Category:JHIH-WEI LAI: Difference between revisions
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=== Executive Summary === | === Executive Summary === | ||
JHIH-WEI LAI is an inventor who has filed | JHIH-WEI LAI is an inventor who has filed 3 patents. Their primary areas of innovation include based on aluminium nitride (1 patents), {obtaining ceramic films, e.g. by using temporary supports} (1 patents), {Milling} (1 patents), and they have worked with companies such as TONG HSING ELECTRONIC INDUSTRIES, LTD. (3 patents). Their most frequent collaborators include [[Category:SHIH-HAN WU|SHIH-HAN WU]] (3 collaborations), [[Category:JIAN-YU SHIH|JIAN-YU SHIH]] (3 collaborations), [[Category:MING-YEN PAN|MING-YEN PAN]] (2 collaborations). | ||
=== Patent Filing Activity === | === Patent Filing Activity === | ||
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==== List of Technology Areas ==== | ==== List of Technology Areas ==== | ||
* [[:Category: | * [[:Category:CPC_C04B35/581|C04B35/581]] (based on aluminium nitride): 1 patents | ||
* [[:Category: | * [[:Category:CPC_C04B35/62218|C04B35/62218]] ({obtaining ceramic films, e.g. by using temporary supports}): 1 patents | ||
* [[:Category: | * [[:Category:CPC_C04B35/6261|C04B35/6261]] ({Milling}): 1 patents | ||
* [[:Category: | * [[:Category:CPC_C04B35/638|C04B35/638]] (Removal thereof): 1 patents | ||
* [[:Category: | * [[:Category:CPC_C04B35/64|C04B35/64]] (Burning or sintering processes (): 1 patents | ||
* [[:Category: | * [[:Category:CPC_C04B2235/3225|C04B2235/3225]] (Yttrium oxide or oxide-forming salts thereof): 1 patents | ||
* [[:Category: | * [[:Category:CPC_C04B2235/386|C04B2235/386]] (Boron nitrides): 1 patents | ||
* [[:Category: | * [[:Category:CPC_C04B2235/3865|C04B2235/3865]] (Aluminium nitrides): 1 patents | ||
* [[:Category: | * [[:Category:CPC_C04B2235/528|C04B2235/528]] (Spheres): 1 patents | ||
* [[:Category: | * [[:Category:CPC_C04B2235/5292|C04B2235/5292]] (Flakes, platelets or plates): 1 patents | ||
* [[:Category: | * [[:Category:CPC_C04B2235/5436|C04B2235/5436]] (micrometer sized, i.e. from 1 to 100 micron): 1 patents | ||
* [[:Category: | * [[:Category:CPC_C04B2235/5445|C04B2235/5445]] (submicron sized, i.e. from 0,1 to 1 micron): 1 patents | ||
* [[:Category: | * [[:Category:CPC_C04B2235/5454|C04B2235/5454]] (nanometer sized, i.e. below 100 nm): 1 patents | ||
* [[:Category: | * [[:Category:CPC_C04B2235/6025|C04B2235/6025]] (Tape casting, e.g. with a doctor blade): 1 patents | ||
* [[:Category: | * [[:Category:CPC_C04B2235/604|C04B2235/604]] (Pressing at temperatures other than sintering temperatures): 1 patents | ||
* [[:Category:CPC_C04B2235/612|C04B2235/612]] (Machining): 1 patents | |||
* [[:Category:CPC_C04B2235/6581|C04B2235/6581]] (Total pressure below 1 atmosphere, e.g. vacuum): 1 patents | |||
* [[:Category:CPC_C04B2235/667|C04B2235/667]] (Sintering using wave energy, e.g. microwave sintering): 1 patents | |||
* [[:Category:CPC_C04B2235/668|C04B2235/668]] (Pressureless sintering): 1 patents | |||
* [[:Category:CPC_C04B2235/78|C04B2235/78]] (Grain sizes and shapes, product microstructures, e.g. acicular grains, equiaxed grains, platelet-structures): 1 patents | |||
* [[:Category:CPC_H05K3/12|H05K3/12]] (using {thick film techniques, e.g.} printing techniques to apply the conductive material {or similar techniques for applying conductive paste or ink patterns}): 1 patents | |||
* [[:Category:CPC_H05K1/18|H05K1/18]] (Printed circuits structurally associated with non-printed electric components ({): 1 patents | |||
* [[:Category:CPC_H05K2201/10984|H05K2201/10984]] (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents | |||
* [[:Category:CPC_H10H20/857|H10H20/857]] (No explanation available): 1 patents | |||
* [[:Category:CPC_H10H20/853|H10H20/853]] (No explanation available): 1 patents | |||
* [[:Category:CPC_H10H20/0362|H10H20/0362]] (No explanation available): 1 patents | |||
* [[:Category:CPC_H10H20/0364|H10H20/0364]] (No explanation available): 1 patents | |||
=== Companies === | === Companies === | ||
