * [[:Category:CPC_H01L21/76831|H01L21/76831]] ({in via holes or trenches, e.g. non-conductive sidewall liners}): 1 patents
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| * [[:Category:CPC_H01L21/76843|H01L21/76843]] ({formed in openings in a dielectric}): 1 patents
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| * [[:Category:CPC_H01L23/5226|H01L23/5226]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
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| * [[:Category:CPC_H01L23/53223|H01L23/53223]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
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| * [[:Category:CPC_H01L23/53238|H01L23/53238]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
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| * [[:Category:CPC_H01L23/53266|H01L23/53266]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
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| * [[:Category:CPC_H01L29/0649|H01L29/0649]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
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| * [[:Category:CPC_H01L27/10808|H01L27/10808]] (including a plurality of individual components in a repetitive configuration): 1 patents
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| * [[:Category:CPC_H01L27/10855|H01L27/10855]] (including a plurality of individual components in a repetitive configuration): 1 patents
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| * [[:Category:CPC_H01L27/10891|H01L27/10891]] (including a plurality of individual components in a repetitive configuration): 1 patents
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| * [[:Category:CPC_H01L29/66969|H01L29/66969]] ({of devices having semiconductor bodies not comprising group 14 or group 13/15 materials (comprising selenium or tellurium in uncombined form other than as impurities in semiconductor bodies of other materials, comprising cuprous oxide or cuprous iodide): 1 patents
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| * [[:Category:CPC_C23C16/407|C23C16/407]] (COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion): 1 patents
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| * [[:Category:CPC_C23C16/45529|C23C16/45529]] (COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion): 1 patents
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| * [[:Category:CPC_C23C16/45553|C23C16/45553]] (COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion): 1 patents
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| * [[:Category:CPC_H01L21/02554|H01L21/02554]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
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| * [[:Category:CPC_H01L21/02565|H01L21/02565]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
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| * [[:Category:CPC_H01L21/0262|H01L21/0262]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
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| * [[:Category:CPC_H01L29/24|H01L29/24]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
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| * [[:Category:CPC_H01L29/78648|H01L29/78648]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
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| * [[:Category:CPC_H01L29/7869|H01L29/7869]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
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| * [[:Category:CPC_H01L29/78693|H01L29/78693]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
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| * [[:Category:CPC_H01L29/78696|H01L29/78696]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
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| * [[:Category:CPC_H01L21/0338|H01L21/0338]] ({Process specially adapted to improve the resolution of the mask}): 1 patents
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| * [[:Category:CPC_H01L21/0335|H01L21/0335]] ({characterised by their behaviour during the process, e.g. soluble masks, redeposited masks}): 1 patents
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| * [[:Category:CPC_H01L21/0337|H01L21/0337]] ({characterised by the process involved to create the mask, e.g. lift-off masks, sidewalls, or to modify the mask, e.g. pre-treatment, post-treatment}): 1 patents
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| * [[:Category:CPC_H01L21/76892|H01L21/76892]] (Applying interconnections to be used for carrying current between separate components within a device {comprising conductors and dielectrics}): 1 patents
