Category:Hai-Hung Wen: Difference between revisions
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=== Executive Summary === | === Executive Summary === | ||
Hai-Hung Wen is an inventor who has filed | Hai-Hung Wen is an inventor who has filed 3 patents. Their primary areas of innovation include Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means {(combinations of transducers with horns, i.e. front-loaded horns (2 patents), Microstructural systems; {Auxiliary parts of microstructural devices or systems} (2 patents), {Arrangements for fixing loudspeaker transducers, e.g. in a box, furniture} (2 patents), and they have worked with companies such as xMEMS Labs, Inc. (3 patents). Their most frequent collaborators include [[Category:Chao-Yu Chen|Chao-Yu Chen]] (3 collaborations), [[Category:Wen-Chien Chen|Wen-Chien Chen]] (3 collaborations), [[Category:Chiung C. Lo of San Jose CA (US)|Chiung C. Lo of San Jose CA (US)]] (3 collaborations). | ||
=== Patent Filing Activity === | === Patent Filing Activity === | ||
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==== List of Technology Areas ==== | ==== List of Technology Areas ==== | ||
* [[:Category:CPC_H04R1/2811|H04R1/2811]] (Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means {(combinations of transducers with horns, i.e. front-loaded horns): 2 patents | |||
* [[:Category:CPC_B81B7/0061|B81B7/0061]] (Microstructural systems; {Auxiliary parts of microstructural devices or systems}): 2 patents | |||
* [[:Category:CPC_H04R1/025|H04R1/025]] ({Arrangements for fixing loudspeaker transducers, e.g. in a box, furniture}): 2 patents | |||
* [[:Category:CPC_B81B2201/0257|B81B2201/0257]] (MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES (piezoelectric, electrostrictive or magnetostrictive elements per se): 2 patents | |||
* [[:Category:CPC_B81B2203/0127|B81B2203/0127]] (MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES (piezoelectric, electrostrictive or magnetostrictive elements per se): 2 patents | |||
* [[:Category:CPC_H04R2201/003|H04R2201/003]] (Mems transducers or their use (of the electrostatic type): 2 patents | |||
* [[:Category:CPC_B81B2203/0307|B81B2203/0307]] (MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES (piezoelectric, electrostrictive or magnetostrictive elements per se): 2 patents | |||
* [[:Category:CPC_H04R7/04|H04R7/04]] (Plane diaphragms): 1 patents | |||
* [[:Category:CPC_H04R19/00|H04R19/00]] (Electrostatic transducers): 1 patents | |||
* [[:Category:CPC_H04R7/06|H04R7/06]] (LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS (generating mechanical vibrations in general): 1 patents | * [[:Category:CPC_H04R7/06|H04R7/06]] (LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS (generating mechanical vibrations in general): 1 patents | ||
* [[:Category:CPC_H04R7/18|H04R7/18]] (at the periphery): 1 patents | * [[:Category:CPC_H04R7/18|H04R7/18]] (at the periphery): 1 patents | ||
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* [[:Category:CPC_B81C1/00158|B81C1/00158]] (Manufacture or treatment of devices or systems in or on a substrate (): 1 patents | * [[:Category:CPC_B81C1/00158|B81C1/00158]] (Manufacture or treatment of devices or systems in or on a substrate (): 1 patents | ||
* [[:Category:CPC_B81B2203/01|B81B2203/01]] (MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES (piezoelectric, electrostrictive or magnetostrictive elements per se): 1 patents | * [[:Category:CPC_B81B2203/01|B81B2203/01]] (MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES (piezoelectric, electrostrictive or magnetostrictive elements per se): 1 patents | ||
* [[:Category:CPC_B81C2203/051|B81C2203/051]] (PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS (making microcapsules or microballoons): 1 patents | * [[:Category:CPC_B81C2203/051|B81C2203/051]] (PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS (making microcapsules or microballoons): 1 patents | ||
* [[:Category:CPC_H04R1/023|H04R1/023]] ({Screens for loudspeakers}): 1 patents | |||
* [[:Category:CPC_H04R19/02|H04R19/02]] (Loudspeakers (): 1 patents | |||
=== Companies === | === Companies === | ||