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==== List of Companies ==== | ==== List of Companies ==== | ||
* TONG HSING ELECTRONIC INDUSTRIES, LTD.: | * TONG HSING ELECTRONIC INDUSTRIES, LTD.: 3 patents | ||
=== Collaborators === | === Collaborators === | ||
* [[:Category: | * [[:Category:SHIH-HAN WU|SHIH-HAN WU]][[Category:SHIH-HAN WU]] (3 collaborations) | ||
* [[:Category: | * [[:Category:JIAN-YU SHIH|JIAN-YU SHIH]][[Category:JIAN-YU SHIH]] (3 collaborations) | ||
* [[:Category:MING-YEN PAN|MING-YEN PAN]][[Category:MING-YEN PAN]] (1 collaborations) | * [[:Category:MING-YEN PAN|MING-YEN PAN]][[Category:MING-YEN PAN]] (2 collaborations) | ||
* [[:Category: | * [[:Category:KAI-MOU CHOU|KAI-MOU CHOU]][[Category:KAI-MOU CHOU]] (1 collaborations) | ||
* [[:Category: | * [[:Category:YU-HSIEN LIAO|YU-HSIEN LIAO]][[Category:YU-HSIEN LIAO]] (1 collaborations) | ||
* [[:Category:HAO-EN HUNG|HAO-EN HUNG]][[Category:HAO-EN HUNG]] (1 collaborations) | |||
[[Category:JHIH-WEI LAI]] | [[Category:JHIH-WEI LAI]] | ||
[[Category:Inventors]] | [[Category:Inventors]] | ||
[[Category:Inventors filing patents with TONG HSING ELECTRONIC INDUSTRIES, LTD.]] | [[Category:Inventors filing patents with TONG HSING ELECTRONIC INDUSTRIES, LTD.]] | ||
Latest revision as of 03:08, 2 April 2025
JHIH-WEI LAI
Executive Summary
JHIH-WEI LAI is an inventor who has filed 3 patents. Their primary areas of innovation include based on aluminium nitride (1 patents), {obtaining ceramic films, e.g. by using temporary supports} (1 patents), {Milling} (1 patents), and they have worked with companies such as TONG HSING ELECTRONIC INDUSTRIES, LTD. (3 patents). Their most frequent collaborators include (3 collaborations), (3 collaborations), (2 collaborations).
Patent Filing Activity
File:JHIH-WEI LAI Monthly Patent Applications.png
Technology Areas
File:JHIH-WEI LAI Top Technology Areas.png
List of Technology Areas
- C04B35/581 (based on aluminium nitride): 1 patents
- C04B35/62218 ({obtaining ceramic films, e.g. by using temporary supports}): 1 patents
- C04B35/6261 ({Milling}): 1 patents
- C04B35/638 (Removal thereof): 1 patents
- C04B35/64 (Burning or sintering processes (): 1 patents
- C04B2235/3225 (Yttrium oxide or oxide-forming salts thereof): 1 patents
- C04B2235/386 (Boron nitrides): 1 patents
- C04B2235/3865 (Aluminium nitrides): 1 patents
- C04B2235/528 (Spheres): 1 patents
- C04B2235/5292 (Flakes, platelets or plates): 1 patents
- C04B2235/5436 (micrometer sized, i.e. from 1 to 100 micron): 1 patents
- C04B2235/5445 (submicron sized, i.e. from 0,1 to 1 micron): 1 patents
- C04B2235/5454 (nanometer sized, i.e. below 100 nm): 1 patents
- C04B2235/6025 (Tape casting, e.g. with a doctor blade): 1 patents
- C04B2235/604 (Pressing at temperatures other than sintering temperatures): 1 patents
- C04B2235/612 (Machining): 1 patents
- C04B2235/6581 (Total pressure below 1 atmosphere, e.g. vacuum): 1 patents
- C04B2235/667 (Sintering using wave energy, e.g. microwave sintering): 1 patents
- C04B2235/668 (Pressureless sintering): 1 patents
- C04B2235/78 (Grain sizes and shapes, product microstructures, e.g. acicular grains, equiaxed grains, platelet-structures): 1 patents
- H05K3/12 (using {thick film techniques, e.g.} printing techniques to apply the conductive material {or similar techniques for applying conductive paste or ink patterns}): 1 patents
- H05K1/18 (Printed circuits structurally associated with non-printed electric components ({): 1 patents
- H05K2201/10984 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
- H10H20/857 (No explanation available): 1 patents
- H10H20/853 (No explanation available): 1 patents
- H10H20/0362 (No explanation available): 1 patents
- H10H20/0364 (No explanation available): 1 patents
Companies
File:JHIH-WEI LAI Top Companies.png
List of Companies
- TONG HSING ELECTRONIC INDUSTRIES, LTD.: 3 patents
Collaborators
- SHIH-HAN WU (3 collaborations)
- JIAN-YU SHIH (3 collaborations)
- MING-YEN PAN (2 collaborations)
- KAI-MOU CHOU (1 collaborations)
- YU-HSIEN LIAO (1 collaborations)
- HAO-EN HUNG (1 collaborations)
Subcategories
This category has the following 7 subcategories, out of 7 total.