Category:MING-YEN PAN: Difference between revisions
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=== Executive Summary === | === Executive Summary === | ||
MING-YEN PAN is an inventor who has filed | MING-YEN PAN is an inventor who has filed 2 patents. Their primary areas of innovation include using {thick film techniques, e.g.} printing techniques to apply the conductive material {or similar techniques for applying conductive paste or ink patterns} (1 patents), Printed circuits structurally associated with non-printed electric components ({ (1 patents), PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS (1 patents), and they have worked with companies such as TONG HSING ELECTRONIC INDUSTRIES, LTD. (2 patents). Their most frequent collaborators include [[Category:SHIH-HAN WU|SHIH-HAN WU]] (2 collaborations), [[Category:JHIH-WEI LAI|JHIH-WEI LAI]] (2 collaborations), [[Category:JIAN-YU SHIH|JIAN-YU SHIH]] (2 collaborations). | ||
=== Patent Filing Activity === | === Patent Filing Activity === | ||
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==== List of Technology Areas ==== | ==== List of Technology Areas ==== | ||
* [[:Category: | * [[:Category:CPC_H05K3/12|H05K3/12]] (using {thick film techniques, e.g.} printing techniques to apply the conductive material {or similar techniques for applying conductive paste or ink patterns}): 1 patents | ||
* [[:Category:CPC_H05K1/18|H05K1/18]] (Printed circuits structurally associated with non-printed electric components ({): 1 patents | |||
* [[:Category: | * [[:Category:CPC_H05K2201/10984|H05K2201/10984]] (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents | ||
* [[:Category:CPC_H10H20/857|H10H20/857]] (No explanation available): 1 patents | |||
* [[:Category: | * [[:Category:CPC_H10H20/853|H10H20/853]] (No explanation available): 1 patents | ||
* [[:Category: | * [[:Category:CPC_H10H20/0362|H10H20/0362]] (No explanation available): 1 patents | ||
* [[:Category: | * [[:Category:CPC_H10H20/0364|H10H20/0364]] (No explanation available): 1 patents | ||
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=== Companies === | === Companies === | ||
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==== List of Companies ==== | ==== List of Companies ==== | ||
* TONG HSING ELECTRONIC INDUSTRIES, LTD.: | * TONG HSING ELECTRONIC INDUSTRIES, LTD.: 2 patents | ||
=== Collaborators === | === Collaborators === | ||
* [[:Category: | * [[:Category:SHIH-HAN WU|SHIH-HAN WU]][[Category:SHIH-HAN WU]] (2 collaborations) | ||
* [[:Category: | * [[:Category:JHIH-WEI LAI|JHIH-WEI LAI]][[Category:JHIH-WEI LAI]] (2 collaborations) | ||
* [[:Category:JIAN-YU SHIH|JIAN-YU SHIH]][[Category:JIAN-YU SHIH]] ( | * [[:Category:JIAN-YU SHIH|JIAN-YU SHIH]][[Category:JIAN-YU SHIH]] (2 collaborations) | ||
* [[:Category: | * [[:Category:YU-HSIEN LIAO|YU-HSIEN LIAO]][[Category:YU-HSIEN LIAO]] (1 collaborations) | ||
* [[:Category: | * [[:Category:HAO-EN HUNG|HAO-EN HUNG]][[Category:HAO-EN HUNG]] (1 collaborations) | ||
[[Category:MING-YEN PAN]] | [[Category:MING-YEN PAN]] | ||
[[Category:Inventors]] | [[Category:Inventors]] | ||
[[Category:Inventors filing patents with TONG HSING ELECTRONIC INDUSTRIES, LTD.]] | [[Category:Inventors filing patents with TONG HSING ELECTRONIC INDUSTRIES, LTD.]] | ||
Latest revision as of 03:11, 2 April 2025
MING-YEN PAN
Executive Summary
MING-YEN PAN is an inventor who has filed 2 patents. Their primary areas of innovation include using {thick film techniques, e.g.} printing techniques to apply the conductive material {or similar techniques for applying conductive paste or ink patterns} (1 patents), Printed circuits structurally associated with non-printed electric components ({ (1 patents), PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS (1 patents), and they have worked with companies such as TONG HSING ELECTRONIC INDUSTRIES, LTD. (2 patents). Their most frequent collaborators include (2 collaborations), (2 collaborations), (2 collaborations).
Patent Filing Activity
File:MING-YEN PAN Monthly Patent Applications.png
Technology Areas
File:MING-YEN PAN Top Technology Areas.png
List of Technology Areas
- H05K3/12 (using {thick film techniques, e.g.} printing techniques to apply the conductive material {or similar techniques for applying conductive paste or ink patterns}): 1 patents
- H05K1/18 (Printed circuits structurally associated with non-printed electric components ({): 1 patents
- H05K2201/10984 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
- H10H20/857 (No explanation available): 1 patents
- H10H20/853 (No explanation available): 1 patents
- H10H20/0362 (No explanation available): 1 patents
- H10H20/0364 (No explanation available): 1 patents
Companies
File:MING-YEN PAN Top Companies.png
List of Companies
- TONG HSING ELECTRONIC INDUSTRIES, LTD.: 2 patents
Collaborators
- SHIH-HAN WU (2 collaborations)
- JHIH-WEI LAI (2 collaborations)
- JIAN-YU SHIH (2 collaborations)
- YU-HSIEN LIAO (1 collaborations)
- HAO-EN HUNG (1 collaborations)
Subcategories
This category has the following 6 subcategories, out of 6 total.