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| === Executive Summary === | | === Executive Summary === |
| Chen-Hua Yu is an inventor who has filed 43 patents. Their primary areas of innovation include SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (9 patents), {Multilayer substrates (multilayer metallisation on monolayer substrate (8 patents), Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements {; Selection of materials therefor} (8 patents), and they have worked with companies such as Taiwan Semiconductor Manufacturing Co., Ltd. (43 patents). Their most frequent collaborators include [[Category:Jiun Yi Wu|Jiun Yi Wu]] (9 collaborations), [[Category:Hsing-Kuo Hsia|Hsing-Kuo Hsia]] (8 collaborations), [[Category:Chung-Shi Liu|Chung-Shi Liu]] (6 collaborations). | | Chen-Hua Yu is an inventor who has filed 9 patents. Their primary areas of innovation include SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (3 patents), {Multilayer substrates ( (3 patents), {Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group (3 patents), and they have worked with companies such as Taiwan Semiconductor Manufacturing Company, Ltd. (9 patents). Their most frequent collaborators include [[Category:Chung-Shi Liu|Chung-Shi Liu]] (5 collaborations), [[Category:Hao-Yi Tsai|Hao-Yi Tsai]] (4 collaborations), [[Category:Chung-Hao Tsai|Chung-Hao Tsai]] (2 collaborations). |
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| === Patent Filing Activity === | | === Patent Filing Activity === |
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| ==== List of Technology Areas ==== | | ==== List of Technology Areas ==== |
| * [[:Category:CPC_H01L24/16|H01L24/16]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 9 patents
| | * [[:Category:CPC_H01L23/3128|H01L23/3128]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents |
| * [[:Category:CPC_H01L23/49822|H01L23/49822]] ({Multilayer substrates (multilayer metallisation on monolayer substrate): 8 patents
| | * [[:Category:CPC_H01L23/5383|H01L23/5383]] ({Multilayer substrates (): 3 patents |
| * [[:Category:CPC_H01L23/481|H01L23/481]] (Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements {; Selection of materials therefor}): 8 patents
| | * [[:Category:CPC_H01L25/50|H01L25/50]] ({Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group): 3 patents |
| * [[:Category:CPC_H01L23/49816|H01L23/49816]] (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate): 8 patents
| | * [[:Category:CPC_H01L23/49838|H01L23/49838]] (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate): 2 patents |
| * [[:Category:CPC_H01L24/32|H01L24/32]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 8 patents
| | * [[:Category:CPC_H01L23/49822|H01L23/49822]] ({Multilayer substrates (multilayer metallisation on monolayer substrate): 2 patents |
| * [[:Category:CPC_H01L24/73|H01L24/73]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 8 patents
| | * [[:Category:CPC_H01L23/5283|H01L23/5283]] ({Geometry or} layout of the interconnection structure {(): 2 patents |
| * [[:Category:CPC_H01L25/18|H01L25/18]] (the devices being of types provided for in two or more different subgroups of the same main group of groups): 8 patents
| |
| * [[:Category:CPC_H01L21/56|H01L21/56]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 7 patents
| |
| * [[:Category:CPC_H01L23/49833|H01L23/49833]] (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate): 7 patents
| |
| * [[:Category:CPC_H01L24/08|H01L24/08]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 7 patents
| |
| * [[:Category:CPC_H01L25/0657|H01L25/0657]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 7 patents
| |
| * [[:Category:CPC_H01L23/5389|H01L23/5389]] (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({): 6 patents
| |
| * [[:Category:CPC_H01L23/3128|H01L23/3128]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 6 patents | |
| * [[:Category:CPC_H01L23/5383|H01L23/5383]] ({Multilayer substrates (): 6 patents | |
| * [[:Category:CPC_H01L23/5386|H01L23/5386]] (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({): 6 patents
| |
| * [[:Category:CPC_H01L21/4857|H01L21/4857]] (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 6 patents
| |
| * [[:Category:CPC_H01L24/17|H01L24/17]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 5 patents
| |
| * [[:Category:CPC_H01L24/97|H01L24/97]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 5 patents
| |
| * [[:Category:CPC_H01L25/105|H01L25/105]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 5 patents
| |
| * [[:Category:CPC_H01L2224/73204|H01L2224/73204]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 5 patents
| |
| * [[:Category:CPC_H01L2225/1058|H01L2225/1058]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 5 patents
| |
| * [[:Category:CPC_H01L25/50|H01L25/50]] ({Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group): 5 patents | |
| * [[:Category:CPC_H01L21/4853|H01L21/4853]] (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 5 patents
| |
| * [[:Category:CPC_H01L24/80|H01L24/80]] ({Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected}): 5 patents
| |
| * [[:Category:CPC_H01L2224/80895|H01L2224/80895]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 5 patents
| |
| * [[:Category:CPC_H01L24/81|H01L24/81]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents
| |
| * [[:Category:CPC_H01L21/561|H01L21/561]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents
| |
| * [[:Category:CPC_H01L21/76898|H01L21/76898]] ({formed through a semiconductor substrate}): 4 patents
| |
| * [[:Category:CPC_H01L25/0652|H01L25/0652]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents
| |
| * [[:Category:CPC_G02B6/13|G02B6/13]] (OPTICAL ELEMENTS, SYSTEMS OR APPARATUS): 4 patents
| |
| * [[:Category:CPC_H01L23/3121|H01L23/3121]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents
| |
| * [[:Category:CPC_G02B6/12004|G02B6/12004]] (of the integrated circuit kind (electric integrated circuits): 4 patents
| |
