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| === Executive Summary === | | === Executive Summary === |
| Kuo-Cheng CHIANG is an inventor who has filed 24 patents. Their primary areas of innovation include SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (18 patents), {using a dummy, i.e. replacement gate in a process wherein at least a part of the final gate is self aligned to the dummy gate} (16 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (15 patents), and they have worked with companies such as Taiwan Semiconductor Manufacturing Company, Ltd. (14 patents), TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (10 patents). Their most frequent collaborators include [[Category:Chih-Hao WANG|Chih-Hao WANG]] (19 collaborations), [[Category:Shi-Ning JU|Shi-Ning JU]] (10 collaborations), [[Category:Kuan-Ting PAN|Kuan-Ting PAN]] (6 collaborations). | | Kuo-Cheng CHIANG is an inventor who has filed 2 patents. Their primary areas of innovation include SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (1 patents), to produce devices, e.g. integrated circuits, each consisting of a plurality of components (1 patents), to produce devices, e.g. integrated circuits, each consisting of a plurality of components (1 patents), and they have worked with companies such as Taiwan Semiconductor Manufacturing Company Ltd. (2 patents). Their most frequent collaborators include [[Category:Chih-Hao WANG|Chih-Hao WANG]] (2 collaborations), [[Category:Chun Yi CHOU|Chun Yi CHOU]] (1 collaborations), [[Category:Guan-Lin CHEN|Guan-Lin CHEN]] (1 collaborations). |
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| === Patent Filing Activity === | | === Patent Filing Activity === |
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| ==== List of Technology Areas ==== | | ==== List of Technology Areas ==== |
| * [[:Category:CPC_H01L29/42392|H01L29/42392]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 18 patents | | * [[:Category:CPC_H01L29/42392|H01L29/42392]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents |
| * [[:Category:CPC_H01L29/66545|H01L29/66545]] ({using a dummy, i.e. replacement gate in a process wherein at least a part of the final gate is self aligned to the dummy gate}): 16 patents
| | * [[:Category:CPC_H01L21/823412|H01L21/823412]] (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents |
| * [[:Category:CPC_H01L29/0673|H01L29/0673]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 15 patents
| | * [[:Category:CPC_H01L21/823418|H01L21/823418]] (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents |
| * [[:Category:CPC_H01L29/78696|H01L29/78696]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 14 patents
| | * [[:Category:CPC_H01L21/823437|H01L21/823437]] (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents |
| * [[:Category:CPC_H01L21/823431|H01L21/823431]] (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 10 patents
| |
| * [[:Category:CPC_H01L29/66439|H01L29/66439]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 8 patents
| |
| * [[:Category:CPC_H01L29/775|H01L29/775]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 8 patents
| |
| * [[:Category:CPC_H01L29/0847|H01L29/0847]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 7 patents
| |
| * [[:Category:CPC_H01L21/823418|H01L21/823418]] (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 6 patents
| |
| * [[:Category:CPC_H01L21/823412|H01L21/823412]] (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 5 patents | |
| * [[:Category:CPC_H01L21/823807|H01L21/823807]] (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 4 patents
| |
| * [[:Category:CPC_H01L21/823814|H01L21/823814]] (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 4 patents
| |
| * [[:Category:CPC_H01L29/66742|H01L29/66742]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents
| |
| * [[:Category:CPC_H01L21/823468|H01L21/823468]] (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 4 patents
| |
