Category:Kandabara Tapily of Albany NY (US): Difference between revisions

Kandabara Tapily of Albany NY (US)

Executive Summary

Kandabara Tapily of Albany NY (US) is an inventor who has filed 3 patents. Their primary areas of innovation include characterised by structural details, e.g. supports, auxiliary layers (supports for printing plates in general (1 patents), used for diffusion transfer {( (1 patents), {from the gas phase, by plasma deposition ( (1 patents), and they have worked with companies such as Tokyo Electron Limited (3 patents). Their most frequent collaborators include (1 collaborations), (1 collaborations), (1 collaborations).

Patent Filing Activity

File:Kandabara Tapily of Albany NY (US) Monthly Patent Applications.png

Technology Areas

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List of Technology Areas

• G03F7/094 (characterised by structural details, e.g. supports, auxiliary layers (supports for printing plates in general): 1 patents
• G03F7/075 (used for diffusion transfer {(): 1 patents
• G03F7/167 ({from the gas phase, by plasma deposition (): 1 patents
• G03F7/70033 (PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR; (phototypographic composing devices): 1 patents
• H01L21/76802 (Applying interconnections to be used for carrying current between separate components within a device {comprising conductors and dielectrics}): 1 patents
• H01L21/31116 ({by dry-etching}): 1 patents
• H01L21/76829 ({characterised by the formation of thin functional dielectric layers, e.g. dielectric etch-stop, barrier, capping or liner layers}): 1 patents
• H01L21/7685 ({the layer covering a conductive structure (): 1 patents
• H01L21/76879 ({by selective deposition of conductive material in the vias, e.g. selective C.V.D. on semiconductor material, plating (plating on semiconductors in general): 1 patents
• H01L21/02315 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• C23C16/402 (COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion): 1 patents
• C23C16/403 (COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion): 1 patents
• C23C16/45527 (COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion): 1 patents
• C23C16/56 (COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion): 1 patents
• H01L21/02636 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/28562 (from a gas or vapour, e.g. condensation): 1 patents
• H01J37/32091 (Gas-filled discharge tubes (heating by discharge): 1 patents
• H01J37/321 (Gas-filled discharge tubes (heating by discharge): 1 patents
• H01J37/32192 (Gas-filled discharge tubes (heating by discharge): 1 patents
• H01J2237/332 (ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS (spark-gaps): 1 patents

Companies

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List of Companies

• Tokyo Electron Limited: 3 patents

Collaborators

• Lior Huli of Albany NY (US) (1 collaborations)
• Subhadeep Kal of Albany NY (US) (1 collaborations)
• Peng Wang of Albany NY (US) (1 collaborations)
• Peter Biolsi of Albany NY (US) (1 collaborations)
• Hunter Frost of Albany NY (US) (1 collaborations)
• Tek Po Rinus Lee of Albany NY (US) (1 collaborations)