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Category:JHIH-WEI LAI: Difference between revisions

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=== Executive Summary ===
=== Executive Summary ===
JHIH-WEI LAI is an inventor who has filed 2 patents. Their primary areas of innovation include Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups (1 patents), Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups (1 patents), Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups (1 patents), and they have worked with companies such as TONG HSING ELECTRONIC INDUSTRIES, LTD. (2 patents). Their most frequent collaborators include [[Category:DEI-CHENG LIU|DEI-CHENG LIU]] (2 collaborations), [[Category:CHIA-SHUAI CHANG|CHIA-SHUAI CHANG]] (1 collaborations), [[Category:MING-YEN PAN|MING-YEN PAN]] (1 collaborations).
JHIH-WEI LAI is an inventor who has filed 3 patents. Their primary areas of innovation include based on aluminium nitride (1 patents), {obtaining ceramic films, e.g. by using temporary supports} (1 patents), {Milling} (1 patents), and they have worked with companies such as TONG HSING ELECTRONIC INDUSTRIES, LTD. (3 patents). Their most frequent collaborators include [[Category:SHIH-HAN WU|SHIH-HAN WU]] (3 collaborations), [[Category:JIAN-YU SHIH|JIAN-YU SHIH]] (3 collaborations), [[Category:MING-YEN PAN|MING-YEN PAN]] (2 collaborations).


=== Patent Filing Activity ===
=== Patent Filing Activity ===
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==== List of Technology Areas ====
==== List of Technology Areas ====
* [[:Category:CPC_H01L21/481|H01L21/481]] (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 1 patents
* [[:Category:CPC_C04B35/581|C04B35/581]] (based on aluminium nitride): 1 patents
* [[:Category:CPC_H01L21/486|H01L21/486]] (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 1 patents
* [[:Category:CPC_C04B35/62218|C04B35/62218]] ({obtaining ceramic films, e.g. by using temporary supports}): 1 patents
* [[:Category:CPC_H01L21/50|H01L21/50]] (Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups): 1 patents
* [[:Category:CPC_C04B35/6261|C04B35/6261]] ({Milling}): 1 patents
* [[:Category:CPC_H01L27/14618|H01L27/14618]] ({Containers}): 1 patents
* [[:Category:CPC_C04B35/638|C04B35/638]] (Removal thereof): 1 patents
* [[:Category:CPC_H01L33/486|H01L33/486]] ({adapted for surface mounting}): 1 patents
* [[:Category:CPC_C04B35/64|C04B35/64]] (Burning or sintering processes (): 1 patents
* [[:Category:CPC_H01L33/60|H01L33/60]] (Reflective elements): 1 patents
* [[:Category:CPC_C04B2235/3225|C04B2235/3225]] (Yttrium oxide or oxide-forming salts thereof): 1 patents
* [[:Category:CPC_H01L33/62|H01L33/62]] (Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls): 1 patents
* [[:Category:CPC_C04B2235/386|C04B2235/386]] (Boron nitrides): 1 patents
* [[:Category:CPC_H01L2933/0058|H01L2933/0058]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_C04B2235/3865|C04B2235/3865]] (Aluminium nitrides): 1 patents
* [[:Category:CPC_H01L2933/0066|H01L2933/0066]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_C04B2235/528|C04B2235/528]] (Spheres): 1 patents
* [[:Category:CPC_H01L23/5384|H01L23/5384]] ({Conductive vias through the substrate with or without pins, e.g. buried coaxial conductors  (): 1 patents
* [[:Category:CPC_C04B2235/5292|C04B2235/5292]] (Flakes, platelets or plates): 1 patents
* [[:Category:CPC_H01L23/5386|H01L23/5386]] (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates  ({): 1 patents
* [[:Category:CPC_C04B2235/5436|C04B2235/5436]] (micrometer sized, i.e. from 1 to 100 micron): 1 patents
* [[:Category:CPC_H01L23/552|H01L23/552]] (Protection against radiation, e.g. light {or electromagnetic waves}): 1 patents
* [[:Category:CPC_C04B2235/5445|C04B2235/5445]] (submicron sized, i.e. from 0,1 to 1 micron): 1 patents
* [[:Category:CPC_H01L24/16|H01L24/16]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_C04B2235/5454|C04B2235/5454]] (nanometer sized, i.e. below 100 nm): 1 patents
* [[:Category:CPC_H01L25/13|H01L25/13]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_C04B2235/6025|C04B2235/6025]] (Tape casting, e.g. with a doctor blade): 1 patents
* [[:Category:CPC_H01L2224/16227|H01L2224/16227]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_C04B2235/604|C04B2235/604]] (Pressing at temperatures other than sintering temperatures): 1 patents
* [[:Category:CPC_C04B2235/612|C04B2235/612]] (Machining): 1 patents
* [[:Category:CPC_C04B2235/6581|C04B2235/6581]] (Total pressure below 1 atmosphere, e.g. vacuum): 1 patents
* [[:Category:CPC_C04B2235/667|C04B2235/667]] (Sintering using wave energy, e.g. microwave sintering): 1 patents
* [[:Category:CPC_C04B2235/668|C04B2235/668]] (Pressureless sintering): 1 patents
* [[:Category:CPC_C04B2235/78|C04B2235/78]] (Grain sizes and shapes, product microstructures, e.g. acicular grains, equiaxed grains, platelet-structures): 1 patents
* [[:Category:CPC_H05K3/12|H05K3/12]] (using {thick film techniques, e.g.} printing techniques to apply the conductive material {or similar techniques for applying conductive paste or ink patterns}): 1 patents
* [[:Category:CPC_H05K1/18|H05K1/18]] (Printed circuits structurally associated with non-printed electric components  ({): 1 patents
* [[:Category:CPC_H05K2201/10984|H05K2201/10984]] (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
* [[:Category:CPC_H10H20/857|H10H20/857]] (No explanation available): 1 patents
* [[:Category:CPC_H10H20/853|H10H20/853]] (No explanation available): 1 patents
* [[:Category:CPC_H10H20/0362|H10H20/0362]] (No explanation available): 1 patents
* [[:Category:CPC_H10H20/0364|H10H20/0364]] (No explanation available): 1 patents