| * [[:Category:CPC_H01L21/02603|H01L21/02603]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
| |
| * [[:Category:CPC_H01L29/66553|H01L29/66553]] ({using self aligned silicidation, i.e. salicide (formation of conductive layers comprising silicides): 3 patents
| |
| * [[:Category:CPC_H01L21/823481|H01L21/823481]] (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 3 patents
| |
| * [[:Category:CPC_H01L29/66795|H01L29/66795]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
| |
| * [[:Category:CPC_H01L29/6656|H01L29/6656]] ({using self aligned silicidation, i.e. salicide (formation of conductive layers comprising silicides): 3 patents
| |
| * [[:Category:CPC_H01L27/0886|H01L27/0886]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
| |
| * [[:Category:CPC_H01L27/0922|H01L27/0922]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
| |
| * [[:Category:CPC_H01L21/823878|H01L21/823878]] (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 2 patents
| |
| * [[:Category:CPC_H01L27/092|H01L27/092]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
| |
| * [[:Category:CPC_H01L21/823828|H01L21/823828]] (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 2 patents
| |
| * [[:Category:CPC_H01L29/6653|H01L29/6653]] ({using self aligned silicidation, i.e. salicide (formation of conductive layers comprising silicides): 2 patents
| |
| * [[:Category:CPC_H01L29/7851|H01L29/7851]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
| |
| * [[:Category:CPC_H01L21/76224|H01L21/76224]] ({using trench refilling with dielectric materials (trench filling with polycristalline silicon): 2 patents
| |
| * [[:Category:CPC_H01L21/30604|H01L21/30604]] (Chemical or electrical treatment, e.g. electrolytic etching (to form insulating layers): 2 patents
| |
| * [[:Category:CPC_H01L21/28518|H01L21/28518]] (from a gas or vapour, e.g. condensation): 1 patents
| |
| * [[:Category:CPC_H01L21/823871|H01L21/823871]] (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents | |
| * [[:Category:CPC_H01L29/45|H01L29/45]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| |
| * [[:Category:CPC_H01L29/78618|H01L29/78618]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| |
| * [[:Category:CPC_H01L21/28088|H01L21/28088]] (Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups): 1 patents
| |
| * [[:Category:CPC_H01L21/823842|H01L21/823842]] (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents
| |
| * [[:Category:CPC_H01L29/4908|H01L29/4908]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| |
| * [[:Category:CPC_H01L21/823857|H01L21/823857]] (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents | |
| * [[:Category:CPC_H01L27/088|H01L27/088]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | | * [[:Category:CPC_H01L27/088|H01L27/088]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents |
| * [[:Category:CPC_H01L21/823456|H01L21/823456]] (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents
| | * [[:Category:CPC_H01L29/0665|H01L29/0665]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents |
| * [[:Category:CPC_H01L21/823475|H01L21/823475]] (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents
| | * [[:Category:CPC_H01L29/0847|H01L29/0847]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents |
| * [[:Category:CPC_H01L29/7848|H01L29/7848]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | | * [[:Category:CPC_H01L29/66545|H01L29/66545]] ({using a dummy, i.e. replacement gate in a process wherein at least a part of the final gate is self aligned to the dummy gate}): 1 patents |
| * [[:Category:CPC_H01L23/481|H01L23/481]] (Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements {; Selection of materials therefor}): 1 patents
| | * [[:Category:CPC_H01L29/66553|H01L29/66553]] ({using self aligned silicidation, i.e. salicide (formation of conductive layers comprising silicides): 1 patents |
| * [[:Category:CPC_H01L29/0649|H01L29/0649]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | | * [[:Category:CPC_H01L29/78696|H01L29/78696]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents |
| * [[:Category:CPC_H01L21/28575|H01L21/28575]] (from a gas or vapour, e.g. condensation): 1 patents | | * [[:Category:CPC_H10D30/6735|H10D30/6735]] (No explanation available): 1 patents |
| * [[:Category:CPC_H01L27/0928|H01L27/0928]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| | * [[:Category:CPC_H10D30/014|H10D30/014]] (No explanation available): 1 patents |
| * [[:Category:CPC_H01L21/823892|H01L21/823892]] (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents
| | * [[:Category:CPC_H10D30/43|H10D30/43]] (No explanation available): 1 patents |
| * [[:Category:CPC_H01L27/1108|H01L27/1108]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| | * [[:Category:CPC_H10D30/6757|H10D30/6757]] (No explanation available): 1 patents |
| * [[:Category:CPC_H01L27/1104|H01L27/1104]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| | * [[:Category:CPC_H10D62/116|H10D62/116]] (No explanation available): 1 patents |
| * [[:Category:CPC_H01L21/32137|H01L21/32137]] ({of silicon-containing layers}): 1 patents
| | * [[:Category:CPC_H10D62/121|H10D62/121]] (No explanation available): 1 patents |
| * [[:Category:CPC_H01L27/11|H01L27/11]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| | * [[:Category:CPC_H10D62/151|H10D62/151]] (No explanation available): 1 patents |
| * [[:Category:CPC_H01L21/32139|H01L21/32139]] ({using masks}): 1 patents
| | * [[:Category:CPC_H10D64/017|H10D64/017]] (No explanation available): 1 patents |
| * [[:Category:CPC_H01L21/3086|H01L21/3086]] ({characterised by the process involved to create the mask, e.g. lift-off masks, sidewalls, or to modify the mask, e.g. pre-treatment, post-treatment}): 1 patents
| | * [[:Category:CPC_H10D64/018|H10D64/018]] (No explanation available): 1 patents |
| * [[:Category:CPC_H01L29/7853|H01L29/7853]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | | * [[:Category:CPC_H10D84/013|H10D84/013]] (No explanation available): 1 patents |
| * [[:Category:CPC_H01L29/7854|H01L29/7854]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| | * [[:Category:CPC_H10D84/0151|H10D84/0151]] (No explanation available): 1 patents |
| * [[:Category:CPC_H01L24/83|H01L24/83]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| | * [[:Category:CPC_H10D84/038|H10D84/038]] (No explanation available): 1 patents |
| * [[:Category:CPC_H01L24/32|H01L24/32]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| | * [[:Category:CPC_H10D84/83|H10D84/83]] (No explanation available): 1 patents |
| * [[:Category:CPC_H01L25/0657|H01L25/0657]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| |
| * [[:Category:CPC_H01L24/29|H01L24/29]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| |
| * [[:Category:CPC_H01L21/0245|H01L21/0245]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| |
| * [[:Category:CPC_H01L21/26533|H01L21/26533]] (producing ion implantation): 1 patents
| |
| * [[:Category:CPC_H01L24/16|H01L24/16]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| |
| * [[:Category:CPC_H01L23/49894|H01L23/49894]] (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate): 1 patents
| |
| * [[:Category:CPC_H01L23/49838|H01L23/49838]] (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate): 1 patents
| |
| * [[:Category:CPC_H01L23/49816|H01L23/49816]] (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate): 1 patents | |
| * [[:Category:CPC_H01L23/49822|H01L23/49822]] ({Multilayer substrates (multilayer metallisation on monolayer substrate): 1 patents
| |
| * [[:Category:CPC_H01L23/5386|H01L23/5386]] (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({): 1 patents
| |
| * [[:Category:CPC_H01L23/5389|H01L23/5389]] (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({): 1 patents
| |
| * [[:Category:CPC_H01L2225/06524|H01L2225/06524]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| |
| * [[:Category:CPC_H01L2225/06541|H01L2225/06541]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| |
