Category:Kandabara Tapily of Albany NY (US): Difference between revisions

Latest revision as of 02:23, 31 March 2025

Kandabara Tapily of Albany NY (US)

Executive Summary

Kandabara Tapily of Albany NY (US) is an inventor who has filed 3 patents. Their primary areas of innovation include characterised by structural details, e.g. supports, auxiliary layers (supports for printing plates in general (1 patents), used for diffusion transfer {( (1 patents), {from the gas phase, by plasma deposition ( (1 patents), and they have worked with companies such as Tokyo Electron Limited (3 patents). Their most frequent collaborators include (1 collaborations), (1 collaborations), (1 collaborations).

Patent Filing Activity

File:Kandabara Tapily of Albany NY (US) Monthly Patent Applications.png

Technology Areas

File:Kandabara Tapily of Albany NY (US) Top Technology Areas.png

List of Technology Areas

G03F7/094 (characterised by structural details, e.g. supports, auxiliary layers (supports for printing plates in general): 1 patents
G03F7/075 (used for diffusion transfer {(): 1 patents
G03F7/167 ({from the gas phase, by plasma deposition (): 1 patents
G03F7/70033 (PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR; (phototypographic composing devices): 1 patents
H01L21/76802 (Applying interconnections to be used for carrying current between separate components within a device {comprising conductors and dielectrics}): 1 patents
H01L21/31116 ({by dry-etching}): 1 patents
H01L21/76829 ({characterised by the formation of thin functional dielectric layers, e.g. dielectric etch-stop, barrier, capping or liner layers}): 1 patents
H01L21/7685 ({the layer covering a conductive structure (): 1 patents
H01L21/76879 ({by selective deposition of conductive material in the vias, e.g. selective C.V.D. on semiconductor material, plating (plating on semiconductors in general): 1 patents
H01L21/02315 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
C23C16/402 (COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion): 1 patents
C23C16/403 (COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion): 1 patents
C23C16/45527 (COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion): 1 patents
C23C16/56 (COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion): 1 patents
H01L21/02636 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L21/28562 (from a gas or vapour, e.g. condensation): 1 patents
H01J37/32091 (Gas-filled discharge tubes (heating by discharge): 1 patents
H01J37/321 (Gas-filled discharge tubes (heating by discharge): 1 patents
H01J37/32192 (Gas-filled discharge tubes (heating by discharge): 1 patents
H01J2237/332 (ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS (spark-gaps): 1 patents

Companies

File:Kandabara Tapily of Albany NY (US) Top Companies.png

List of Companies

Tokyo Electron Limited: 3 patents

Collaborators

Lior Huli of Albany NY (US) (1 collaborations)
Subhadeep Kal of Albany NY (US) (1 collaborations)
Peng Wang of Albany NY (US) (1 collaborations)
Peter Biolsi of Albany NY (US) (1 collaborations)
Hunter Frost of Albany NY (US) (1 collaborations)
Tek Po Rinus Lee of Albany NY (US) (1 collaborations)

Subcategories

This category has only the following subcategory.

K

► Kandabara Tapily of Albany NY (US)‎ (1 C, 1 P)

