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| === Executive Summary === | | === Executive Summary === |
| Wen Hung Huang is an inventor who has filed 4 patents. Their primary areas of innovation include SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (2 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (2 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (2 patents), and they have worked with companies such as NXP B.V. (4 patents). Their most frequent collaborators include [[Category:Kuan-Hsiang Mao|Kuan-Hsiang Mao]] (4 collaborations), [[Category:Yufu Liu|Yufu Liu]] (3 collaborations), [[Category:Che Ming Fang|Che Ming Fang]] (2 collaborations). | | Wen Hung Huang is an inventor who has filed 1 patents. Their primary areas of innovation include Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means {(combinations of transducers with horns, i.e. front-loaded horns (1 patents), {Improving the acoustic characteristics by means of constructional features of the housing, e.g. ribs, walls, resonating chambers or cavities} (1 patents), {Arrangements for fixing loudspeaker transducers, e.g. in a box, furniture} (1 patents), and they have worked with companies such as Logitech Europe S.A. (1 patents). Their most frequent collaborators include [[Category:Cheng Chia Pan|Cheng Chia Pan]] (1 collaborations), [[Category:Ching-Lung Lan|Ching-Lung Lan]] (1 collaborations). |
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| === Patent Filing Activity === | | === Patent Filing Activity === |
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| ==== List of Technology Areas ==== | | ==== List of Technology Areas ==== |
| * [[:Category:CPC_H01L24/19|H01L24/19]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents | | * [[:Category:CPC_H04R1/2896|H04R1/2896]] (Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means {(combinations of transducers with horns, i.e. front-loaded horns): 1 patents |
| * [[:Category:CPC_H01L24/20|H01L24/20]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
| | * [[:Category:CPC_H04M1/035|H04M1/035]] ({Improving the acoustic characteristics by means of constructional features of the housing, e.g. ribs, walls, resonating chambers or cavities}): 1 patents |
| * [[:Category:CPC_H01L24/73|H01L24/73]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
| | * [[:Category:CPC_H04R1/025|H04R1/025]] ({Arrangements for fixing loudspeaker transducers, e.g. in a box, furniture}): 1 patents |
| * [[:Category:CPC_H01L24/13|H01L24/13]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
| | * [[:Category:CPC_H04R1/08|H04R1/08]] (Mouthpieces; {Microphones;} Attachments therefor): 1 patents |
| * [[:Category:CPC_H01L2224/2101|H01L2224/2101]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
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| * [[:Category:CPC_H01L2224/2105|H01L2224/2105]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
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| * [[:Category:CPC_H01L2224/211|H01L2224/211]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
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| * [[:Category:CPC_H01L2224/214|H01L2224/214]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
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| * [[:Category:CPC_H01L2224/73101|H01L2224/73101]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
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| * [[:Category:CPC_H01L24/11|H01L24/11]] ({Manufacturing methods (for bumps on insulating substrates): 2 patents
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| * [[:Category:CPC_H01L2224/13006|H01L2224/13006]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
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| * [[:Category:CPC_H01L2224/215|H01L2224/215]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
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| * [[:Category:CPC_H01L23/49861|H01L23/49861]] ({Lead-frames fixed on or encapsulated in insulating substrates (): 1 patents
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| * [[:Category:CPC_H01L24/16|H01L24/16]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
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| * [[:Category:CPC_H01L24/81|H01L24/81]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
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| * [[:Category:CPC_H01L23/49838|H01L23/49838]] (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate): 1 patents
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| * [[:Category:CPC_H01L21/4839|H01L21/4839]] (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 1 patents | |
| * [[:Category:CPC_H01L21/4882|H01L21/4882]] (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 1 patents | |
| * [[:Category:CPC_H01L23/3675|H01L23/3675]] (Cooling facilitated by shape of device {(): 1 patents
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| * [[:Category:CPC_H01L2224/81203|H01L2224/81203]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
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| * [[:Category:CPC_H01L2224/81207|H01L2224/81207]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
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| * [[:Category:CPC_H01L2224/16245|H01L2224/16245]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
