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| === Executive Summary === | | === Executive Summary === |
| Chung-Te Lin is an inventor who has filed 27 patents. Their primary areas of innovation include ELECTRONIC MEMORY DEVICES (8 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (7 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (7 patents), and they have worked with companies such as Taiwan Semiconductor Manufacturing Company, Ltd. (27 patents). Their most frequent collaborators include [[Category:Hai-Ching Chen|Hai-Ching Chen]] (11 collaborations), [[Category:Yu-Ming Lin|Yu-Ming Lin]] (8 collaborations), [[Category:Wu-Wei Tsai|Wu-Wei Tsai]] (6 collaborations). | | Chung-Te Lin is an inventor who has filed 6 patents. Their primary areas of innovation include SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (2 patents), ELECTRONIC MEMORY DEVICES (2 patents), Protection against radiation, e.g. light {or electromagnetic waves} (1 patents), and they have worked with companies such as Taiwan Semiconductor Manufacturing Company, Ltd. (6 patents). Their most frequent collaborators include [[Category:Katherine H. Chiang|Katherine H. Chiang]] (2 collaborations), [[Category:Kuo-Chang Chiang|Kuo-Chang Chiang]] (1 collaborations), [[Category:Katherine Chiang|Katherine Chiang]] (1 collaborations). |
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| === Patent Filing Activity === | | === Patent Filing Activity === |
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| ==== List of Technology Areas ==== | | ==== List of Technology Areas ==== |
| * [[:Category:CPC_H10B51/30|H10B51/30]] (ELECTRONIC MEMORY DEVICES): 8 patents
| | * [[:Category:CPC_H01L29/7869|H01L29/7869]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents |
| * [[:Category:CPC_H01L29/6684|H01L29/6684]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 7 patents | | * [[:Category:CPC_H10B51/20|H10B51/20]] (ELECTRONIC MEMORY DEVICES): 2 patents |
| * [[:Category:CPC_H01L29/78391|H01L29/78391]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 7 patents
| | * [[:Category:CPC_H01L23/552|H01L23/552]] (Protection against radiation, e.g. light {or electromagnetic waves}): 1 patents |
| * [[:Category:CPC_H01L29/66742|H01L29/66742]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 6 patents
| | * [[:Category:CPC_G11C11/4096|G11C11/4096]] (Input/output [I/O] data management or control circuits, e.g. reading or writing circuits, I/O drivers or bit-line switches): 1 patents |
| * [[:Category:CPC_H10B51/20|H10B51/20]] (ELECTRONIC MEMORY DEVICES): 5 patents | | * [[:Category:CPC_H01L23/5283|H01L23/5283]] ({Geometry or} layout of the interconnection structure {(): 1 patents |
| * [[:Category:CPC_H01L29/516|H01L29/516]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 5 patents
| | * [[:Category:CPC_H01L23/5226|H01L23/5226]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents |
| * [[:Category:CPC_H01L29/7869|H01L29/7869]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents
| | * [[:Category:CPC_H10B51/30|H10B51/30]] (ELECTRONIC MEMORY DEVICES): 1 patents |
| * [[:Category:CPC_H01L23/5226|H01L23/5226]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents | | * [[:Category:CPC_H01L29/6684|H01L29/6684]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents |
| * [[:Category:CPC_H01L27/1159|H01L27/1159]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents | | * [[:Category:CPC_H01L29/78391|H01L29/78391]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents |
| * [[:Category:CPC_H01L29/66969|H01L29/66969]] ({of devices having semiconductor bodies not comprising group 14 or group 13/15 materials (comprising selenium or tellurium in uncombined form other than as impurities in semiconductor bodies of other materials, comprising cuprous oxide or cuprous iodide): 3 patents