@@ Line 2: / Line 2: @@
 === Executive Summary ===
-Kandabara Tapily of Albany NY (US) is an inventor who has filed 6 patents. Their primary areas of innovation include SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (1 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (1 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (1 patents), and they have worked with companies such as Tokyo Electron Limited (6 patents). Their most frequent collaborators include [[Category:Kai-Hung Yu of Albany NY (US)|Kai-Hung Yu of Albany NY (US)]] (2 collaborations), [[Category:Nobuo Matsuki|Nobuo Matsuki]] (2 collaborations), [[Category:Dina Triyoso of Albany NY (US)|Dina Triyoso of Albany NY (US)]] (1 collaborations).
+Kandabara Tapily of Albany NY (US) is an inventor who has filed 3 patents. Their primary areas of innovation include characterised by structural details, e.g. supports, auxiliary layers  (supports for printing plates in general (1 patents), used for diffusion transfer {( (1 patents), {from the gas phase, by plasma deposition  ( (1 patents), and they have worked with companies such as Tokyo Electron Limited (3 patents). Their most frequent collaborators include [[Category:Lior Huli of Albany NY (US)|Lior Huli of Albany NY (US)]] (1 collaborations), [[Category:Subhadeep Kal of Albany NY (US)|Subhadeep Kal of Albany NY (US)]] (1 collaborations), [[Category:Peng Wang of Albany NY (US)|Peng Wang of Albany NY (US)]] (1 collaborations).
 === Patent Filing Activity ===
@@ Line 11: / Line 11: @@
 ==== List of Technology Areas ====
-* [[:Category:CPC_H01L28/40|H01L28/40]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_G03F7/094|G03F7/094]] (characterised by structural details, e.g. supports, auxiliary layers  (supports for printing plates in general): 1 patents
-* [[:Category:CPC_H01L21/02181|H01L21/02181]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_G03F7/075|G03F7/075]] (used for diffusion transfer {(): 1 patents
-* [[:Category:CPC_H01L21/02189|H01L21/02189]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_G03F7/167|G03F7/167]] ({from the gas phase, by plasma deposition  (): 1 patents
-* [[:Category:CPC_H01L21/02194|H01L21/02194]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_G03F7/70033|G03F7/70033]] (PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR;  (phototypographic composing devices): 1 patents
-* [[:Category:CPC_H01L21/0228|H01L21/0228]] ({deposition by cyclic CVD, e.g. ALD, ALE, pulsed CVD}): 1 patents
+* [[:Category:CPC_H01L21/76802|H01L21/76802]] (Applying interconnections to be used for carrying current between separate components within a device {comprising conductors and dielectrics}): 1 patents
-* [[:Category:CPC_H01L21/283|H01L21/283]] (Deposition of conductive or insulating materials for electrodes {conducting electric current}): 1 patents
+* [[:Category:CPC_H01L21/31116|H01L21/31116]] ({by dry-etching}): 1 patents
-* [[:Category:CPC_H01L21/321|H01L21/321]] (After treatment): 1 patents
+* [[:Category:CPC_H01L21/76829|H01L21/76829]] ({characterised by the formation of thin functional dielectric layers, e.g. dielectric etch-stop, barrier, capping or liner layers}): 1 patents
-* [[:Category:CPC_H10B53/00|H10B53/00]] (Ferroelectric RAM [FeRAM] devices comprising ferroelectric memory capacitors): 1 patents
+* [[:Category:CPC_H01L21/7685|H01L21/7685]] ({the layer covering a conductive structure  (): 1 patents
-* [[:Category:CPC_H01L21/32133|H01L21/32133]] ({by chemical means only}): 1 patents
+* [[:Category:CPC_H01L21/76879|H01L21/76879]] ({by selective deposition of conductive material in the vias, e.g. selective C.V.D. on semiconductor material, plating  (plating on semiconductors in general): 1 patents
-* [[:Category:CPC_G03F7/70733|G03F7/70733]] (PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR;  (phototypographic composing devices): 1 patents
+* [[:Category:CPC_H01L21/02315|H01L21/02315]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L21/02164|H01L21/02164]] ({the material being a silicon oxide, e.g. SiO): 1 patents
