Category:Kohei SEYAMA: Difference between revisions

Latest revision as of 07:53, 30 March 2025

Kohei SEYAMA

Executive Summary

Kohei SEYAMA is an inventor who has filed 1 patents. Their primary areas of innovation include {Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates} (1 patents), {using an image reference approach} (1 patents), Subject of image; Context of image processing (1 patents), and they have worked with companies such as SHINKAWA LTD. (1 patents). Their most frequent collaborators include .

Patent Filing Activity

File:Kohei SEYAMA Monthly Patent Applications.png

Technology Areas

File:Kohei SEYAMA Top Technology Areas.png

List of Technology Areas

H01L21/67144 ({Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates}): 1 patents
G06T7/001 ({using an image reference approach}): 1 patents
G06T2207/30148 (Subject of image; Context of image processing): 1 patents

Companies

File:Kohei SEYAMA Top Companies.png

List of Companies

SHINKAWA LTD.: 1 patents

Collaborators

Subcategories

This category has only the following subcategory.

K

► Kohei SEYAMA‎ (1 C)

@@ Line 2: / Line 2: @@
 === Executive Summary ===
-Kohei SEYAMA is an inventor who has filed 2 patents. Their primary areas of innovation include SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (1 patents), Soldering, e.g. brazing, or unsoldering  ( (1 patents), SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM  (making metal-coated products by extruding metal (1 patents), and they have worked with companies such as SHINKAWA LTD. (2 patents). Their most frequent collaborators include .
+Kohei SEYAMA is an inventor who has filed 1 patents. Their primary areas of innovation include {Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates} (1 patents), {using an image reference approach} (1 patents), Subject of image; Context of image processing (1 patents), and they have worked with companies such as SHINKAWA LTD. (1 patents). Their most frequent collaborators include .
 === Patent Filing Activity ===
@@ Line 11: / Line 11: @@
 ==== List of Technology Areas ====
-* [[:Category:CPC_H01L24/75|H01L24/75]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_B23K1/0016|B23K1/0016]] (Soldering, e.g. brazing, or unsoldering  (): 1 patents
-* [[:Category:CPC_B23K3/087|B23K3/087]] (SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM  (making metal-coated products by extruding metal): 1 patents
-* [[:Category:CPC_H01L2224/75984|H01L2224/75984]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L2224/75744|H01L2224/75744]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L2224/75755|H01L2224/75755]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L2224/7598|H01L2224/7598]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_B23K2101/40|B23K2101/40]] (SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM  (making metal-coated products by extruding metal): 1 patents
-* [[:Category:CPC_H01L21/681|H01L21/681]] (for positioning, orientation or alignment): 1 patents
 * [[:Category:CPC_H01L21/67144|H01L21/67144]] ({Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates}): 1 patents
-* [[:Category:CPC_H01L21/67248|H01L21/67248]] (Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components {; Apparatus not specifically provided for elsewhere  (processes per se): 1 patents
+* [[:Category:CPC_G06T7/001|G06T7/001]] ({using an image reference approach}): 1 patents
+* [[:Category:CPC_G06T2207/30148|G06T2207/30148]] (Subject of image; Context of image processing): 1 patents
 === Companies ===
@@ Line 27: / Line 19: @@
 ==== List of Companies ====
-* SHINKAWA LTD.: 2 patents
+* SHINKAWA LTD.: 1 patents
 === Collaborators ===