| * [[:Category:CPC_H01L24/09|H01L24/09]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents
| |
| * [[:Category:CPC_H01L21/565|H01L21/565]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents
| |
| * [[:Category:CPC_H01L2224/32225|H01L2224/32225]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents
| |
| * [[:Category:CPC_H01L2224/80896|H01L2224/80896]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents
| |
| * [[:Category:CPC_H01L24/19|H01L24/19]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents
| |
| * [[:Category:CPC_H01L23/3114|H01L23/3114]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
| |
| * [[:Category:CPC_H01L21/563|H01L21/563]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
| |
| * [[:Category:CPC_H01L23/49838|H01L23/49838]] (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate): 3 patents | |
| * [[:Category:CPC_H01L24/94|H01L24/94]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
| |
| * [[:Category:CPC_H01L24/96|H01L24/96]] ({the devices being encapsulated in a common layer, e.g. neo-wafer or pseudo-wafer, said common layer being separable into individual assemblies after connecting}): 3 patents
| |
| * [[:Category:CPC_H01L24/48|H01L24/48]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
| |
| * [[:Category:CPC_H01L2225/1041|H01L2225/1041]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
| |
| * [[:Category:CPC_H01L2924/182|H01L2924/182]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
| |
| * [[:Category:CPC_G02B2006/12121|G02B2006/12121]] (OPTICAL ELEMENTS, SYSTEMS OR APPARATUS): 3 patents
| |
| * [[:Category:CPC_G02B6/4214|G02B6/4214]] (Coupling light guides with opto-electronic elements): 3 patents
| |
| * [[:Category:CPC_H01L23/49827|H01L23/49827]] ({Via connections through the substrates, e.g. pins going through the substrate, coaxial cables (): 3 patents | |
| * [[:Category:CPC_H10B80/00|H10B80/00]] (Assemblies of multiple devices comprising at least one memory device covered by this subclass): 3 patents | |
| * [[:Category:CPC_H01L2224/16225|H01L2224/16225]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
| |
| * [[:Category:CPC_H01L2224/32245|H01L2224/32245]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
| |
| * [[:Category:CPC_H01L25/0655|H01L25/0655]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
| |
| * [[:Category:CPC_H01L2224/0231|H01L2224/0231]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
| |
| * [[:Category:CPC_H01L24/03|H01L24/03]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
| |
| * [[:Category:CPC_H01L24/05|H01L24/05]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
| |
| * [[:Category:CPC_H01L24/14|H01L24/14]] ({of a plurality of bump connectors}): 3 patents
| |
| * [[:Category:CPC_H01L24/13|H01L24/13]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
| |
| * [[:Category:CPC_H01L21/76802|H01L21/76802]] (Applying interconnections to be used for carrying current between separate components within a device {comprising conductors and dielectrics}): 3 patents
| |
| * [[:Category:CPC_H01L23/31|H01L23/31]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
| |
| * [[:Category:CPC_H01L24/29|H01L24/29]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
| |
| * [[:Category:CPC_H01L2924/1431|H01L2924/1431]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
| |
| * [[:Category:CPC_H01L23/5385|H01L23/5385]] (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({): 3 patents
| |
| * [[:Category:CPC_H01L24/20|H01L24/20]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
| |
| * [[:Category:CPC_H01L2225/1035|H01L2225/1035]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
| |
| * [[:Category:CPC_H01L2924/3511|H01L2924/3511]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
| |
| * [[:Category:CPC_H01L2224/08235|H01L2224/08235]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
| |
| * [[:Category:CPC_H01L2224/32145|H01L2224/32145]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
| |
| * [[:Category:CPC_H01L2225/1023|H01L2225/1023]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
| |
| * [[:Category:CPC_G02B6/1225|G02B6/1225]] (of the integrated circuit kind (electric integrated circuits): 2 patents
| |
| * [[:Category:CPC_H01L23/3677|H01L23/3677]] (Cooling facilitated by shape of device {(): 2 patents
| |
| * [[:Category:CPC_H01L24/33|H01L24/33]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
| |
| * [[:Category:CPC_H01L2224/33181|H01L2224/33181]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
| |
| * [[:Category:CPC_H01L2224/73253|H01L2224/73253]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
| |
| * [[:Category:CPC_H01L23/473|H01L23/473]] (by flowing liquids {(): 2 patents
| |
| * [[:Category:CPC_H01L23/3135|H01L23/3135]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
| |
| * [[:Category:CPC_G02B6/4239|G02B6/4239]] (Coupling light guides with opto-electronic elements): 2 patents
| |
| * [[:Category:CPC_G02B2006/12104|G02B2006/12104]] (OPTICAL ELEMENTS, SYSTEMS OR APPARATUS): 2 patents
| |
| * [[:Category:CPC_G02B6/136|G02B6/136]] (OPTICAL ELEMENTS, SYSTEMS OR APPARATUS): 2 patents
| |
| * [[:Category:CPC_H01L23/5226|H01L23/5226]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents | | * [[:Category:CPC_H01L23/5226|H01L23/5226]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents |
| * [[:Category:CPC_H01L2224/02373|H01L2224/02373]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
| |
| * [[:Category:CPC_H01L2924/1433|H01L2924/1433]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
| |
| * [[:Category:CPC_H01L24/06|H01L24/06]] ({of a plurality of bonding areas}): 2 patents
| |
| * [[:Category:CPC_G02B6/132|G02B6/132]] (OPTICAL ELEMENTS, SYSTEMS OR APPARATUS): 2 patents
| |
| * [[:Category:CPC_G02B2006/12061|G02B2006/12061]] (OPTICAL ELEMENTS, SYSTEMS OR APPARATUS): 2 patents
| |
| * [[:Category:CPC_H01L2224/02375|H01L2224/02375]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
| |
| * [[:Category:CPC_H01L24/83|H01L24/83]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
| |