=== Companies ===
=== Companies ===
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==== List of Companies ====
==== List of Companies ====
* TONG HSING ELECTRONIC INDUSTRIES, LTD.: 2 patents
* TONG HSING ELECTRONIC INDUSTRIES, LTD.: 3 patents


=== Collaborators ===
=== Collaborators ===
* [[:Category:DEI-CHENG LIU|DEI-CHENG LIU]][[Category:DEI-CHENG LIU]] (2 collaborations)
* [[:Category:SHIH-HAN WU|SHIH-HAN WU]][[Category:SHIH-HAN WU]] (3 collaborations)
* [[:Category:CHIA-SHUAI CHANG|CHIA-SHUAI CHANG]][[Category:CHIA-SHUAI CHANG]] (1 collaborations)
* [[:Category:JIAN-YU SHIH|JIAN-YU SHIH]][[Category:JIAN-YU SHIH]] (3 collaborations)
* [[:Category:MING-YEN PAN|MING-YEN PAN]][[Category:MING-YEN PAN]] (1 collaborations)
* [[:Category:MING-YEN PAN|MING-YEN PAN]][[Category:MING-YEN PAN]] (2 collaborations)
* [[:Category:JIAN-YU SHIH|JIAN-YU SHIH]][[Category:JIAN-YU SHIH]] (1 collaborations)
* [[:Category:KAI-MOU CHOU|KAI-MOU CHOU]][[Category:KAI-MOU CHOU]] (1 collaborations)
* [[:Category:SHIH-HAN WU|SHIH-HAN WU]][[Category:SHIH-HAN WU]] (1 collaborations)
* [[:Category:YU-HSIEN LIAO|YU-HSIEN LIAO]][[Category:YU-HSIEN LIAO]] (1 collaborations)
* [[:Category:HAO-EN HUNG|HAO-EN HUNG]][[Category:HAO-EN HUNG]] (1 collaborations)


