Category:Chen-Hua Yu: Difference between revisions

Chen-Hua Yu

Executive Summary

Chen-Hua Yu is an inventor who has filed 15 patents. Their primary areas of innovation include SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (3 patents), Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups (3 patents), Coupling light guides with opto-electronic elements (2 patents), and they have worked with companies such as Taiwan Semiconductor Manufacturing Co., Ltd. (15 patents). Their most frequent collaborators include (4 collaborations), (3 collaborations), (3 collaborations).

Patent Filing Activity

File:Chen-Hua Yu Monthly Patent Applications.png

Technology Areas

File:Chen-Hua Yu Top Technology Areas.png

List of Technology Areas

• H01L24/08 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
• H01L21/4853 (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 3 patents
• G02B6/4204 (Coupling light guides with opto-electronic elements): 2 patents
• H01L21/4857 (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 2 patents
• H01L24/05 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L25/0657 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L2224/08145 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• G02B6/12004 (of the integrated circuit kind (electric integrated circuits): 2 patents
• H01L21/486 (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 2 patents
• H01L21/56 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L23/3128 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L23/49816 (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate): 2 patents
• H01L23/5389 (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({): 2 patents
• H01L24/14 ({of a plurality of bump connectors}): 2 patents
• H01L24/19 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L23/5386 (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({): 2 patents
• H01L2924/1437 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• G02B6/428 (Coupling light guides with opto-electronic elements): 1 patents
• G02B6/4283 (Coupling light guides with opto-electronic elements): 1 patents
• G02B6/4293 (Coupling light guides with opto-electronic elements): 1 patents
• H01L33/0095 ({Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination}): 1 patents
• G02B6/30 (OPTICAL ELEMENTS, SYSTEMS OR APPARATUS): 1 patents
• G02B6/32 (OPTICAL ELEMENTS, SYSTEMS OR APPARATUS): 1 patents
• G02B6/423 (Coupling light guides with opto-electronic elements): 1 patents
• G02B6/4274 (Coupling light guides with opto-electronic elements): 1 patents
• H01L24/29 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/27 ({Manufacturing methods}): 1 patents
• H01L24/32 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/80 ({Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected}): 1 patents
• H01L24/83 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L25/16 (the devices being of types provided for in two or more different main groups of groups): 1 patents
• H01L25/50 ({Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group): 1 patents
• H01L24/73 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05572 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05624 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05647 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/27845 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/29082 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/29083 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/29187 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/29188 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/73253 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/80009 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/8001 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/80357 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/80379 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/80896 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/8301 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/83896 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2225/06541 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/05432 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/05442 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/059 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• G02B6/4214 (Coupling light guides with opto-electronic elements): 1 patents
• G02B6/13 (OPTICAL ELEMENTS, SYSTEMS OR APPARATUS): 1 patents
• G02B2006/12102 (OPTICAL ELEMENTS, SYSTEMS OR APPARATUS): 1 patents
• G02B2006/12104 (OPTICAL ELEMENTS, SYSTEMS OR APPARATUS): 1 patents
• H01L24/13 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/02065 ({during, before or after processing of insulating layers}): 1 patents
• H01L21/7684 (Applying interconnections to be used for carrying current between separate components within a device {comprising conductors and dielectrics}): 1 patents
• H01L21/76895 (Applying interconnections to be used for carrying current between separate components within a device {comprising conductors and dielectrics}): 1 patents
• H01L24/02 ({Bonding areas (on insulating substrates, e.g. chip carriers,): 1 patents
• H01L2224/02333 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/11849 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• G02B6/29338 (with wavelength selective means): 1 patents
• G02B6/12007 (of the integrated circuit kind (electric integrated circuits): 1 patents
• H01L21/76254 (Dielectric regions {, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers}): 1 patents
• H01L21/26506 (producing ion implantation): 1 patents
• H01L21/268 (Bombardment with radiation {(): 1 patents
• H01L23/3114 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/561 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/49827 ({Via connections through the substrates, e.g. pins going through the substrate, coaxial cables (): 1 patents
• H01L24/46 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/96 ({the devices being encapsulated in a common layer, e.g. neo-wafer or pseudo-wafer, said common layer being separable into individual assemblies after connecting}): 1 patents
• H01L23/645 ({Inductive arrangements (): 1 patents
• H01L21/565 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/568 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/6835 ({using temporarily an auxiliary support}): 1 patents
• H01L23/5383 ({Multilayer substrates (): 1 patents
• H01L24/20 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2221/68372 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/214 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/1903 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/19042 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/19103 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/481 (Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements {; Selection of materials therefor}): 1 patents
• H01L25/167 (the devices being of types provided for in two or more different main groups of groups): 1 patents
• H10D1/68 (No explanation available): 1 patents
• G02B2006/12061 (OPTICAL ELEMENTS, SYSTEMS OR APPARATUS): 1 patents
• G02B2006/12121 (OPTICAL ELEMENTS, SYSTEMS OR APPARATUS): 1 patents
• H01L21/76877 ({Thin films associated with contacts of capacitors}): 1 patents
• H01L23/53209 ({based on metals, e.g. alloys, metal silicides (): 1 patents
• H01L2224/0812 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/085 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/80894 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/5384 ({Conductive vias through the substrate with or without pins, e.g. buried coaxial conductors (): 1 patents
• H01L23/5385 (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({): 1 patents
• H01L24/95 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• G02F1/3551 (Non-linear optics): 1 patents
• G02F1/3501 ({Constructional details or arrangements of non-linear optical devices, e.g. shape of non-linear crystals}): 1 patents
• G02F2201/12 (OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS): 1 patents
• G02F2202/20 (OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS): 1 patents
• G02F2203/50 (OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS): 1 patents
• G01J1/0437 (Optical or mechanical part {supplementary adjustable parts}): 1 patents
• G01J1/0433 (Optical or mechanical part {supplementary adjustable parts}): 1 patents

Companies

File:Chen-Hua Yu Top Companies.png

List of Companies

• Taiwan Semiconductor Manufacturing Co., Ltd.: 15 patents

Collaborators

• Tung-Liang Shao (4 collaborations)
• Hsing-Kuo Hsia (3 collaborations)
• Jiun Yi Wu (3 collaborations)
• Hua-Kung Chiu (2 collaborations)
• Jui Lin Chao (2 collaborations)
• Chao-Jen Wang (2 collaborations)
• Szu-Wei Lu (2 collaborations)
• Tsung-Fu Tsai (2 collaborations)
• Yu-Sheng Huang (2 collaborations)
• Chieh-Yen Chen (2 collaborations)
• Chung-Shi Liu (2 collaborations)
• Chih-Wei Tseng (1 collaborations)
• Yi-Jan Lin (1 collaborations)
• Chih-Hao Yu (1 collaborations)
• Ren-Fen Tsui (1 collaborations)
• Chien-Hsun Lee (1 collaborations)
• Kuo Lung Pan (1 collaborations)
• Tin-Hao Kuo (1 collaborations)
• Hao-Yi Tsai (1 collaborations)
• Chung-Hao Tsai (1 collaborations)
• Chuei-Tang Wang (1 collaborations)
• Wei Ling Chang (1 collaborations)
• Su-Chun Yang (1 collaborations)
• Chen Chiang Yu (1 collaborations)
• Jui Hsuan Tsai (1 collaborations)
• Jih-Churng Twu (1 collaborations)
• Jia-Hong Wu (1 collaborations)