| * [[:Category:CPC_H01L2924/1632|H01L2924/1632]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
| |
| * [[:Category:CPC_H01L23/5384|H01L23/5384]] ({Conductive vias through the substrate with or without pins, e.g. buried coaxial conductors (): 2 patents
| |
| * [[:Category:CPC_H01L23/562|H01L23/562]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
| |
| * [[:Category:CPC_H01L23/49811|H01L23/49811]] ({Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads (): 2 patents
| |
| * [[:Category:CPC_H01L2224/214|H01L2224/214]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
| |
| * [[:Category:CPC_H01L25/167|H01L25/167]] (the devices being of types provided for in two or more different main groups of groups): 2 patents
| |
| * [[:Category:CPC_H01L23/3675|H01L23/3675]] (Cooling facilitated by shape of device {(): 2 patents | | * [[:Category:CPC_H01L23/3675|H01L23/3675]] (Cooling facilitated by shape of device {(): 2 patents |
| * [[:Category:CPC_H01L23/49861|H01L23/49861]] ({Lead-frames fixed on or encapsulated in insulating substrates (): 2 patents | | * [[:Category:CPC_H01L25/0655|H01L25/0655]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents |
| * [[:Category:CPC_H01L23/528|H01L23/528]] ({Geometry or} layout of the interconnection structure {(): 2 patents | | * [[:Category:CPC_H01L23/49816|H01L23/49816]] (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate): 2 patents |
| * [[:Category:CPC_H01L23/4006|H01L23/4006]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents | | * [[:Category:CPC_G02B6/12004|G02B6/12004]] (of the integrated circuit kind (electric integrated circuits): 1 patents |
| * [[:Category:CPC_H01L2224/08145|H01L2224/08145]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents | | * [[:Category:CPC_G02B6/12|G02B6/12]] (of the integrated circuit kind (electric integrated circuits): 1 patents |
| * [[:Category:CPC_H01L2224/2919|H01L2224/2919]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents | | * [[:Category:CPC_G02B6/1228|G02B6/1228]] (of the integrated circuit kind (electric integrated circuits): 1 patents |
| * [[:Category:CPC_H01L2924/1437|H01L2924/1437]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents | | * [[:Category:CPC_G02B6/13|G02B6/13]] (OPTICAL ELEMENTS, SYSTEMS OR APPARATUS): 1 patents |
| * [[:Category:CPC_H01L2224/04105|H01L2224/04105]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents | | * [[:Category:CPC_G02B6/4202|G02B6/4202]] (Coupling light guides with opto-electronic elements): 1 patents |
| * [[:Category:CPC_H01L2224/12105|H01L2224/12105]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents | | * [[:Category:CPC_G02B6/4274|G02B6/4274]] (Coupling light guides with opto-electronic elements): 1 patents |
| * [[:Category:CPC_H01L2224/73267|H01L2224/73267]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents | | * [[:Category:CPC_H01L21/7684|H01L21/7684]] (Applying interconnections to be used for carrying current between separate components within a device {comprising conductors and dielectrics}): 1 patents |
| * [[:Category:CPC_H01L2224/175|H01L2224/175]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | | * [[:Category:CPC_H01L24/16|H01L24/16]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents |
| * [[:Category:CPC_H01L2224/81224|H01L2224/81224]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | | * [[:Category:CPC_H01L2224/16055|H01L2224/16055]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents |
| | * [[:Category:CPC_H01L2224/16112|H01L2224/16112]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents |
| * [[:Category:CPC_H01L2224/16148|H01L2224/16148]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | | * [[:Category:CPC_H01L2224/16148|H01L2224/16148]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents |
| * [[:Category:CPC_H01L2224/48229|H01L2224/48229]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| | * [[:Category:CPC_H01L2924/19033|H01L2924/19033]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents |
| * [[:Category:CPC_H01L2224/95001|H01L2224/95001]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| | * [[:Category:CPC_G02B6/4214|G02B6/4214]] (Coupling light guides with opto-electronic elements): 1 patents |
| * [[:Category:CPC_H01L2225/06513|H01L2225/06513]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| | * [[:Category:CPC_H01L21/266|H01L21/266]] (using masks {(): 1 patents |
| * [[:Category:CPC_H01L2225/06524|H01L2225/06524]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| | * [[:Category:CPC_H01L21/76254|H01L21/76254]] (Dielectric regions {, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers}): 1 patents |
| * [[:Category:CPC_H01L2225/06544|H01L2225/06544]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| | * [[:Category:CPC_H01L27/0688|H01L27/0688]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents |
| * [[:Category:CPC_H01L2924/37001|H01L2924/37001]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | | * [[:Category:CPC_H01L25/0652|H01L25/0652]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents |
| * [[:Category:CPC_G02B6/122|G02B6/122]] (of the integrated circuit kind (electric integrated circuits): 1 patents | | * [[:Category:CPC_H01L21/4857|H01L21/4857]] (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 1 patents |
| * [[:Category:CPC_G02B6/12019|G02B6/12019]] (of the integrated circuit kind (electric integrated circuits): 1 patents
| | * [[:Category:CPC_H01L21/56|H01L21/56]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents |
| * [[:Category:CPC_G02B6/4243|G02B6/4243]] (Coupling light guides with opto-electronic elements): 1 patents
| | * [[:Category:CPC_H01L23/3135|H01L23/3135]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents |
| * [[:Category:CPC_H01L21/6835|H01L21/6835]] ({using temporarily an auxiliary support}): 1 patents | | * [[:Category:CPC_H01L23/5385|H01L23/5385]] (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({): 1 patents |
| * [[:Category:CPC_H01L23/147|H01L23/147]] ({Semiconductor insulating substrates (semiconductor conductive substrates): 1 patents
