Category:RAJA SWAMINATHAN of AUSTIN TX (US): Difference between revisions

Latest revision as of 08:33, 16 July 2024

RAJA SWAMINATHAN of AUSTIN TX (US)

Executive Summary

RAJA SWAMINATHAN of AUSTIN TX (US) is an inventor who has filed 7 patents. Their primary areas of innovation include No explanation available (3 patents), No explanation available (2 patents), No explanation available (2 patents), and they have worked with companies such as ADVANCED MICRO DEVICES, INC. (7 patents). Their most frequent collaborators include (4 collaborations), (3 collaborations), (1 collaborations).

Patent Filing Activity

File:RAJA SWAMINATHAN of AUSTIN TX (US) Monthly Patent Applications.png

Technology Areas

File:RAJA SWAMINATHAN of AUSTIN TX (US) Top Technology Areas.png

List of Technology Areas

H01L25/0657 (No explanation available): 3 patents
H01L24/80 (No explanation available): 2 patents
H01L24/08 (No explanation available): 2 patents
H01L2224/80895 (No explanation available): 2 patents
H01L2224/80896 (No explanation available): 2 patents
H01L2225/06524 (No explanation available): 2 patents
H01L24/16 (No explanation available): 2 patents
G02B6/4274 (No explanation available): 1 patents
G02B6/4255 (No explanation available): 1 patents
G02B6/425 (No explanation available): 1 patents
G02B6/43 (No explanation available): 1 patents
H01L23/5226 (No explanation available): 1 patents
H01L23/16 (No explanation available): 1 patents
H01L23/528 (No explanation available): 1 patents
H01L23/5384 (No explanation available): 1 patents
H01L21/50 (No explanation available): 1 patents
H01L23/5381 (No explanation available): 1 patents
H01L23/5385 (No explanation available): 1 patents
H01L27/0688 (No explanation available): 1 patents
H01L2224/08145 (No explanation available): 1 patents
H01L2225/06527 (No explanation available): 1 patents
H01L2924/381 (No explanation available): 1 patents
H01L23/49833 (No explanation available): 1 patents
H01L24/32 (No explanation available): 1 patents
H01L24/73 (No explanation available): 1 patents
H01L24/92 (No explanation available): 1 patents
H01L2224/16225 (No explanation available): 1 patents
H01L2224/32225 (No explanation available): 1 patents
H01L2224/73204 (No explanation available): 1 patents
H01L2224/9211 (No explanation available): 1 patents
H01L24/94 (No explanation available): 1 patents
H01L24/97 (No explanation available): 1 patents
H01L25/50 (No explanation available): 1 patents
H01L2224/08146 (No explanation available): 1 patents
H01L2224/16145 (No explanation available): 1 patents
H01L2224/94 (No explanation available): 1 patents
H01L2224/97 (No explanation available): 1 patents
H01L2225/06517 (No explanation available): 1 patents
H01L2225/06544 (No explanation available): 1 patents
H01L2924/1205 (No explanation available): 1 patents
H01L2924/1206 (No explanation available): 1 patents
H01L2924/1432 (No explanation available): 1 patents
H01L2924/37001 (No explanation available): 1 patents
H01L21/486 (No explanation available): 1 patents
H01L23/49822 (No explanation available): 1 patents
H01L21/4857 (No explanation available): 1 patents
H01L23/49838 (No explanation available): 1 patents
H01L23/49894 (No explanation available): 1 patents
H01L21/6835 (No explanation available): 1 patents