+* [[:Category:CPC_C23C16/402|C23C16/402]] (COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL  (making metal-coated products by extrusion): 1 patents
-* [[:Category:CPC_H01L21/02263|H01L21/02263]] ({deposition from the gas or vapour phase}): 1 patents
-* [[:Category:CPC_H01L21/02318|H01L21/02318]] ({post-treatment}): 1 patents
-* [[:Category:CPC_H01L21/0337|H01L21/0337]] ({characterised by the process involved to create the mask, e.g. lift-off masks, sidewalls, or to modify the mask, e.g. pre-treatment, post-treatment}): 1 patents
-* [[:Category:CPC_H01L21/32051|H01L21/32051]] (Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers  (manufacture of electrodes): 1 patents
-* [[:Category:CPC_H01L21/32055|H01L21/32055]] (Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers  (manufacture of electrodes): 1 patents
-* [[:Category:CPC_H01L24/80|H01L24/80]] ({Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected}): 1 patents
 * [[:Category:CPC_C23C16/403|C23C16/403]] (COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL  (making metal-coated products by extrusion): 1 patents
-* [[:Category:CPC_C23C16/45536|C23C16/45536]] (COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL  (making metal-coated products by extrusion): 1 patents
+* [[:Category:CPC_C23C16/45527|C23C16/45527]] (COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL  (making metal-coated products by extrusion): 1 patents
 * [[:Category:CPC_C23C16/56|C23C16/56]] (COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL  (making metal-coated products by extrusion): 1 patents
-* [[:Category:CPC_H01L2224/80011|H01L2224/80011]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H01L21/02636|H01L21/02636]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L2224/8002|H01L2224/8002]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H01L21/28562|H01L21/28562]] (from a gas or vapour, e.g. condensation): 1 patents
-* [[:Category:CPC_H01L2224/80236|H01L2224/80236]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H01J37/32091|H01J37/32091]] (Gas-filled discharge tubes  (heating by discharge): 1 patents
-* [[:Category:CPC_H01L2224/80379|H01L2224/80379]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H01J37/321|H01J37/321]] (Gas-filled discharge tubes  (heating by discharge): 1 patents
-* [[:Category:CPC_H01L2224/80895|H01L2224/80895]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H01J37/32192|H01J37/32192]] (Gas-filled discharge tubes  (heating by discharge): 1 patents
-* [[:Category:CPC_H01L2224/80896|H01L2224/80896]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H01J2237/332|H01J2237/332]] (ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS  (spark-gaps): 1 patents
-* [[:Category:CPC_G03F7/167|G03F7/167]] ({from the gas phase, by plasma deposition  (): 1 patents
-* [[:Category:CPC_G03F7/70033|G03F7/70033]] (PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR;  (phototypographic composing devices): 1 patents
-* [[:Category:CPC_H01L21/0273|H01L21/0273]] ({characterised by the treatment of photoresist layers}): 1 patents
-* [[:Category:CPC_H01L21/32136|H01L21/32136]] ({using plasmas}): 1 patents
-* [[:Category:CPC_H01L21/02175|H01L21/02175]] ({characterised by the metal  (): 1 patents
-* [[:Category:CPC_H01L21/02244|H01L21/02244]] ({the layer being a laminate, i.e. composed of sublayers, e.g. stacks of alternating high-k metal oxides  (adhesion layers or buffer layers): 1 patents
-* [[:Category:CPC_H01L21/02252|H01L21/02252]] ({formation by plasma treatment, e.g. plasma oxidation of the substrate  (after treatment of an insulating film by plasma): 1 patents
-* [[:Category:CPC_H01L21/02337|H01L21/02337]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L21/31122|H01L21/31122]] (to form insulating layers thereon, e.g. for masking or by using photolithographic techniques  (encapsulating layers): 1 patents
-* [[:Category:CPC_G03F7/039|G03F7/039]] (Macromolecular compounds which are photodegradable, e.g. positive electron resists  (): 1 patents
-* [[:Category:CPC_C08F230/04|C08F230/04]] (MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS): 1 patents