| | * [[:Category:CPC_H01L23/3185|H01L23/3185]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents |
| * [[:Category:CPC_H01S5/02315|H01S5/02315]] (Support members, e.g. bases or carriers): 1 patents | | * [[:Category:CPC_H01L23/53228|H01L23/53228]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents |
| * [[:Category:CPC_H01S5/0232|H01S5/0232]] (Lead-frames): 1 patents
| | * [[:Category:CPC_H01L23/5386|H01L23/5386]] (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({): 1 patents |
| * [[:Category:CPC_H01S5/02345|H01S5/02345]] (DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL): 1 patents
| | * [[:Category:CPC_H01L24/09|H01L24/09]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents |
| * [[:Category:CPC_H01S5/028|H01S5/028]] (DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL): 1 patents | | * [[:Category:CPC_H01L24/17|H01L24/17]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents |
| * [[:Category:CPC_H01L2224/48225|H01L2224/48225]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| | * [[:Category:CPC_H05K1/0271|H05K1/0271]] (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents |
| * [[:Category:CPC_H01L23/3736|H01L23/3736]] ({Metallic materials (): 1 patents | | * [[:Category:CPC_H05K1/0298|H05K1/0298]] (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents |
| * [[:Category:CPC_H01L2224/29124|H01L2224/29124]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| | * [[:Category:CPC_H01L2224/02373|H01L2224/02373]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents |
| * [[:Category:CPC_H01L2224/29147|H01L2224/29147]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | | * [[:Category:CPC_H01L21/52|H01L21/52]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents |
| * [[:Category:CPC_H01L2224/29155|H01L2224/29155]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | | * [[:Category:CPC_H01L21/563|H01L21/563]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents |
| * [[:Category:CPC_H01L2224/29166|H01L2224/29166]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| | * [[:Category:CPC_H01L24/20|H01L24/20]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents |
| * [[:Category:CPC_H01L2224/29172|H01L2224/29172]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| | * [[:Category:CPC_H01L21/565|H01L21/565]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents |
| * [[:Category:CPC_G02B6/262|G02B6/262]] (Optical coupling means (): 1 patents
| | * [[:Category:CPC_H01L21/568|H01L21/568]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents |
| * [[:Category:CPC_G02B2006/12102|G02B2006/12102]] (OPTICAL ELEMENTS, SYSTEMS OR APPARATUS): 1 patents
| | * [[:Category:CPC_H01L23/4006|H01L23/4006]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents |
| * [[:Category:CPC_G02B6/30|G02B6/30]] (OPTICAL ELEMENTS, SYSTEMS OR APPARATUS): 1 patents
| | * [[:Category:CPC_H01L24/19|H01L24/19]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents |
| * [[:Category:CPC_H01L23/3171|H01L23/3171]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | | * [[:Category:CPC_H01L2023/4031|H01L2023/4031]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents |
| * [[:Category:CPC_H01L23/5283|H01L23/5283]] ({Geometry or} layout of the interconnection structure {(): 1 patents | | * [[:Category:CPC_H01L2023/405|H01L2023/405]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents |
| * [[:Category:CPC_H01L23/525|H01L23/525]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | | * [[:Category:CPC_H01L2023/4087|H01L2023/4087]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents |
| * [[:Category:CPC_H01L23/293|H01L23/293]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | |
| * [[:Category:CPC_H01L23/3192|H01L23/3192]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | |
| * [[:Category:CPC_H01L23/5225|H01L23/5225]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | |
| * [[:Category:CPC_H01L23/5329|H01L23/5329]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | |
| * [[:Category:CPC_H01L23/552|H01L23/552]] (Protection against radiation, e.g. light {or electromagnetic waves}): 1 patents | |
| * [[:Category:CPC_H01L24/11|H01L24/11]] ({Manufacturing methods (for bumps on insulating substrates): 1 patents | |
| * [[:Category:CPC_H01L23/5286|H01L23/5286]] ({Geometry or} layout of the interconnection structure {(): 1 patents
| |
| * [[:Category:CPC_G02B6/4295|G02B6/4295]] (Coupling light guides with opto-electronic elements): 1 patents
| |
| * [[:Category:CPC_H01L2224/02381|H01L2224/02381]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | |
| * [[:Category:CPC_H01L21/4878|H01L21/4878]] (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 1 patents | |
| * [[:Category:CPC_H01L23/315|H01L23/315]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | |
| * [[:Category:CPC_H01L2224/16235|H01L2224/16235]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | |
| * [[:Category:CPC_H01L2224/83359|H01L2224/83359]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | |
| * [[:Category:CPC_H01L2021/60022|H01L2021/60022]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | |
| * [[:Category:CPC_H01L23/49866|H01L23/49866]] ({characterised by the materials (materials of the substrates): 1 patents | |
| * [[:Category:CPC_H01L23/49894|H01L23/49894]] (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate): 1 patents
| |
| * [[:Category:CPC_H01L2224/16227|H01L2224/16227]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| |
| * [[:Category:CPC_H01L23/14|H01L23/14]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | |
| * [[:Category:CPC_H01L2224/8234|H01L2224/8234]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | |
| * [[:Category:CPC_H01L2924/35|H01L2924/35]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | |
| * [[:Category:CPC_H01L2224/0401|H01L2224/0401]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | |
| * [[:Category:CPC_H01L2224/211|H01L2224/211]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | | * [[:Category:CPC_H01L2224/211|H01L2224/211]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents |