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| * [[:Category:CPC_H01L23/528|H01L23/528]] ({Geometry or} layout of the interconnection structure {(): 1 patents
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| * [[:Category:CPC_H10B12/31|H10B12/31]] (ELECTRONIC MEMORY DEVICES): 1 patents
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| * [[:Category:CPC_H01L21/76224|H01L21/76224]] ({using trench refilling with dielectric materials (trench filling with polycristalline silicon): 1 patents
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| * [[:Category:CPC_H10B12/485|H10B12/485]] (ELECTRONIC MEMORY DEVICES): 1 patents | | * [[:Category:CPC_H10B12/485|H10B12/485]] (ELECTRONIC MEMORY DEVICES): 1 patents |
| * [[:Category:CPC_H10B12/488|H10B12/488]] (ELECTRONIC MEMORY DEVICES): 1 patents | | * [[:Category:CPC_H10B12/488|H10B12/488]] (ELECTRONIC MEMORY DEVICES): 1 patents |
| | * [[:Category:CPC_H10B12/315|H10B12/315]] (ELECTRONIC MEMORY DEVICES): 1 patents |
| | * [[:Category:CPC_H10B12/033|H10B12/033]] (ELECTRONIC MEMORY DEVICES): 1 patents |
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| === Companies === | | === Companies === |
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| ==== List of Companies ==== | | ==== List of Companies ==== |
| * Fujian Jinhua Integrated Circuit Co., Ltd.: 12 patents | | * Fujian Jinhua Integrated Circuit Co., Ltd.: 3 patents |
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| === Collaborators === | | === Collaborators === |
| * [[:Category:Janbo Zhang|Janbo Zhang]][[Category:Janbo Zhang]] (7 collaborations) | | * [[:Category:Janbo Zhang|Janbo Zhang]][[Category:Janbo Zhang]] (2 collaborations) |
| * [[:Category:Yifei Yan|Yifei Yan]][[Category:Yifei Yan]] (3 collaborations)
| | * [[:Category:Bingxing Wu|Bingxing Wu]][[Category:Bingxing Wu]] (1 collaborations) |
| * [[:Category:Yi-Wang Jhan|Yi-Wang Jhan]][[Category:Yi-Wang Jhan]] (2 collaborations)
| | * [[:Category:Jung-Hua Chen|Jung-Hua Chen]][[Category:Jung-Hua Chen]] (1 collaborations) |
| * [[:Category:Gang-Yi Lin|Gang-Yi Lin]][[Category:Gang-Yi Lin]] (2 collaborations)
| | * [[:Category:Wei-Ming Hsiao|Wei-Ming Hsiao]][[Category:Wei-Ming Hsiao]] (1 collaborations) |
| * [[:Category:Chia-Wei Wu|Chia-Wei Wu]][[Category:Chia-Wei Wu]] (2 collaborations) | | * [[:Category:Qiangwei Xu|Qiangwei Xu]][[Category:Qiangwei Xu]] (1 collaborations) |
| * [[:Category:Fu-Che Lee|Fu-Che Lee]][[Category:Fu-Che Lee]] (1 collaborations)
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| * [[:Category:An-Chi Liu|An-Chi Liu]][[Category:An-Chi Liu]] (1 collaborations) | |
| * [[:Category:Ken-Li Chen|Ken-Li Chen]][[Category:Ken-Li Chen]] (1 collaborations) | |
| * [[:Category:Xiaopei Fang|Xiaopei Fang]][[Category:Xiaopei Fang]] (1 collaborations) | |
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| [[Category:Yu-Cheng Tung]] | | [[Category:Yu-Cheng Tung]] |
| [[Category:Inventors]] | | [[Category:Inventors]] |
| [[Category:Inventors filing patents with Fujian Jinhua Integrated Circuit Co., Ltd.]] | | [[Category:Inventors filing patents with Fujian Jinhua Integrated Circuit Co., Ltd.]] |
Yu-Cheng Tung
Executive Summary
Yu-Cheng Tung is an inventor who has filed 3 patents. Their primary areas of innovation include SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (1 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (1 patents), ELECTRONIC MEMORY DEVICES (1 patents), and they have worked with companies such as Fujian Jinhua Integrated Circuit Co., Ltd. (3 patents). Their most frequent collaborators include (2 collaborations), (1 collaborations), (1 collaborations).
Patent Filing Activity
File:Yu-Cheng Tung Monthly Patent Applications.png
Technology Areas
File:Yu-Cheng Tung Top Technology Areas.png
List of Technology Areas
- H01L28/91 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L28/75 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H10B12/0335 (ELECTRONIC MEMORY DEVICES): 1 patents
- H10B12/31 (ELECTRONIC MEMORY DEVICES): 1 patents
- H10B12/03 (ELECTRONIC MEMORY DEVICES): 1 patents
- H10B12/482 (ELECTRONIC MEMORY DEVICES): 1 patents
- H10B12/485 (ELECTRONIC MEMORY DEVICES): 1 patents
- H10B12/488 (ELECTRONIC MEMORY DEVICES): 1 patents
- H10B12/315 (ELECTRONIC MEMORY DEVICES): 1 patents
- H10B12/033 (ELECTRONIC MEMORY DEVICES): 1 patents
Companies
File:Yu-Cheng Tung Top Companies.png
List of Companies
- Fujian Jinhua Integrated Circuit Co., Ltd.: 3 patents
Collaborators
