Category:Hiroshi UEDA: Difference between revisions
Updating Category:Hiroshi_UEDA |
Updating Category:Hiroshi_UEDA |
||
| Line 2: | Line 2: | ||
=== Executive Summary === | === Executive Summary === | ||
Hiroshi UEDA is an inventor who has filed 4 patents. Their primary areas of innovation include PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS | Hiroshi UEDA is an inventor who has filed 4 patents. Their primary areas of innovation include PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS (2 patents), PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS (2 patents), Use of materials for the substrate (1 patents), and they have worked with companies such as SUMITOMO ELECTRIC INDUSTRIES, LTD. (3 patents), Sumitomo Electric Industries, Ltd. (1 patents). Their most frequent collaborators include [[Category:Ichiro KUWAYAMA|Ichiro KUWAYAMA]] (3 collaborations), [[Category:Suguru YAMAGISHI|Suguru YAMAGISHI]] (3 collaborations), [[Category:Shun IGARASHI|Shun IGARASHI]] (2 collaborations). | ||
=== Patent Filing Activity === | === Patent Filing Activity === | ||
| Line 11: | Line 11: | ||
==== List of Technology Areas ==== | ==== List of Technology Areas ==== | ||
* [[:Category: | * [[:Category:CPC_H05K2201/09236|H05K2201/09236]] (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 2 patents | ||
* [[:Category: | * [[:Category:CPC_H05K2201/09618|H05K2201/09618]] (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 2 patents | ||
* [[:Category:CPC_H05K1/ | * [[:Category:CPC_H05K1/036|H05K1/036]] (Use of materials for the substrate): 1 patents | ||
* [[:Category:CPC_H05K1/ | * [[:Category:CPC_H05K1/0237|H05K1/0237]] ({using auxiliary mounted passive components or auxiliary substances (printed passive components): 1 patents | ||
* [[:Category:CPC_H05K1/ | * [[:Category:CPC_H05K1/09|H05K1/09]] (Use of materials for the {conductive, e.g. } metallic pattern): 1 patents | ||
* [[:Category: | * [[:Category:CPC_H05K2201/015|H05K2201/015]] (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents | ||
* [[:Category: | * [[:Category:CPC_H05K2201/0154|H05K2201/0154]] (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents | ||
* [[:Category: | * [[:Category:CPC_H05K2201/0355|H05K2201/0355]] (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents | ||
* [[:Category: | * [[:Category:CPC_H05K2201/068|H05K2201/068]] (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents | ||
* [[:Category: | * [[:Category:CPC_H04L43/106|H04L43/106]] (using time related information in packets, e.g. by adding timestamps): 1 patents | ||
* [[:Category:CPC_H04L43/0876|H04L43/0876]] (Network utilisation, e.g. volume of load or congestion level): 1 patents | |||
* [[:Category:CPC_H05K1/0228|H05K1/0228]] ({Compensation of cross-talk by a mutually correlated lay-out of printed circuit traces, e.g. for compensation of cross-talk in mounted connectors (balanced signal pairs): 1 patents | |||
* [[:Category:CPC_H05K1/115|H05K1/115]] (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents | |||
* [[:Category:CPC_H05K2201/09636|H05K2201/09636]] (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents | |||
* [[:Category:CPC_H05K1/0218|H05K1/0218]] ({by printed shielding conductors, ground planes or power plane (): 1 patents | |||
* [[:Category:CPC_H05K1/0298|H05K1/0298]] (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents | |||
* [[:Category:CPC_H05K3/0026|H05K3/0026]] (Apparatus or processes for manufacturing printed circuits): 1 patents | |||
* [[:Category:CPC_H05K3/4661|H05K3/4661]] (Manufacturing multilayer circuits): 1 patents | |||
* [[:Category:CPC_H05K2201/09227|H05K2201/09227]] (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents | |||
* [[:Category:CPC_H05K2201/09545|H05K2201/09545]] (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents | |||
* [[:Category:CPC_H05K2201/09609|H05K2201/09609]] (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents | |||
=== Companies === | === Companies === | ||
| Line 30: | Line 41: | ||
=== Collaborators === | === Collaborators === | ||