| * [[:Category:CPC_H01L2224/2101|H01L2224/2101]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| |
| * [[:Category:CPC_H01L2224/2902|H01L2224/2902]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| |
| * [[:Category:CPC_H01L2224/14104|H01L2224/14104]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| |
| * [[:Category:CPC_H01L2224/8134|H01L2224/8134]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| |
| * [[:Category:CPC_H04B10/50|H04B10/50]] (Transmitters): 1 patents
| |
| * [[:Category:CPC_H01L2224/08225|H01L2224/08225]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| |
| * [[:Category:CPC_H01L21/4882|H01L21/4882]] (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 1 patents
| |
| * [[:Category:CPC_H01L23/44|H01L23/44]] (the complete device being wholly immersed in a fluid other than air {(): 1 patents
| |
| * [[:Category:CPC_H01L23/3735|H01L23/3735]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| |
| * [[:Category:CPC_H01L2924/16196|H01L2924/16196]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| |
| * [[:Category:CPC_H01L2924/16235|H01L2924/16235]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| |
| * [[:Category:CPC_H01L2924/16587|H01L2924/16587]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| |
| * [[:Category:CPC_H01L2224/29187|H01L2224/29187]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| |
| * [[:Category:CPC_H01L2224/82896|H01L2224/82896]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| |
| * [[:Category:CPC_H01L2224/02379|H01L2224/02379]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| |
| * [[:Category:CPC_H01L23/544|H01L23/544]] (Marks applied to semiconductor devices {or parts}, e.g. registration marks, {alignment structures, wafer maps (test patterns for characterising or monitoring manufacturing processes): 1 patents
| |
| * [[:Category:CPC_H01L21/76895|H01L21/76895]] (Applying interconnections to be used for carrying current between separate components within a device {comprising conductors and dielectrics}): 1 patents
| |
| * [[:Category:CPC_H01L21/77|H01L21/77]] (Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate (electrically programmable read-only memories or multistep manufacturing processes therefor): 1 patents
| |
| * [[:Category:CPC_H01L2224/02311|H01L2224/02311]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| |
| * [[:Category:CPC_H01L2224/02313|H01L2224/02313]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| |
| * [[:Category:CPC_H01L2224/0239|H01L2224/0239]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| |
| * [[:Category:CPC_H01L23/5381|H01L23/5381]] (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({): 1 patents
| |
| * [[:Category:CPC_H01L21/486|H01L21/486]] (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 1 patents
| |
| * [[:Category:CPC_H01L2224/16146|H01L2224/16146]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| |
| * [[:Category:CPC_H01L2224/16165|H01L2224/16165]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| |
| * [[:Category:CPC_H01L2224/818|H01L2224/818]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| |
| * [[:Category:CPC_H01L2924/1434|H01L2924/1434]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| |
| * [[:Category:CPC_G02B6/43|G02B6/43]] (Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections): 1 patents
| |
| * [[:Category:CPC_G02B6/4204|G02B6/4204]] (Coupling light guides with opto-electronic elements): 1 patents
| |
| * [[:Category:CPC_G02B6/4253|G02B6/4253]] (Coupling light guides with opto-electronic elements): 1 patents
| |
| * [[:Category:CPC_G02B2006/12123|G02B2006/12123]] (OPTICAL ELEMENTS, SYSTEMS OR APPARATUS): 1 patents
| |
| * [[:Category:CPC_H01L2224/05022|H01L2224/05022]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| |
| * [[:Category:CPC_H01L2224/05124|H01L2224/05124]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| |
| * [[:Category:CPC_H01L2224/05562|H01L2224/05562]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| |
| * [[:Category:CPC_H01L2224/05571|H01L2224/05571]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| |
| * [[:Category:CPC_H01L2224/05624|H01L2224/05624]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| |
| * [[:Category:CPC_H01L2224/05647|H01L2224/05647]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| |
| * [[:Category:CPC_H01L2224/05666|H01L2224/05666]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| |
| * [[:Category:CPC_H01L2224/05684|H01L2224/05684]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| |
| * [[:Category:CPC_H01L2224/08147|H01L2224/08147]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| |
| * [[:Category:CPC_H01L2224/08237|H01L2224/08237]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| |
| * [[:Category:CPC_H01L2224/13109|H01L2224/13109]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| |
| * [[:Category:CPC_H01L2224/13111|H01L2224/13111]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| |
| * [[:Category:CPC_H01L2224/13116|H01L2224/13116]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| |
| * [[:Category:CPC_H01L2224/13124|H01L2224/13124]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| |
| * [[:Category:CPC_H01L2224/13139|H01L2224/13139]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| |
| * [[:Category:CPC_H01L2224/13144|H01L2224/13144]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| |
| * [[:Category:CPC_H01L2224/13147|H01L2224/13147]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| |
| * [[:Category:CPC_H01L2224/13155|H01L2224/13155]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| |
| * [[:Category:CPC_H01L2224/13164|H01L2224/13164]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| |
| * [[:Category:CPC_H01L2224/80357|H01L2224/80357]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| |
| * [[:Category:CPC_H01L2224/80379|H01L2224/80379]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| |