Companies

File:RAJA SWAMINATHAN of AUSTIN TX (US) Top Companies.png

List of Companies

ADVANCED MICRO DEVICES, INC.: 7 patents

Collaborators

RAHUL AGARWAL of LIVERMORE CA (US) (4 collaborations)
GABRIEL H. LOH of BELLEVUE WA (US) (3 collaborations)
BRETT P. WILKERSON of AUSTIN TX (US) (1 collaborations)
KONG TOON NG (1 collaborations)
MICHAEL S. ALFANO of AUSTIN TX (US) (1 collaborations)
ALAN D. SMITH of AUSTIN TX (US) (1 collaborations)
GABRIEL WONG (1 collaborations)
MICHAEL MANTOR of ORLANDO FL (US) (1 collaborations)
CHANDRA SEKHAR MANDALAPU of AUSTIN TX (US) (1 collaborations)
ERIC J. CHAPMAN of AUSTIN TX (US) (1 collaborations)
CHINTAN BUCH of SANTA CLARA CA (US) (1 collaborations)
SRI RANGA SAI BOYAPATI of AUSTIN TX (US) (1 collaborations)
DEEPAK VASANT KULKARNI of AUSTIN TX (US) (1 collaborations)

Subcategories

This category has only the following subcategory.

R

► RAJA SWAMINATHAN of AUSTIN TX (US)‎ (1 C)