* [[:Category:Ichiro KUWAYAMA|Ichiro KUWAYAMA]][[Category:Ichiro KUWAYAMA]] (3 collaborations) | |||
* [[:Category:Suguru YAMAGISHI|Suguru YAMAGISHI]][[Category:Suguru YAMAGISHI]] (3 collaborations) | |||
* [[:Category:Shun IGARASHI|Shun IGARASHI]][[Category:Shun IGARASHI]] (2 collaborations) | * [[:Category:Shun IGARASHI|Shun IGARASHI]][[Category:Shun IGARASHI]] (2 collaborations) | ||
* [[:Category: | * [[:Category:Satoshi KIYA|Satoshi KIYA]][[Category:Satoshi KIYA]] (2 collaborations) | ||
* [[:Category: | * [[:Category:Toshiki IWASAKI|Toshiki IWASAKI]][[Category:Toshiki IWASAKI]] (1 collaborations) | ||
* [[:Category:Akihiro YANO|Akihiro YANO]][[Category:Akihiro YANO]] (1 collaborations) | |||
* [[:Category: | * [[:Category:Takuma YAMAMOTO|Takuma YAMAMOTO]][[Category:Takuma YAMAMOTO]] (1 collaborations) | ||
* [[:Category: | * [[:Category:Kyosuke MASUKAWA|Kyosuke MASUKAWA]][[Category:Kyosuke MASUKAWA]] (1 collaborations) | ||
* [[:Category: | |||
[[Category:Hiroshi UEDA]] | [[Category:Hiroshi UEDA]] | ||
Latest revision as of 03:31, 28 March 2025
Hiroshi UEDA
Executive Summary
Hiroshi UEDA is an inventor who has filed 4 patents. Their primary areas of innovation include PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS (2 patents), PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS (2 patents), Use of materials for the substrate (1 patents), and they have worked with companies such as SUMITOMO ELECTRIC INDUSTRIES, LTD. (3 patents), Sumitomo Electric Industries, Ltd. (1 patents). Their most frequent collaborators include (3 collaborations), (3 collaborations), (2 collaborations).
Patent Filing Activity
File:Hiroshi UEDA Monthly Patent Applications.png
Technology Areas
File:Hiroshi UEDA Top Technology Areas.png
List of Technology Areas
- H05K2201/09236 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 2 patents
- H05K2201/09618 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 2 patents
- H05K1/036 (Use of materials for the substrate): 1 patents
- H05K1/0237 ({using auxiliary mounted passive components or auxiliary substances (printed passive components): 1 patents
- H05K1/09 (Use of materials for the {conductive, e.g. } metallic pattern): 1 patents
- H05K2201/015 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
- H05K2201/0154 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
- H05K2201/0355 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
- H05K2201/068 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
- H04L43/106 (using time related information in packets, e.g. by adding timestamps): 1 patents
- H04L43/0876 (Network utilisation, e.g. volume of load or congestion level): 1 patents
- H05K1/0228 ({Compensation of cross-talk by a mutually correlated lay-out of printed circuit traces, e.g. for compensation of cross-talk in mounted connectors (balanced signal pairs): 1 patents
- H05K1/115 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
- H05K2201/09636 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
- H05K1/0218 ({by printed shielding conductors, ground planes or power plane (): 1 patents
- H05K1/0298 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
- H05K3/0026 (Apparatus or processes for manufacturing printed circuits): 1 patents
- H05K3/4661 (Manufacturing multilayer circuits): 1 patents
- H05K2201/09227 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
- H05K2201/09545 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
- H05K2201/09609 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
Companies
File:Hiroshi UEDA Top Companies.png
List of Companies
- SUMITOMO ELECTRIC INDUSTRIES, LTD.: 3 patents
- Sumitomo Electric Industries, Ltd.: 1 patents
Collaborators
- Ichiro KUWAYAMA (3 collaborations)
- Suguru YAMAGISHI (3 collaborations)
- Shun IGARASHI (2 collaborations)
- Satoshi KIYA (2 collaborations)
- Toshiki IWASAKI (1 collaborations)
- Akihiro YANO (1 collaborations)
- Takuma YAMAMOTO (1 collaborations)
- Kyosuke MASUKAWA (1 collaborations)
Subcategories
This category has the following 4 subcategories, out of 4 total.