| * [[:Category:CPC_H01L2924/0504|H01L2924/0504]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| |
| * [[:Category:CPC_H01L2924/0544|H01L2924/0544]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| |
| * [[:Category:CPC_H01L2924/05494|H01L2924/05494]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| |
| * [[:Category:CPC_H01L2924/0665|H01L2924/0665]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| |
| * [[:Category:CPC_H01L2924/07025|H01L2924/07025]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| |
| * [[:Category:CPC_H01L2924/1432|H01L2924/1432]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| |
| * [[:Category:CPC_H01L2924/14361|H01L2924/14361]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| |
| * [[:Category:CPC_G02B6/0006|G02B6/0006]] (Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings): 1 patents
| |
| * [[:Category:CPC_G02B6/124|G02B6/124]] (of the integrated circuit kind (electric integrated circuits): 1 patents
| |
| * [[:Category:CPC_G02B6/4244|G02B6/4244]] (Coupling light guides with opto-electronic elements): 1 patents
| |
| * [[:Category:CPC_G02B6/4283|G02B6/4283]] (Coupling light guides with opto-electronic elements): 1 patents
| |
| * [[:Category:CPC_H01L23/367|H01L23/367]] (Cooling facilitated by shape of device {(): 1 patents
| |
| * [[:Category:CPC_H01L23/4012|H01L23/4012]] ({for stacked arrangements of a plurality of semiconductor devices (assemblies per se): 1 patents
| |
| * [[:Category:CPC_H01L23/50|H01L23/50]] (for integrated circuit devices, {e.g. power bus, number of leads} (): 1 patents
| |
| * [[:Category:CPC_H01L2224/04042|H01L2224/04042]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| |
| * [[:Category:CPC_H01L2224/48091|H01L2224/48091]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| |
| * [[:Category:CPC_H01L2224/48227|H01L2224/48227]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| |
| * [[:Category:CPC_H01L2224/73265|H01L2224/73265]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| |
| * [[:Category:CPC_H01L2224/81385|H01L2224/81385]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| |
| * [[:Category:CPC_H01L2924/00014|H01L2924/00014]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| |
| * [[:Category:CPC_H01L2924/14|H01L2924/14]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| |
| * [[:Category:CPC_H01L2924/15311|H01L2924/15311]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| |
| * [[:Category:CPC_H01L2924/181|H01L2924/181]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| |
| * [[:Category:CPC_H01L21/481|H01L21/481]] (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 1 patents
| |
| * [[:Category:CPC_H01L24/92|H01L24/92]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| |
| * [[:Category:CPC_H01L2224/08146|H01L2224/08146]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| |
| * [[:Category:CPC_H01L2224/33505|H01L2224/33505]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| |
| * [[:Category:CPC_H01L2224/33519|H01L2224/33519]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| |
| * [[:Category:CPC_H01L2224/80006|H01L2224/80006]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| |
| * [[:Category:CPC_H01L2224/8083|H01L2224/8083]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| |
| * [[:Category:CPC_H01L2224/83005|H01L2224/83005]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| |
| * [[:Category:CPC_H01L2224/8383|H01L2224/8383]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| |
| * [[:Category:CPC_H01L2224/83896|H01L2224/83896]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| |
| * [[:Category:CPC_H01L2224/92142|H01L2224/92142]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| |
| * [[:Category:CPC_H01L2225/06541|H01L2225/06541]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| |
| * [[:Category:CPC_H01L2225/06589|H01L2225/06589]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| |
| * [[:Category:CPC_H01L2224/023|H01L2224/023]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| |
| * [[:Category:CPC_H01L2225/107|H01L2225/107]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| |
| * [[:Category:CPC_H01L21/568|H01L21/568]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| |
| * [[:Category:CPC_H01L21/76877|H01L21/76877]] ({Thin films associated with contacts of capacitors}): 1 patents
| |
| * [[:Category:CPC_H01L2224/19|H01L2224/19]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| |
| * [[:Category:CPC_H01L2224/83101|H01L2224/83101]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| |
| * [[:Category:CPC_H01L2224/92244|H01L2224/92244]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| |
| * [[:Category:CPC_H01L2224/97|H01L2224/97]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| |
| * [[:Category:CPC_H01L2924/18162|H01L2924/18162]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| |
| * [[:Category:CPC_H01L21/4871|H01L21/4871]] (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 1 patents
| |
| * [[:Category:CPC_H01L21/78|H01L21/78]] (with subsequent division of the substrate into plural individual devices (cutting to change the surface-physical characteristics or shape of semiconductor bodies): 1 patents
| |
| * [[:Category:CPC_H01L22/12|H01L22/12]] ({for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions (electrical measurement of diffusions): 1 patents
| |
| * [[:Category:CPC_H01L2924/19103|H01L2924/19103]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| |
|
| |
|
| === Companies === | | === Companies === |
| Line 272: |
Line 66: |
|
| |
|
| ==== List of Companies ==== | | ==== List of Companies ==== |
| * Taiwan Semiconductor Manufacturing Co., Ltd.: 43 patents | | * Taiwan Semiconductor Manufacturing Company, Ltd.: 9 patents |
|
| |
|
| === Collaborators === | | === Collaborators === |
| * [[:Category:Jiun Yi Wu|Jiun Yi Wu]][[Category:Jiun Yi Wu]] (9 collaborations)
| | * [[:Category:Chung-Shi Liu|Chung-Shi Liu]][[Category:Chung-Shi Liu]] (5 collaborations) |
| * [[:Category:Hsing-Kuo Hsia|Hsing-Kuo Hsia]][[Category:Hsing-Kuo Hsia]] (8 collaborations)