[[Category:JHIH-WEI LAI]]
[[Category:JHIH-WEI LAI]]
[[Category:Inventors]]
[[Category:Inventors]]
[[Category:Inventors filing patents with TONG HSING ELECTRONIC INDUSTRIES, LTD.]]
[[Category:Inventors filing patents with TONG HSING ELECTRONIC INDUSTRIES, LTD.]]

Latest revision as of 03:08, 2 April 2025

JHIH-WEI LAI

Executive Summary

JHIH-WEI LAI is an inventor who has filed 3 patents. Their primary areas of innovation include based on aluminium nitride (1 patents), {obtaining ceramic films, e.g. by using temporary supports} (1 patents), {Milling} (1 patents), and they have worked with companies such as TONG HSING ELECTRONIC INDUSTRIES, LTD. (3 patents). Their most frequent collaborators include (3 collaborations), (3 collaborations), (2 collaborations).

Patent Filing Activity

File:JHIH-WEI LAI Monthly Patent Applications.png

Technology Areas

File:JHIH-WEI LAI Top Technology Areas.png

List of Technology Areas

  • C04B35/581 (based on aluminium nitride): 1 patents
  • C04B35/62218 ({obtaining ceramic films, e.g. by using temporary supports}): 1 patents
  • C04B35/6261 ({Milling}): 1 patents
  • C04B35/638 (Removal thereof): 1 patents
  • C04B35/64 (Burning or sintering processes (): 1 patents
  • C04B2235/3225 (Yttrium oxide or oxide-forming salts thereof): 1 patents
  • C04B2235/386 (Boron nitrides): 1 patents
  • C04B2235/3865 (Aluminium nitrides): 1 patents
  • C04B2235/528 (Spheres): 1 patents
  • C04B2235/5292 (Flakes, platelets or plates): 1 patents
  • C04B2235/5436 (micrometer sized, i.e. from 1 to 100 micron): 1 patents
  • C04B2235/5445 (submicron sized, i.e. from 0,1 to 1 micron): 1 patents
  • C04B2235/5454 (nanometer sized, i.e. below 100 nm): 1 patents
  • C04B2235/6025 (Tape casting, e.g. with a doctor blade): 1 patents
  • C04B2235/604 (Pressing at temperatures other than sintering temperatures): 1 patents
  • C04B2235/612 (Machining): 1 patents
  • C04B2235/6581 (Total pressure below 1 atmosphere, e.g. vacuum): 1 patents
  • C04B2235/667 (Sintering using wave energy, e.g. microwave sintering): 1 patents
  • C04B2235/668 (Pressureless sintering): 1 patents
  • C04B2235/78 (Grain sizes and shapes, product microstructures, e.g. acicular grains, equiaxed grains, platelet-structures): 1 patents
  • H05K3/12 (using {thick film techniques, e.g.} printing techniques to apply the conductive material {or similar techniques for applying conductive paste or ink patterns}): 1 patents
  • H05K1/18 (Printed circuits structurally associated with non-printed electric components ({): 1 patents
  • H05K2201/10984 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
  • H10H20/857 (No explanation available): 1 patents
  • H10H20/853 (No explanation available): 1 patents
  • H10H20/0362 (No explanation available): 1 patents
  • H10H20/0364 (No explanation available): 1 patents

Companies

File:JHIH-WEI LAI Top Companies.png

List of Companies

  • TONG HSING ELECTRONIC INDUSTRIES, LTD.: 3 patents

Collaborators

Subcategories

This category has the following 7 subcategories, out of 7 total.

C

D

J

K

M

S

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