| * [[:Category:CPC_H01L2225/06517|H01L2225/06517]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| |
| * [[:Category:CPC_H01L2225/06593|H01L2225/06593]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| |
| * [[:Category:CPC_H01L2924/37001|H01L2924/37001]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | |
| * [[:Category:CPC_H01L2224/29187|H01L2224/29187]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | |
| * [[:Category:CPC_H01L2224/83005|H01L2224/83005]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | |
| * [[:Category:CPC_H01L2224/8313|H01L2224/8313]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | |
| * [[:Category:CPC_H01L2224/83123|H01L2224/83123]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | |
| * [[:Category:CPC_H01L2224/8383|H01L2224/8383]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | |
| * [[:Category:CPC_H01L2224/32145|H01L2224/32145]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | |
| * [[:Category:CPC_H01L2224/16227|H01L2224/16227]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | |
| * [[:Category:CPC_H01L21/4857|H01L21/4857]] (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 1 patents | |
| * [[:Category:CPC_H01L29/66787|H01L29/66787]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | |
| * [[:Category:CPC_H01L29/785|H01L29/785]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | |
| * [[:Category:CPC_H01L29/0642|H01L29/0642]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | |
| * [[:Category:CPC_B82Y40/00|B82Y40/00]] (Manufacture or treatment of nanostructures): 1 patents | |
| * [[:Category:CPC_H01L29/42376|H01L29/42376]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| |
| * [[:Category:CPC_H01L29/7856|H01L29/7856]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| |
| * [[:Category:CPC_H01L27/1207|H01L27/1207]] ({combined with devices in contact with the semiconductor body, i.e. bulk/SOI hybrid circuits}): 1 patents
| |
| * [[:Category:CPC_H01L21/8221|H01L21/8221]] ({Three dimensional integrated circuits stacked in different levels}): 1 patents
| |
| * [[:Category:CPC_H01L21/76843|H01L21/76843]] ({formed in openings in a dielectric}): 1 patents
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| === Companies === | | === Companies === |
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| ==== List of Companies ==== | | ==== List of Companies ==== |
| * Taiwan Semiconductor Manufacturing Company, Ltd.: 14 patents | | * Taiwan Semiconductor Manufacturing Company Ltd.: 2 patents |
| * TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.: 10 patents
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| === Collaborators === | | === Collaborators === |
| * [[:Category:Chih-Hao WANG|Chih-Hao WANG]][[Category:Chih-Hao WANG]] (19 collaborations) | | * [[:Category:Chih-Hao WANG|Chih-Hao WANG]][[Category:Chih-Hao WANG]] (2 collaborations) |
| * [[:Category:Shi-Ning JU|Shi-Ning JU]][[Category:Shi-Ning JU]] (10 collaborations) | | * [[:Category:Chun Yi CHOU|Chun Yi CHOU]][[Category:Chun Yi CHOU]] (1 collaborations) |
| * [[:Category:Kuan-Ting PAN|Kuan-Ting PAN]][[Category:Kuan-Ting PAN]] (6 collaborations)
| | * [[:Category:Guan-Lin CHEN|Guan-Lin CHEN]][[Category:Guan-Lin CHEN]] (1 collaborations) |
| * [[:Category:Guan-Lin CHEN|Guan-Lin CHEN]][[Category:Guan-Lin CHEN]] (6 collaborations) | | * [[:Category:Shi Ning JU|Shi Ning JU]][[Category:Shi Ning JU]] (1 collaborations) |
| * [[:Category:Jung-Hung CHANG|Jung-Hung CHANG]][[Category:Jung-Hung CHANG]] (5 collaborations)
| | * [[:Category:Jung-Hung CHANG|Jung-Hung CHANG]][[Category:Jung-Hung CHANG]] (1 collaborations) |
| * [[:Category:Kuan-Lun CHENG|Kuan-Lun CHENG]][[Category:Kuan-Lun CHENG]] (5 collaborations)
| | * [[:Category:Shih-Cheng CHEN|Shih-Cheng CHEN]][[Category:Shih-Cheng CHEN]] (1 collaborations) |
| * [[:Category:Shi Ning JU|Shi Ning JU]][[Category:Shi Ning JU]] (5 collaborations) | |
| * [[:Category:Shih-Cheng CHEN|Shih-Cheng CHEN]][[Category:Shih-Cheng CHEN]] (4 collaborations)