| | * [[:Category:Hao-Yi Tsai|Hao-Yi Tsai]][[Category:Hao-Yi Tsai]] (4 collaborations) |
| * [[:Category:Chung-Shi Liu|Chung-Shi Liu]][[Category:Chung-Shi Liu]] (6 collaborations) | | * [[:Category:Chung-Hao Tsai|Chung-Hao Tsai]][[Category:Chung-Hao Tsai]] (2 collaborations) |
| * [[:Category:Jui Lin Chao|Jui Lin Chao]][[Category:Jui Lin Chao]] (6 collaborations)
| | * [[:Category:Chung-Ming Weng|Chung-Ming Weng]][[Category:Chung-Ming Weng]] (2 collaborations) |
| * [[:Category:Szu-Wei Lu|Szu-Wei Lu]][[Category:Szu-Wei Lu]] (5 collaborations)
| |
| * [[:Category:Chuei-Tang Wang|Chuei-Tang Wang]][[Category:Chuei-Tang Wang]] (5 collaborations)
| |
| * [[:Category:Chung-Hao Tsai|Chung-Hao Tsai]][[Category:Chung-Hao Tsai]] (4 collaborations)
| |
| * [[:Category:Wei-Yu Chen|Wei-Yu Chen]][[Category:Wei-Yu Chen]] (3 collaborations)
| |
| * [[:Category:Shang-Yun Hou|Shang-Yun Hou]][[Category:Shang-Yun Hou]] (3 collaborations)
| |
| * [[:Category:Chih-Wei Tseng|Chih-Wei Tseng]][[Category:Chih-Wei Tseng]] (3 collaborations)
| |
| * [[:Category:Ming-Fa Chen|Ming-Fa Chen]][[Category:Ming-Fa Chen]] (3 collaborations)
| |
| * [[:Category:Hung-Yi Kuo|Hung-Yi Kuo]][[Category:Hung-Yi Kuo]] (3 collaborations)
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| * [[:Category:Hao-Yi Tsai|Hao-Yi Tsai]][[Category:Hao-Yi Tsai]] (3 collaborations) | |
| * [[:Category:Tin-Hao Kuo|Tin-Hao Kuo]][[Category:Tin-Hao Kuo]] (3 collaborations) | |
| * [[:Category:Tung-Liang Shao|Tung-Liang Shao]][[Category:Tung-Liang Shao]] (3 collaborations)
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| * [[:Category:Yu-Sheng Huang|Yu-Sheng Huang]][[Category:Yu-Sheng Huang]] (3 collaborations)
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| * [[:Category:Chi-Hsi Wu|Chi-Hsi Wu]][[Category:Chi-Hsi Wu]] (2 collaborations)
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| * [[:Category:Hsien-Pin Hu|Hsien-Pin Hu]][[Category:Hsien-Pin Hu]] (2 collaborations)
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| * [[:Category:Jing-Cheng Lin|Jing-Cheng Lin]][[Category:Jing-Cheng Lin]] (2 collaborations)
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| * [[:Category:Yung-Chi Lin|Yung-Chi Lin]][[Category:Yung-Chi Lin]] (2 collaborations) | |
| * [[:Category:Kuo-Chung Yee|Kuo-Chung Yee]][[Category:Kuo-Chung Yee]] (2 collaborations)
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| * [[:Category:Chung-Ju Lee|Chung-Ju Lee]][[Category:Chung-Ju Lee]] (2 collaborations)
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| * [[:Category:Cheng-Chieh Hsieh|Cheng-Chieh Hsieh]][[Category:Cheng-Chieh Hsieh]] (2 collaborations) | | * [[:Category:Cheng-Chieh Hsieh|Cheng-Chieh Hsieh]][[Category:Cheng-Chieh Hsieh]] (2 collaborations) |
| * [[:Category:An-Jhih Su|An-Jhih Su]][[Category:An-Jhih Su]] (2 collaborations) | | * [[:Category:Hung-Yi Kuo|Hung-Yi Kuo]][[Category:Hung-Yi Kuo]] (2 collaborations) |
| * [[:Category:Chao-Wen Shih|Chao-Wen Shih]][[Category:Chao-Wen Shih]] (2 collaborations) | | * [[:Category:Tsung-Yuan Yu|Tsung-Yuan Yu]][[Category:Tsung-Yuan Yu]] (2 collaborations) |
| * [[:Category:Chien-Hsun Lee|Chien-Hsun Lee]][[Category:Chien-Hsun Lee]] (2 collaborations) | | * [[:Category:Hua-Kuei Lin|Hua-Kuei Lin]][[Category:Hua-Kuei Lin]] (2 collaborations) |
| * [[:Category:Hsien-Wei Chen|Hsien-Wei Chen]][[Category:Hsien-Wei Chen]] (2 collaborations) | | * [[:Category:Tin-Hao Kuo|Tin-Hao Kuo]][[Category:Tin-Hao Kuo]] (2 collaborations) |
| * [[:Category:Jie Chen|Jie Chen]][[Category:Jie Chen]] (2 collaborations) | | * [[:Category:Chih-Chieh Chang|Chih-Chieh Chang]][[Category:Chih-Chieh Chang]] (1 collaborations) |
| * [[:Category:Wen-Chih Chiou|Wen-Chih Chiou]][[Category:Wen-Chih Chiou]] (2 collaborations)
| | * [[:Category:Chuei-Tang Wang|Chuei-Tang Wang]][[Category:Chuei-Tang Wang]] (1 collaborations) |
| * [[:Category:Chia-Shen Cheng|Chia-Shen Cheng]][[Category:Chia-Shen Cheng]] (1 collaborations)
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| * [[:Category:Hao-Jan Pei|Hao-Jan Pei]][[Category:Hao-Jan Pei]] (1 collaborations) | |
| * [[:Category:Philip Yu-Shuan Chung|Philip Yu-Shuan Chung]][[Category:Philip Yu-Shuan Chung]] (1 collaborations)
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| * [[:Category:Kuei-Wei Huang|Kuei-Wei Huang]][[Category:Kuei-Wei Huang]] (1 collaborations)
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| * [[:Category:Yu-Peng Tsai|Yu-Peng Tsai]][[Category:Yu-Peng Tsai]] (1 collaborations)
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| * [[:Category:Hsiu-Jen Lin|Hsiu-Jen Lin]][[Category:Hsiu-Jen Lin]] (1 collaborations) | | * [[:Category:Hsiu-Jen Lin|Hsiu-Jen Lin]][[Category:Hsiu-Jen Lin]] (1 collaborations) |
| * [[:Category:Ching-Hua Hsieh|Ching-Hua Hsieh]][[Category:Ching-Hua Hsieh]] (1 collaborations) | | * [[:Category:Ming-Che Ho|Ming-Che Ho]][[Category:Ming-Che Ho]] (1 collaborations) |
| * [[:Category:Chin-Chuan Chang|Chin-Chuan Chang]][[Category:Chin-Chuan Chang]] (1 collaborations)
| | * [[:Category:Yu-Hsiang Hu|Yu-Hsiang Hu]][[Category:Yu-Hsiang Hu]] (1 collaborations) |
| * [[:Category:Chih-Hao Yu|Chih-Hao Yu]][[Category:Chih-Hao Yu]] (1 collaborations)
| | * [[:Category:Chewn-Pu Jou|Chewn-Pu Jou]][[Category:Chewn-Pu Jou]] (1 collaborations) |
| * [[:Category:Shih-Peng Tai|Shih-Peng Tai]][[Category:Shih-Peng Tai]] (1 collaborations)
| | * [[:Category:Cheng-Tse Tang|Cheng-Tse Tang]][[Category:Cheng-Tse Tang]] (1 collaborations) |
| * [[:Category:Kuo-Chiang Ting|Kuo-Chiang Ting]][[Category:Kuo-Chiang Ting]] (1 collaborations)
| |
| * [[:Category:Sung-Hui Huang|Sung-Hui Huang]][[Category:Sung-Hui Huang]] (1 collaborations)
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| * [[:Category:Jiun Ren Lai|Jiun Ren Lai]][[Category:Jiun Ren Lai]] (1 collaborations)
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| * [[:Category:Yu-Jen Lien|Yu-Jen Lien]][[Category:Yu-Jen Lien]] (1 collaborations) | |
| * [[:Category:Ke-Han Shen|Ke-Han Shen]][[Category:Ke-Han Shen]] (1 collaborations)