@@ Line 2: / Line 2: @@
 === Executive Summary ===
-RAJA SWAMINATHAN of AUSTIN TX (US) is an inventor who has filed 7 patents. Their primary areas of innovation include SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (3 patents), {Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected} (2 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (2 patents), and they have worked with companies such as ADVANCED MICRO DEVICES, INC. (7 patents). Their most frequent collaborators include [[Category:RAHUL AGARWAL of LIVERMORE CA (US)|RAHUL AGARWAL of LIVERMORE CA (US)]] (4 collaborations), [[Category:GABRIEL H. LOH of BELLEVUE WA (US)|GABRIEL H. LOH of BELLEVUE WA (US)]] (3 collaborations), [[Category:BRETT P. WILKERSON of AUSTIN TX (US)|BRETT P. WILKERSON of AUSTIN TX (US)]] (1 collaborations).
+RAJA SWAMINATHAN of AUSTIN TX (US) is an inventor who has filed 7 patents. Their primary areas of innovation include No explanation available (3 patents), No explanation available (2 patents), No explanation available (2 patents), and they have worked with companies such as ADVANCED MICRO DEVICES, INC. (7 patents). Their most frequent collaborators include [[Category:RAHUL AGARWAL of LIVERMORE CA (US)|RAHUL AGARWAL of LIVERMORE CA (US)]] (4 collaborations), [[Category:GABRIEL H. LOH of BELLEVUE WA (US)|GABRIEL H. LOH of BELLEVUE WA (US)]] (3 collaborations), [[Category:BRETT P. WILKERSON of AUSTIN TX (US)|BRETT P. WILKERSON of AUSTIN TX (US)]] (1 collaborations).
 === Patent Filing Activity ===
@@ Line 11: / Line 11: @@
 ==== List of Technology Areas ====
-* [[:Category:CPC_H01L25/0657|H01L25/0657]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
+* [[:Category:CPC_H01L25/0657|H01L25/0657]] (No explanation available): 3 patents
-* [[:Category:CPC_H01L24/80|H01L24/80]] ({Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected}): 2 patents
+* [[:Category:CPC_H01L24/80|H01L24/80]] (No explanation available): 2 patents
-* [[:Category:CPC_H01L24/08|H01L24/08]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
+* [[:Category:CPC_H01L24/08|H01L24/08]] (No explanation available): 2 patents
-* [[:Category:CPC_H01L2224/80895|H01L2224/80895]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
+* [[:Category:CPC_H01L2224/80895|H01L2224/80895]] (No explanation available): 2 patents
-* [[:Category:CPC_H01L2224/80896|H01L2224/80896]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
+* [[:Category:CPC_H01L2224/80896|H01L2224/80896]] (No explanation available): 2 patents
-* [[:Category:CPC_H01L2225/06524|H01L2225/06524]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
+* [[:Category:CPC_H01L2225/06524|H01L2225/06524]] (No explanation available): 2 patents
-* [[:Category:CPC_H01L24/16|H01L24/16]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
+* [[:Category:CPC_H01L24/16|H01L24/16]] (No explanation available): 2 patents
-* [[:Category:CPC_G02B6/4274|G02B6/4274]] (Coupling light guides with opto-electronic elements): 1 patents
+* [[:Category:CPC_G02B6/4274|G02B6/4274]] (No explanation available): 1 patents
-* [[:Category:CPC_G02B6/4255|G02B6/4255]] (Coupling light guides with opto-electronic elements): 1 patents
+* [[:Category:CPC_G02B6/4255|G02B6/4255]] (No explanation available): 1 patents
-* [[:Category:CPC_G02B6/425|G02B6/425]] (Coupling light guides with opto-electronic elements): 1 patents
+* [[:Category:CPC_G02B6/425|G02B6/425]] (No explanation available): 1 patents
-* [[:Category:CPC_G02B6/43|G02B6/43]] (Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections): 1 patents
+* [[:Category:CPC_G02B6/43|G02B6/43]] (No explanation available): 1 patents
-* [[:Category:CPC_H01L23/5226|H01L23/5226]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H01L23/5226|H01L23/5226]] (No explanation available): 1 patents
-* [[:Category:CPC_H01L23/16|H01L23/16]] (Fillings or auxiliary members in containers {or encapsulations}, e.g. centering rings  (): 1 patents
+* [[:Category:CPC_H01L23/16|H01L23/16]] (No explanation available): 1 patents
-* [[:Category:CPC_H01L23/528|H01L23/528]] ({Geometry or} layout of the interconnection structure {(): 1 patents
+* [[:Category:CPC_H01L23/528|H01L23/528]] (No explanation available): 1 patents
-* [[:Category:CPC_H01L23/5384|H01L23/5384]] ({Conductive vias through the substrate with or without pins, e.g. buried coaxial conductors  (): 1 patents
+* [[:Category:CPC_H01L23/5384|H01L23/5384]] (No explanation available): 1 patents
-* [[:Category:CPC_H01L21/50|H01L21/50]] (Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups): 1 patents
+* [[:Category:CPC_H01L21/50|H01L21/50]] (No explanation available): 1 patents
-* [[:Category:CPC_H01L23/5381|H01L23/5381]] (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates  ({): 1 patents
+* [[:Category:CPC_H01L23/5381|H01L23/5381]] (No explanation available): 1 patents
-* [[:Category:CPC_H01L23/5385|H01L23/5385]] (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates  ({): 1 patents
+* [[:Category:CPC_H01L23/5385|H01L23/5385]] (No explanation available): 1 patents
-* [[:Category:CPC_H01L27/0688|H01L27/0688]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H01L27/0688|H01L27/0688]] (No explanation available): 1 patents
