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Category:JIAN-YU SHIH: Difference between revisions

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=== Executive Summary ===
=== Executive Summary ===
JIAN-YU SHIH is an inventor who has filed 1 patents. Their primary areas of innovation include No explanation available (1 patents), No explanation available (1 patents), No explanation available (1 patents), and they have worked with companies such as TONG HSING ELECTRONIC INDUSTRIES, LTD. (1 patents). Their most frequent collaborators include [[Category:DEI-CHENG LIU|DEI-CHENG LIU]] (1 collaborations), [[Category:CHIA-SHUAI CHANG|CHIA-SHUAI CHANG]] (1 collaborations), [[Category:MING-YEN PAN|MING-YEN PAN]] (1 collaborations).
JIAN-YU SHIH is an inventor who has filed 3 patents. Their primary areas of innovation include based on aluminium nitride (1 patents), {obtaining ceramic films, e.g. by using temporary supports} (1 patents), {Milling} (1 patents), and they have worked with companies such as TONG HSING ELECTRONIC INDUSTRIES, LTD. (3 patents). Their most frequent collaborators include [[Category:SHIH-HAN WU|SHIH-HAN WU]] (3 collaborations), [[Category:JHIH-WEI LAI|JHIH-WEI LAI]] (3 collaborations), [[Category:MING-YEN PAN|MING-YEN PAN]] (2 collaborations).


=== Patent Filing Activity ===
=== Patent Filing Activity ===
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==== List of Technology Areas ====
==== List of Technology Areas ====
* [[:Category:CPC_H01L21/481|H01L21/481]] (No explanation available): 1 patents
* [[:Category:CPC_C04B35/581|C04B35/581]] (based on aluminium nitride): 1 patents
* [[:Category:CPC_H01L21/486|H01L21/486]] (No explanation available): 1 patents
* [[:Category:CPC_C04B35/62218|C04B35/62218]] ({obtaining ceramic films, e.g. by using temporary supports}): 1 patents
* [[:Category:CPC_H01L21/50|H01L21/50]] (No explanation available): 1 patents
* [[:Category:CPC_C04B35/6261|C04B35/6261]] ({Milling}): 1 patents
* [[:Category:CPC_H01L27/14618|H01L27/14618]] (No explanation available): 1 patents
* [[:Category:CPC_C04B35/638|C04B35/638]] (Removal thereof): 1 patents
* [[:Category:CPC_H01L33/486|H01L33/486]] (No explanation available): 1 patents
* [[:Category:CPC_C04B35/64|C04B35/64]] (Burning or sintering processes  (): 1 patents
* [[:Category:CPC_H01L33/60|H01L33/60]] (No explanation available): 1 patents
* [[:Category:CPC_C04B2235/3225|C04B2235/3225]] (Yttrium oxide or oxide-forming salts thereof): 1 patents
* [[:Category:CPC_H01L33/62|H01L33/62]] (No explanation available): 1 patents
* [[:Category:CPC_C04B2235/386|C04B2235/386]] (Boron nitrides): 1 patents
* [[:Category:CPC_H01L2933/0058|H01L2933/0058]] (No explanation available): 1 patents
* [[:Category:CPC_C04B2235/3865|C04B2235/3865]] (Aluminium nitrides): 1 patents
* [[:Category:CPC_H01L2933/0066|H01L2933/0066]] (No explanation available): 1 patents
* [[:Category:CPC_C04B2235/528|C04B2235/528]] (Spheres): 1 patents
* [[:Category:CPC_C04B2235/5292|C04B2235/5292]] (Flakes, platelets or plates): 1 patents
* [[:Category:CPC_C04B2235/5436|C04B2235/5436]] (micrometer sized, i.e. from 1 to 100 micron): 1 patents
* [[:Category:CPC_C04B2235/5445|C04B2235/5445]] (submicron sized, i.e. from 0,1 to 1 micron): 1 patents
* [[:Category:CPC_C04B2235/5454|C04B2235/5454]] (nanometer sized, i.e. below 100 nm): 1 patents
* [[:Category:CPC_C04B2235/6025|C04B2235/6025]] (Tape casting, e.g. with a doctor blade): 1 patents
* [[:Category:CPC_C04B2235/604|C04B2235/604]] (Pressing at temperatures other than sintering temperatures): 1 patents
* [[:Category:CPC_C04B2235/612|C04B2235/612]] (Machining): 1 patents
* [[:Category:CPC_C04B2235/6581|C04B2235/6581]] (Total pressure below 1 atmosphere, e.g. vacuum): 1 patents
* [[:Category:CPC_C04B2235/667|C04B2235/667]] (Sintering using wave energy, e.g. microwave sintering): 1 patents
* [[:Category:CPC_C04B2235/668|C04B2235/668]] (Pressureless sintering): 1 patents
* [[:Category:CPC_C04B2235/78|C04B2235/78]] (Grain sizes and shapes, product microstructures, e.g. acicular grains, equiaxed grains, platelet-structures): 1 patents
* [[:Category:CPC_H05K3/12|H05K3/12]] (using {thick film techniques, e.g.} printing techniques to apply the conductive material {or similar techniques for applying conductive paste or ink patterns}): 1 patents
* [[:Category:CPC_H05K1/18|H05K1/18]] (Printed circuits structurally associated with non-printed electric components  ({): 1 patents
* [[:Category:CPC_H05K2201/10984|H05K2201/10984]] (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
* [[:Category:CPC_H10H20/857|H10H20/857]] (No explanation available): 1 patents
* [[:Category:CPC_H10H20/853|H10H20/853]] (No explanation available): 1 patents
* [[:Category:CPC_H10H20/0362|H10H20/0362]] (No explanation available): 1 patents
* [[:Category:CPC_H10H20/0364|H10H20/0364]] (No explanation available): 1 patents