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==== List of Companies ==== | ==== List of Companies ==== | ||
* xMEMS Labs, Inc.: | * xMEMS Labs, Inc.: 3 patents | ||
=== Collaborators === | === Collaborators === | ||
* [[:Category:Chiung C. Lo of San Jose CA (US)|Chiung C. Lo of San Jose CA (US)]][[Category:Chiung C. Lo of San Jose CA (US)]] ( | * [[:Category:Chao-Yu Chen|Chao-Yu Chen]][[Category:Chao-Yu Chen]] (3 collaborations) | ||
* [[:Category:Wen-Chien Chen|Wen-Chien Chen]][[Category:Wen-Chien Chen]] (3 collaborations) | |||
* [[:Category:Chiung C. Lo of San Jose CA (US)|Chiung C. Lo of San Jose CA (US)]][[Category:Chiung C. Lo of San Jose CA (US)]] (3 collaborations) | |||
* [[:Category:Hao-Hsin Chang|Hao-Hsin Chang]][[Category:Hao-Hsin Chang]] (1 collaborations) | * [[:Category:Hao-Hsin Chang|Hao-Hsin Chang]][[Category:Hao-Hsin Chang]] (1 collaborations) | ||
* [[:Category:Chun-I Chang|Chun-I Chang]][[Category:Chun-I Chang]] (1 collaborations) | * [[:Category:Chun-I Chang|Chun-I Chang]][[Category:Chun-I Chang]] (1 collaborations) | ||
[[Category:Hai-Hung Wen]] | [[Category:Hai-Hung Wen]] | ||
[[Category:Inventors]] | [[Category:Inventors]] | ||
[[Category:Inventors filing patents with xMEMS Labs, Inc.]] | [[Category:Inventors filing patents with xMEMS Labs, Inc.]] | ||
Latest revision as of 17:13, 2 January 2025
Hai-Hung Wen
Executive Summary
Hai-Hung Wen is an inventor who has filed 3 patents. Their primary areas of innovation include Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means {(combinations of transducers with horns, i.e. front-loaded horns (2 patents), Microstructural systems; {Auxiliary parts of microstructural devices or systems} (2 patents), {Arrangements for fixing loudspeaker transducers, e.g. in a box, furniture} (2 patents), and they have worked with companies such as xMEMS Labs, Inc. (3 patents). Their most frequent collaborators include (3 collaborations), (3 collaborations), (3 collaborations).
Patent Filing Activity
File:Hai-Hung Wen Monthly Patent Applications.png
Technology Areas
File:Hai-Hung Wen Top Technology Areas.png
List of Technology Areas
- H04R1/2811 (Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means {(combinations of transducers with horns, i.e. front-loaded horns): 2 patents
- B81B7/0061 (Microstructural systems; {Auxiliary parts of microstructural devices or systems}): 2 patents
- H04R1/025 ({Arrangements for fixing loudspeaker transducers, e.g. in a box, furniture}): 2 patents
- B81B2201/0257 (MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES (piezoelectric, electrostrictive or magnetostrictive elements per se): 2 patents
- B81B2203/0127 (MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES (piezoelectric, electrostrictive or magnetostrictive elements per se): 2 patents
- H04R2201/003 (Mems transducers or their use (of the electrostatic type): 2 patents
- B81B2203/0307 (MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES (piezoelectric, electrostrictive or magnetostrictive elements per se): 2 patents
- H04R7/04 (Plane diaphragms): 1 patents
- H04R19/00 (Electrostatic transducers): 1 patents
- H04R7/06 (LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS (generating mechanical vibrations in general): 1 patents
- H04R7/18 (at the periphery): 1 patents
- H04R31/003 ({for diaphragms or their outer suspension}): 1 patents
- B81C1/00158 (Manufacture or treatment of devices or systems in or on a substrate (): 1 patents
- B81B2203/01 (MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES (piezoelectric, electrostrictive or magnetostrictive elements per se): 1 patents
- B81C2203/051 (PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS (making microcapsules or microballoons): 1 patents
- H04R1/023 ({Screens for loudspeakers}): 1 patents
- H04R19/02 (Loudspeakers (): 1 patents
Companies
File:Hai-Hung Wen Top Companies.png
List of Companies
- xMEMS Labs, Inc.: 3 patents
Collaborators
- Chao-Yu Chen (3 collaborations)
- Wen-Chien Chen (3 collaborations)
- Chiung C. Lo of San Jose CA (US) (3 collaborations)
- Hao-Hsin Chang (1 collaborations)
- Chun-I Chang (1 collaborations)
Subcategories
This category has the following 5 subcategories, out of 5 total.