-* [[:Category:CPC_H01L2224/08145|H01L2224/08145]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H01L2224/08145|H01L2224/08145]] (No explanation available): 1 patents
-* [[:Category:CPC_H01L2225/06527|H01L2225/06527]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H01L2225/06527|H01L2225/06527]] (No explanation available): 1 patents
-* [[:Category:CPC_H01L2924/381|H01L2924/381]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H01L2924/381|H01L2924/381]] (No explanation available): 1 patents
-* [[:Category:CPC_H01L23/49833|H01L23/49833]] (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers  (shape of the substrate): 1 patents
+* [[:Category:CPC_H01L23/49833|H01L23/49833]] (No explanation available): 1 patents
-* [[:Category:CPC_H01L24/32|H01L24/32]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H01L24/32|H01L24/32]] (No explanation available): 1 patents
-* [[:Category:CPC_H01L24/73|H01L24/73]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H01L24/73|H01L24/73]] (No explanation available): 1 patents
-* [[:Category:CPC_H01L24/92|H01L24/92]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H01L24/92|H01L24/92]] (No explanation available): 1 patents
-* [[:Category:CPC_H01L2224/16225|H01L2224/16225]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H01L2224/16225|H01L2224/16225]] (No explanation available): 1 patents
-* [[:Category:CPC_H01L2224/32225|H01L2224/32225]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H01L2224/32225|H01L2224/32225]] (No explanation available): 1 patents
-* [[:Category:CPC_H01L2224/73204|H01L2224/73204]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H01L2224/73204|H01L2224/73204]] (No explanation available): 1 patents
-* [[:Category:CPC_H01L2224/9211|H01L2224/9211]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H01L2224/9211|H01L2224/9211]] (No explanation available): 1 patents
-* [[:Category:CPC_H01L24/94|H01L24/94]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H01L24/94|H01L24/94]] (No explanation available): 1 patents
-* [[:Category:CPC_H01L24/97|H01L24/97]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H01L24/97|H01L24/97]] (No explanation available): 1 patents
-* [[:Category:CPC_H01L25/50|H01L25/50]] ({Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group): 1 patents
+* [[:Category:CPC_H01L25/50|H01L25/50]] (No explanation available): 1 patents
-* [[:Category:CPC_H01L2224/08146|H01L2224/08146]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H01L2224/08146|H01L2224/08146]] (No explanation available): 1 patents
-* [[:Category:CPC_H01L2224/16145|H01L2224/16145]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H01L2224/16145|H01L2224/16145]] (No explanation available): 1 patents
-* [[:Category:CPC_H01L2224/94|H01L2224/94]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H01L2224/94|H01L2224/94]] (No explanation available): 1 patents
-* [[:Category:CPC_H01L2224/97|H01L2224/97]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H01L2224/97|H01L2224/97]] (No explanation available): 1 patents
-* [[:Category:CPC_H01L2225/06517|H01L2225/06517]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H01L2225/06517|H01L2225/06517]] (No explanation available): 1 patents
-* [[:Category:CPC_H01L2225/06544|H01L2225/06544]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H01L2225/06544|H01L2225/06544]] (No explanation available): 1 patents
-* [[:Category:CPC_H01L2924/1205|H01L2924/1205]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H01L2924/1205|H01L2924/1205]] (No explanation available): 1 patents
-* [[:Category:CPC_H01L2924/1206|H01L2924/1206]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H01L2924/1206|H01L2924/1206]] (No explanation available): 1 patents
-* [[:Category:CPC_H01L2924/1432|H01L2924/1432]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H01L2924/1432|H01L2924/1432]] (No explanation available): 1 patents
-* [[:Category:CPC_H01L2924/37001|H01L2924/37001]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H01L2924/37001|H01L2924/37001]] (No explanation available): 1 patents
-* [[:Category:CPC_H01L21/486|H01L21/486]] (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 1 patents
+* [[:Category:CPC_H01L21/486|H01L21/486]] (No explanation available): 1 patents
-* [[:Category:CPC_H01L23/49822|H01L23/49822]] ({Multilayer substrates  (multilayer metallisation on monolayer substrate): 1 patents
+* [[:Category:CPC_H01L23/49822|H01L23/49822]] (No explanation available): 1 patents
-* [[:Category:CPC_H01L21/4857|H01L21/4857]] (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 1 patents
+* [[:Category:CPC_H01L21/4857|H01L21/4857]] (No explanation available): 1 patents
-* [[:Category:CPC_H01L23/49838|H01L23/49838]] (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers  (shape of the substrate): 1 patents
+* [[:Category:CPC_H01L23/49838|H01L23/49838]] (No explanation available): 1 patents
-* [[:Category:CPC_H01L23/49894|H01L23/49894]] (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers  (shape of the substrate): 1 patents
+* [[:Category:CPC_H01L23/49894|H01L23/49894]] (No explanation available): 1 patents
-* [[:Category:CPC_H01L21/6835|H01L21/6835]] ({using temporarily an auxiliary support}): 1 patents
+* [[:Category:CPC_H01L21/6835|H01L21/6835]] (No explanation available): 1 patents
 === Companies ===