| |
| * [[:Category:Wei-Kong Sheng|Wei-Kong Sheng]][[Category:Wei-Kong Sheng]] (1 collaborations)
| |
| * [[:Category:Tsung-Fu Tsai|Tsung-Fu Tsai]][[Category:Tsung-Fu Tsai]] (1 collaborations)
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| * [[:Category:Chih-Ming Ke|Chih-Ming Ke]][[Category:Chih-Ming Ke]] (1 collaborations)
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| * [[:Category:Han-Ping Pu|Han-Ping Pu]][[Category:Han-Ping Pu]] (1 collaborations) | |
| * [[:Category:Hsin-Yu Pan|Hsin-Yu Pan]][[Category:Hsin-Yu Pan]] (1 collaborations) | |
| * [[:Category:Sen-Kuei Hsu|Sen-Kuei Hsu]][[Category:Sen-Kuei Hsu]] (1 collaborations)
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| * [[:Category:Chih-Hsin Lu|Chih-Hsin Lu]][[Category:Chih-Hsin Lu]] (1 collaborations)
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| * [[:Category:Chin-Her Chien|Chin-Her Chien]][[Category:Chin-Her Chien]] (1 collaborations)
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| * [[:Category:You-Rong Shaw|You-Rong Shaw]][[Category:You-Rong Shaw]] (1 collaborations)
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| * [[:Category:Chia-Chia Lin|Chia-Chia Lin]][[Category:Chia-Chia Lin]] (1 collaborations)
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| * [[:Category:Kuo Yang Wu|Kuo Yang Wu]][[Category:Kuo Yang Wu]] (1 collaborations)
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| * [[:Category:Po-Hao Tsai|Po-Hao Tsai]][[Category:Po-Hao Tsai]] (1 collaborations)
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| * [[:Category:Wei Ling Chang|Wei Ling Chang]][[Category:Wei Ling Chang]] (1 collaborations)
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| * [[:Category:Che-Wei Hsu|Che-Wei Hsu]][[Category:Che-Wei Hsu]] (1 collaborations)
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| * [[:Category:Wen-Hao Cheng|Wen-Hao Cheng]][[Category:Wen-Hao Cheng]] (1 collaborations)
| |
| * [[:Category:Chieh-Yen Chen|Chieh-Yen Chen]][[Category:Chieh-Yen Chen]] (1 collaborations)
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| * [[:Category:Jeng-Nan Hung|Jeng-Nan Hung]][[Category:Jeng-Nan Hung]] (1 collaborations)
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| * [[:Category:Chih-Hang Tung|Chih-Hang Tung]][[Category:Chih-Hang Tung]] (1 collaborations)
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| * [[:Category:Chung-Ming Weng|Chung-Ming Weng]][[Category:Chung-Ming Weng]] (1 collaborations)
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| * [[:Category:Tsung-Yuan Yu|Tsung-Yuan Yu]][[Category:Tsung-Yuan Yu]] (1 collaborations)
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| * [[:Category:Hua-Kuei Lin|Hua-Kuei Lin]][[Category:Hua-Kuei Lin]] (1 collaborations)
| |
| * [[:Category:Che-Hsiang Hsu|Che-Hsiang Hsu]][[Category:Che-Hsiang Hsu]] (1 collaborations) | | * [[:Category:Che-Hsiang Hsu|Che-Hsiang Hsu]][[Category:Che-Hsiang Hsu]] (1 collaborations) |
| * [[:Category:Wei-Kang Hsieh|Wei-Kang Hsieh]][[Category:Wei-Kang Hsieh]] (1 collaborations) | | * [[:Category:Su-Chun Yang|Su-Chun Yang]][[Category:Su-Chun Yang]] (1 collaborations) |
| * [[:Category:Shih-Wei Chen|Shih-Wei Chen]][[Category:Shih-Wei Chen]] (1 collaborations) | | * [[:Category:Jui Hsuan Tsai|Jui Hsuan Tsai]][[Category:Jui Hsuan Tsai]] (1 collaborations) |
| * [[:Category:Yih Wang|Yih Wang]][[Category:Yih Wang]] (1 collaborations) | | * [[:Category:Jih-Churng Twu|Jih-Churng Twu]][[Category:Jih-Churng Twu]] (1 collaborations) |
| * [[:Category:Wei-Ting Chen|Wei-Ting Chen]][[Category:Wei-Ting Chen]] (1 collaborations) | | * [[:Category:Ching-Ho CHIN|Ching-Ho CHIN]][[Category:Ching-Ho CHIN]] (1 collaborations) |
| * [[:Category:Shin-Puu Jeng|Shin-Puu Jeng]][[Category:Shin-Puu Jeng]] (1 collaborations) | | * [[:Category:Chuei-Tang WANG|Chuei-Tang WANG]][[Category:Chuei-Tang WANG]] (1 collaborations) |
| | * [[:Category:Kuo-Chung Yee|Kuo-Chung Yee]][[Category:Kuo-Chung Yee]] (1 collaborations) |
| | * [[:Category:Yu-Chia Lai|Yu-Chia Lai]][[Category:Yu-Chia Lai]] (1 collaborations) |
| | * [[:Category:Po-Yuan Teng|Po-Yuan Teng]][[Category:Po-Yuan Teng]] (1 collaborations) |
| | * [[:Category:Wei-Chih Lai|Wei-Chih Lai]][[Category:Wei-Chih Lai]] (1 collaborations) |
| | * [[:Category:Chien-Chia Chiu|Chien-Chia Chiu]][[Category:Chien-Chia Chiu]] (1 collaborations) |
| * [[:Category:Der-Chyang Yeh|Der-Chyang Yeh]][[Category:Der-Chyang Yeh]] (1 collaborations) | | * [[:Category:Der-Chyang Yeh|Der-Chyang Yeh]][[Category:Der-Chyang Yeh]] (1 collaborations) |
| * [[:Category:Sao-Ling Chiu|Sao-Ling Chiu]][[Category:Sao-Ling Chiu]] (1 collaborations) | | * [[:Category:Cheng-Hsien Hsieh|Cheng-Hsien Hsieh]][[Category:Cheng-Hsien Hsieh]] (1 collaborations) |
| * [[:Category:Wen-Hsin Wei|Wen-Hsin Wei]][[Category:Wen-Hsin Wei]] (1 collaborations) | | * [[:Category:Li-Han Hsu|Li-Han Hsu]][[Category:Li-Han Hsu]] (1 collaborations) |
| * [[:Category:Ping-Kang Huang|Ping-Kang Huang]][[Category:Ping-Kang Huang]] (1 collaborations) | | * [[:Category:Tsung-Shu Lin|Tsung-Shu Lin]][[Category:Tsung-Shu Lin]] (1 collaborations) |
| * [[:Category:Chih-Ta Shen|Chih-Ta Shen]][[Category:Chih-Ta Shen]] (1 collaborations) | | * [[:Category:Wei-Cheng Wu|Wei-Cheng Wu]][[Category:Wei-Cheng Wu]] (1 collaborations) |
| * [[:Category:Ying-Ching Shih|Ying-Ching Shih]][[Category:Ying-Ching Shih]] (1 collaborations)
| | * [[:Category:Yu-Chen Hsu|Yu-Chen Hsu]][[Category:Yu-Chen Hsu]] (1 collaborations) |
| * [[:Category:Tzuan-Horng Liu|Tzuan-Horng Liu]][[Category:Tzuan-Horng Liu]] (1 collaborations)
| |
| * [[:Category:Sung-Feng Yeh|Sung-Feng Yeh]][[Category:Sung-Feng Yeh]] (1 collaborations) | |
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|
| [[Category:Chen-Hua Yu]] | | [[Category:Chen-Hua Yu]] |
| [[Category:Inventors]] | | [[Category:Inventors]] |
| [[Category:Inventors filing patents with Taiwan Semiconductor Manufacturing Co., Ltd.]] | | [[Category:Inventors filing patents with Taiwan Semiconductor Manufacturing Company, Ltd.]] |