=== Companies ===
=== Companies ===
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==== List of Companies ====
==== List of Companies ====
* TONG HSING ELECTRONIC INDUSTRIES, LTD.: 1 patents
* TONG HSING ELECTRONIC INDUSTRIES, LTD.: 3 patents


=== Collaborators ===
=== Collaborators ===
* [[:Category:DEI-CHENG LIU|DEI-CHENG LIU]][[Category:DEI-CHENG LIU]] (1 collaborations)
* [[:Category:SHIH-HAN WU|SHIH-HAN WU]][[Category:SHIH-HAN WU]] (3 collaborations)
* [[:Category:CHIA-SHUAI CHANG|CHIA-SHUAI CHANG]][[Category:CHIA-SHUAI CHANG]] (1 collaborations)
* [[:Category:JHIH-WEI LAI|JHIH-WEI LAI]][[Category:JHIH-WEI LAI]] (3 collaborations)
* [[:Category:MING-YEN PAN|MING-YEN PAN]][[Category:MING-YEN PAN]] (1 collaborations)
* [[:Category:MING-YEN PAN|MING-YEN PAN]][[Category:MING-YEN PAN]] (2 collaborations)
* [[:Category:JHIH-WEI LAI|JHIH-WEI LAI]][[Category:JHIH-WEI LAI]] (1 collaborations)
* [[:Category:KAI-MOU CHOU|KAI-MOU CHOU]][[Category:KAI-MOU CHOU]] (1 collaborations)
* [[:Category:SHIH-HAN WU|SHIH-HAN WU]][[Category:SHIH-HAN WU]] (1 collaborations)
* [[:Category:YU-HSIEN LIAO|YU-HSIEN LIAO]][[Category:YU-HSIEN LIAO]] (1 collaborations)
* [[:Category:HAO-EN HUNG|HAO-EN HUNG]][[Category:HAO-EN HUNG]] (1 collaborations)


[[Category:JIAN-YU SHIH]]
[[Category:JIAN-YU SHIH]]
[[Category:Inventors]]
[[Category:Inventors]]
[[Category:Inventors filing patents with TONG HSING ELECTRONIC INDUSTRIES, LTD.]]
[[Category:Inventors filing patents with TONG HSING ELECTRONIC INDUSTRIES, LTD.]]

Latest revision as of 03:08, 2 April 2025

JIAN-YU SHIH

Executive Summary

JIAN-YU SHIH is an inventor who has filed 3 patents. Their primary areas of innovation include based on aluminium nitride (1 patents), {obtaining ceramic films, e.g. by using temporary supports} (1 patents), {Milling} (1 patents), and they have worked with companies such as TONG HSING ELECTRONIC INDUSTRIES, LTD. (3 patents). Their most frequent collaborators include (3 collaborations), (3 collaborations), (2 collaborations).

Patent Filing Activity

File:JIAN-YU SHIH Monthly Patent Applications.png

Technology Areas

File:JIAN-YU SHIH Top Technology Areas.png

List of Technology Areas

  • C04B35/581 (based on aluminium nitride): 1 patents
  • C04B35/62218 ({obtaining ceramic films, e.g. by using temporary supports}): 1 patents
  • C04B35/6261 ({Milling}): 1 patents
  • C04B35/638 (Removal thereof): 1 patents
  • C04B35/64 (Burning or sintering processes (): 1 patents
  • C04B2235/3225 (Yttrium oxide or oxide-forming salts thereof): 1 patents
  • C04B2235/386 (Boron nitrides): 1 patents
  • C04B2235/3865 (Aluminium nitrides): 1 patents
  • C04B2235/528 (Spheres): 1 patents
  • C04B2235/5292 (Flakes, platelets or plates): 1 patents
  • C04B2235/5436 (micrometer sized, i.e. from 1 to 100 micron): 1 patents
  • C04B2235/5445 (submicron sized, i.e. from 0,1 to 1 micron): 1 patents
  • C04B2235/5454 (nanometer sized, i.e. below 100 nm): 1 patents
  • C04B2235/6025 (Tape casting, e.g. with a doctor blade): 1 patents
  • C04B2235/604 (Pressing at temperatures other than sintering temperatures): 1 patents
  • C04B2235/612 (Machining): 1 patents
  • C04B2235/6581 (Total pressure below 1 atmosphere, e.g. vacuum): 1 patents
  • C04B2235/667 (Sintering using wave energy, e.g. microwave sintering): 1 patents
  • C04B2235/668 (Pressureless sintering): 1 patents
  • C04B2235/78 (Grain sizes and shapes, product microstructures, e.g. acicular grains, equiaxed grains, platelet-structures): 1 patents
  • H05K3/12 (using {thick film techniques, e.g.} printing techniques to apply the conductive material {or similar techniques for applying conductive paste or ink patterns}): 1 patents
  • H05K1/18 (Printed circuits structurally associated with non-printed electric components ({): 1 patents
  • H05K2201/10984 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
  • H10H20/857 (No explanation available): 1 patents
  • H10H20/853 (No explanation available): 1 patents
  • H10H20/0362 (No explanation available): 1 patents
  • H10H20/0364 (No explanation available): 1 patents

Companies

File:JIAN-YU SHIH Top Companies.png

List of Companies

  • TONG HSING ELECTRONIC INDUSTRIES, LTD.: 3 patents

Collaborators

Subcategories

This category has the following 7 subcategories, out of 7 total.

C

D

J

K

M

S

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