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| * [[:Category:CPC_H01L23/49816|H01L23/49816]] (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate): 1 patents
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| * [[:Category:CPC_H01L25/105|H01L25/105]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | |
| * [[:Category:CPC_H01L21/283|H01L21/283]] (Deposition of conductive or insulating materials for electrodes {conducting electric current}): 1 patents
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| * [[:Category:CPC_H01L21/78|H01L21/78]] (with subsequent division of the substrate into plural individual devices (cutting to change the surface-physical characteristics or shape of semiconductor bodies): 1 patents
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| * [[:Category:CPC_H01L24/03|H01L24/03]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
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| * [[:Category:CPC_H01L24/05|H01L24/05]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
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| * [[:Category:CPC_H01L2224/0231|H01L2224/0231]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
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| * [[:Category:CPC_H01L2224/02331|H01L2224/02331]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
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| * [[:Category:CPC_H01L2224/05558|H01L2224/05558]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
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| * [[:Category:CPC_H01L2924/3511|H01L2924/3511]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
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| * [[:Category:CPC_H01L2224/13027|H01L2224/13027]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
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| * [[:Category:CPC_H01L2224/11849|H01L2224/11849]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
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| === Companies === | | === Companies === |
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| ==== List of Companies ==== | | ==== List of Companies ==== |
| * NXP B.V.: 4 patents | | * Logitech Europe S.A.: 1 patents |
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| === Collaborators === | | === Collaborators === |
| * [[:Category:Kuan-Hsiang Mao|Kuan-Hsiang Mao]][[Category:Kuan-Hsiang Mao]] (4 collaborations) | | * [[:Category:Cheng Chia Pan|Cheng Chia Pan]][[Category:Cheng Chia Pan]] (1 collaborations) |
| * [[:Category:Yufu Liu|Yufu Liu]][[Category:Yufu Liu]] (3 collaborations)
| | * [[:Category:Ching-Lung Lan|Ching-Lung Lan]][[Category:Ching-Lung Lan]] (1 collaborations) |
| * [[:Category:Che Ming Fang|Che Ming Fang]][[Category:Che Ming Fang]] (2 collaborations)
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| * [[:Category:Tsung Nan Lo|Tsung Nan Lo]][[Category:Tsung Nan Lo]] (1 collaborations)
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| * [[:Category:Chin Teck Siong|Chin Teck Siong]][[Category:Chin Teck Siong]] (1 collaborations) | |
| * [[:Category:Pey Fang Hiew|Pey Fang Hiew]][[Category:Pey Fang Hiew]] (1 collaborations)
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| * [[:Category:Wen Yuan Chuang|Wen Yuan Chuang]][[Category:Wen Yuan Chuang]] (1 collaborations)
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| * [[:Category:Sharon Huey Lin Tay|Sharon Huey Lin Tay]][[Category:Sharon Huey Lin Tay]] (1 collaborations)
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| [[Category:Wen Hung Huang]] | | [[Category:Wen Hung Huang]] |
| [[Category:Inventors]] | | [[Category:Inventors]] |
| [[Category:Inventors filing patents with NXP B.V.]] | | [[Category:Inventors filing patents with Logitech Europe S.A.]] |
Wen Hung Huang
Executive Summary
Wen Hung Huang is an inventor who has filed 1 patents. Their primary areas of innovation include Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means {(combinations of transducers with horns, i.e. front-loaded horns (1 patents), {Improving the acoustic characteristics by means of constructional features of the housing, e.g. ribs, walls, resonating chambers or cavities} (1 patents), {Arrangements for fixing loudspeaker transducers, e.g. in a box, furniture} (1 patents), and they have worked with companies such as Logitech Europe S.A. (1 patents). Their most frequent collaborators include (1 collaborations), (1 collaborations).
Patent Filing Activity
File:Wen Hung Huang Monthly Patent Applications.png
Technology Areas
File:Wen Hung Huang Top Technology Areas.png
List of Technology Areas
- H04R1/2896 (Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means {(combinations of transducers with horns, i.e. front-loaded horns): 1 patents
- H04M1/035 ({Improving the acoustic characteristics by means of constructional features of the housing, e.g. ribs, walls, resonating chambers or cavities}): 1 patents
- H04R1/025 ({Arrangements for fixing loudspeaker transducers, e.g. in a box, furniture}): 1 patents
- H04R1/08 (Mouthpieces; {Microphones;} Attachments therefor): 1 patents
Companies
File:Wen Hung Huang Top Companies.png
List of Companies
- Logitech Europe S.A.: 1 patents
Collaborators