-* [[:Category:CPC_G03F7/038|G03F7/038]] (Macromolecular compounds which are rendered insoluble or differentially wettable  (): 1 patents
-* [[:Category:CPC_G03F7/168|G03F7/168]] ({Finishing the coated layer, e.g. drying, baking, soaking}): 1 patents
-* [[:Category:CPC_G03F7/2004|G03F7/2004]] (Exposure; Apparatus therefor  (photographic printing apparatus for making copies): 1 patents
-* [[:Category:CPC_H01L21/0274|H01L21/0274]] (Making masks on semiconductor bodies for further photolithographic processing not provided for in group): 1 patents
 === Companies ===
@@ Line 57: / Line 36: @@
 ==== List of Companies ====
-* Tokyo Electron Limited: 6 patents
+* Tokyo Electron Limited: 3 patents
 === Collaborators ===
-* [[:Category:Kai-Hung Yu of Albany NY (US)|Kai-Hung Yu of Albany NY (US)]][[Category:Kai-Hung Yu of Albany NY (US)]] (2 collaborations)
+* [[:Category:Lior Huli of Albany NY (US)|Lior Huli of Albany NY (US)]][[Category:Lior Huli of Albany NY (US)]] (1 collaborations)
-* [[:Category:Nobuo Matsuki|Nobuo Matsuki]][[Category:Nobuo Matsuki]] (2 collaborations)
+* [[:Category:Subhadeep Kal of Albany NY (US)|Subhadeep Kal of Albany NY (US)]][[Category:Subhadeep Kal of Albany NY (US)]] (1 collaborations)
-* [[:Category:Dina Triyoso of Albany NY (US)|Dina Triyoso of Albany NY (US)]][[Category:Dina Triyoso of Albany NY (US)]] (1 collaborations)
+* [[:Category:Peng Wang of Albany NY (US)|Peng Wang of Albany NY (US)]][[Category:Peng Wang of Albany NY (US)]] (1 collaborations)
-* [[:Category:Robert Clark of Albany NY (US)|Robert Clark of Albany NY (US)]][[Category:Robert Clark of Albany NY (US)]] (1 collaborations)
+* [[:Category:Peter Biolsi of Albany NY (US)|Peter Biolsi of Albany NY (US)]][[Category:Peter Biolsi of Albany NY (US)]] (1 collaborations)
-* [[:Category:Tony Schenk|Tony Schenk]][[Category:Tony Schenk]] (1 collaborations)
+* [[:Category:Hunter Frost of Albany NY (US)|Hunter Frost of Albany NY (US)]][[Category:Hunter Frost of Albany NY (US)]] (1 collaborations)
-* [[:Category:Alireza Kashir|Alireza Kashir]][[Category:Alireza Kashir]] (1 collaborations)
+* [[:Category:Tek Po Rinus Lee of Albany NY (US)|Tek Po Rinus Lee of Albany NY (US)]][[Category:Tek Po Rinus Lee of Albany NY (US)]] (1 collaborations)
-* [[:Category:Stefan Ferdinand Mueller|Stefan Ferdinand Mueller]][[Category:Stefan Ferdinand Mueller]] (1 collaborations)
-* [[:Category:Hirokazu Aizawa of Albany NY (US)|Hirokazu Aizawa of Albany NY (US)]][[Category:Hirokazu Aizawa of Albany NY (US)]] (1 collaborations)
-* [[:Category:Nicholas Joy of Albany NY (US)|Nicholas Joy of Albany NY (US)]][[Category:Nicholas Joy of Albany NY (US)]] (1 collaborations)
-* [[:Category:Yusuke Yoshida of Albany NY (US)|Yusuke Yoshida of Albany NY (US)]][[Category:Yusuke Yoshida of Albany NY (US)]] (1 collaborations)
-* [[:Category:Soo Doo Chae of Albany NY (US)|Soo Doo Chae of Albany NY (US)]][[Category:Soo Doo Chae of Albany NY (US)]] (1 collaborations)
-* [[:Category:Satohiko Hoshino of Albany NY (US)|Satohiko Hoshino of Albany NY (US)]][[Category:Satohiko Hoshino of Albany NY (US)]] (1 collaborations)
-* [[:Category:Hojin Kim of Albany NY (US)|Hojin Kim of Albany NY (US)]][[Category:Hojin Kim of Albany NY (US)]] (1 collaborations)
-* [[:Category:Adam Gildea of Albany NY (US)|Adam Gildea of Albany NY (US)]][[Category:Adam Gildea of Albany NY (US)]] (1 collaborations)
-* [[:Category:Hisashi Higuchi|Hisashi Higuchi]][[Category:Hisashi Higuchi]] (1 collaborations)
-* [[:Category:Cory Wajda of Albany NY (US)|Cory Wajda of Albany NY (US)]][[Category:Cory Wajda of Albany NY (US)]] (1 collaborations)
-* [[:Category:Gyanaranjan Pattanaik of Albany NY (US)|Gyanaranjan Pattanaik of Albany NY (US)]][[Category:Gyanaranjan Pattanaik of Albany NY (US)]] (1 collaborations)
-* [[:Category:Gerrit Leusink of Albany NY (US)|Gerrit Leusink of Albany NY (US)]][[Category:Gerrit Leusink of Albany NY (US)]] (1 collaborations)
-* [[:Category:Robert Clark|Robert Clark]][[Category:Robert Clark]] (1 collaborations)
 [[Category:Kandabara Tapily of Albany NY (US)]]
 [[Category:Inventors]]
 [[Category:Inventors filing patents with Tokyo Electron Limited]]