| |
| * [[:Category:Zhi-Chang LIN|Zhi-Chang LIN]][[Category:Zhi-Chang LIN]] (4 collaborations)
| |
| * [[:Category:Jung-Chien CHENG|Jung-Chien CHENG]][[Category:Jung-Chien CHENG]] (4 collaborations) | |
| * [[:Category:Chien Ning YAO|Chien Ning YAO]][[Category:Chien Ning YAO]] (3 collaborations)
| |
| * [[:Category:Jia-Ni YU|Jia-Ni YU]][[Category:Jia-Ni YU]] (3 collaborations)
| |
| * [[:Category:Mao-Lin HUANG|Mao-Lin HUANG]][[Category:Mao-Lin HUANG]] (3 collaborations)
| |
| * [[:Category:Lung-Kun CHU|Lung-Kun CHU]][[Category:Lung-Kun CHU]] (3 collaborations)
| |
| * [[:Category:Chung-Wei HSU|Chung-Wei HSU]][[Category:Chung-Wei HSU]] (3 collaborations)
| |
| * [[:Category:Chun-Fu LU|Chun-Fu LU]][[Category:Chun-Fu LU]] (3 collaborations)
| |
| * [[:Category:Yi-Ruei JHAN|Yi-Ruei JHAN]][[Category:Yi-Ruei JHAN]] (2 collaborations)
| |
| * [[:Category:Lo-Heng CHANG|Lo-Heng CHANG]][[Category:Lo-Heng CHANG]] (2 collaborations)
| |
| * [[:Category:Wen-Ting LAN|Wen-Ting LAN]][[Category:Wen-Ting LAN]] (2 collaborations)
| |
| * [[:Category:Lin-Yu HUANG|Lin-Yu HUANG]][[Category:Lin-Yu HUANG]] (2 collaborations)
| |
| * [[:Category:Bo-Rong LIN|Bo-Rong LIN]][[Category:Bo-Rong LIN]] (2 collaborations)
| |
| * [[:Category:Lo Heng CHANG|Lo Heng CHANG]][[Category:Lo Heng CHANG]] (1 collaborations)
| |
| * [[:Category:CHIH-HAO WANG|CHIH-HAO WANG]][[Category:CHIH-HAO WANG]] (1 collaborations) | |
| * [[:Category:Jin CAI|Jin CAI]][[Category:Jin CAI]] (1 collaborations)
| |
| * [[:Category:Pei-Yu WANG|Pei-Yu WANG]][[Category:Pei-Yu WANG]] (1 collaborations)
| |
| * [[:Category:Cheng-Ting CHUNG|Cheng-Ting CHUNG]][[Category:Cheng-Ting CHUNG]] (1 collaborations)
| |
| * [[:Category:Ching-Wei TSAI|Ching-Wei TSAI]][[Category:Ching-Wei TSAI]] (1 collaborations)
| |
| * [[:Category:Yu-Xuan HUANG|Yu-Xuan HUANG]][[Category:Yu-Xuan HUANG]] (1 collaborations)
| |
| * [[:Category:Min CAO|Min CAO]][[Category:Min CAO]] (1 collaborations)
| |
| * [[:Category:Pei-Hsun WANG|Pei-Hsun WANG]][[Category:Pei-Hsun WANG]] (1 collaborations)
| |
| * [[:Category:Wei-Ting WANG|Wei-Ting WANG]][[Category:Wei-Ting WANG]] (1 collaborations)
| |
| * [[:Category:Chien-Ning YAO|Chien-Ning YAO]][[Category:Chien-Ning YAO]] (1 collaborations)
| |
| * [[:Category:Tsung-Han CHUANG|Tsung-Han CHUANG]][[Category:Tsung-Han CHUANG]] (1 collaborations) | | * [[:Category:Tsung-Han CHUANG|Tsung-Han CHUANG]][[Category:Tsung-Han CHUANG]] (1 collaborations) |
| * [[:Category:Hsiao-Han LIU|Hsiao-Han LIU]][[Category:Hsiao-Han LIU]] (1 collaborations)
| |
| * [[:Category:I-Han HUANG|I-Han HUANG]][[Category:I-Han HUANG]] (1 collaborations)
| |
| * [[:Category:Fu-Cheng CHANG|Fu-Cheng CHANG]][[Category:Fu-Cheng CHANG]] (1 collaborations) | | * [[:Category:Fu-Cheng CHANG|Fu-Cheng CHANG]][[Category:Fu-Cheng CHANG]] (1 collaborations) |
| * [[:Category:Jia-Chuan YOU|Jia-Chuan YOU]][[Category:Jia-Chuan YOU]] (1 collaborations) | | * [[:Category:Wen-Ting LAN|Wen-Ting LAN]][[Category:Wen-Ting LAN]] (1 collaborations) |
| * [[:Category:Huan-Chieh SU|Huan-Chieh SU]][[Category:Huan-Chieh SU]] (1 collaborations) | | * [[:Category:Chia-Cheng TSAI|Chia-Cheng TSAI]][[Category:Chia-Cheng TSAI]] (1 collaborations) |
| * [[:Category:Chia-Hao CHANG|Chia-Hao CHANG]][[Category:Chia-Hao CHANG]] (1 collaborations) | | * [[:Category:Wang-Chun Huang|Wang-Chun Huang]][[Category:Wang-Chun Huang]] (1 collaborations) |
| | * [[:Category:Shi-Syuan Huang|Shi-Syuan Huang]][[Category:Shi-Syuan Huang]] (1 collaborations) |
|
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|
| [[Category:Kuo-Cheng CHIANG]] | | [[Category:Kuo-Cheng CHIANG]] |
| [[Category:Inventors]] | | [[Category:Inventors]] |
| [[Category:Inventors filing patents with TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.]]
| | [[Category:Inventors filing patents with Taiwan Semiconductor Manufacturing Company Ltd.]] |
| [[Category:Inventors filing patents with Taiwan Semiconductor Manufacturing Company, Ltd.]] | |