| | * [[:Category:CPC_H10B51/10|H10B51/10]] (ELECTRONIC MEMORY DEVICES): 1 patents |
| * [[:Category:CPC_H01L27/11597|H01L27/11597]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
| |
| * [[:Category:CPC_H01L29/78696|H01L29/78696]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
| |
| * [[:Category:CPC_H01L29/401|H01L29/401]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
| |
| * [[:Category:CPC_H10B51/10|H10B51/10]] (ELECTRONIC MEMORY DEVICES): 2 patents
| |
| * [[:Category:CPC_H10B51/40|H10B51/40]] (ELECTRONIC MEMORY DEVICES): 2 patents
| |
| * [[:Category:CPC_H10B53/30|H10B53/30]] (ELECTRONIC MEMORY DEVICES): 2 patents
| |
| * [[:Category:CPC_H01L23/5283|H01L23/5283]] ({Geometry or} layout of the interconnection structure {(): 2 patents | |
| * [[:Category:CPC_H01L29/0847|H01L29/0847]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents | |
| * [[:Category:CPC_H10B51/00|H10B51/00]] (Ferroelectric RAM [FeRAM] devices comprising ferroelectric memory transistors): 2 patents | |
| * [[:Category:CPC_H01L27/11587|H01L27/11587]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
| |
| * [[:Category:CPC_H01L27/1207|H01L27/1207]] ({combined with devices in contact with the semiconductor body, i.e. bulk/SOI hybrid circuits}): 2 patents
| |
| * [[:Category:CPC_H01L29/41733|H01L29/41733]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | |
| * [[:Category:CPC_H01L29/42384|H01L29/42384]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | |
| * [[:Category:CPC_H01L21/76876|H01L21/76876]] ({Thin films associated with contacts of capacitors}): 1 patents | |
| * [[:Category:CPC_H01L27/11514|H01L27/11514]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| |
| * [[:Category:CPC_H10B53/20|H10B53/20]] (ELECTRONIC MEMORY DEVICES): 1 patents
| |
| * [[:Category:CPC_H01L21/02178|H01L21/02178]] ({the material being a silicon nitride not containing oxygen, e.g. SixNy or SixByNz (): 1 patents
| |
| * [[:Category:CPC_H01L21/02194|H01L21/02194]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| |
| * [[:Category:CPC_H01L21/0228|H01L21/0228]] ({deposition by cyclic CVD, e.g. ALD, ALE, pulsed CVD}): 1 patents
| |
| * [[:Category:CPC_H10B20/20|H10B20/20]] (Programmable ROM [PROM] devices comprising field-effect components (): 1 patents
| |
| * [[:Category:CPC_G11C17/18|G11C17/18]] (Auxiliary circuits, e.g. for writing into memory): 1 patents
| |
| * [[:Category:CPC_G11C17/16|G11C17/16]] (using electrically-fusible links): 1 patents
| |
| * [[:Category:CPC_H01L28/75|H01L28/75]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| |
| * [[:Category:CPC_H01L2924/1441|H01L2924/1441]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| |
| * [[:Category:CPC_H01L29/78642|H01L29/78642]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| |
| * [[:Category:CPC_H01L27/124|H01L27/124]] (the substrate being other than a semiconductor body, e.g. an insulating body): 1 patents | | * [[:Category:CPC_H01L27/124|H01L27/124]] (the substrate being other than a semiconductor body, e.g. an insulating body): 1 patents |
| * [[:Category:CPC_H01L27/127|H01L27/127]] (the substrate being other than a semiconductor body, e.g. an insulating body): 1 patents
| |
| * [[:Category:CPC_H01L27/1225|H01L27/1225]] (the substrate being other than a semiconductor body, e.g. an insulating body): 1 patents | | * [[:Category:CPC_H01L27/1225|H01L27/1225]] (the substrate being other than a semiconductor body, e.g. an insulating body): 1 patents |
| * [[:Category:CPC_H01L27/1255|H01L27/1255]] (the substrate being other than a semiconductor body, e.g. an insulating body): 1 patents | | * [[:Category:CPC_H01L27/1255|H01L27/1255]] (the substrate being other than a semiconductor body, e.g. an insulating body): 1 patents |
| * [[:Category:CPC_H10B41/23|H10B41/23]] (ELECTRONIC MEMORY DEVICES): 1 patents | | * [[:Category:CPC_H01L27/1259|H01L27/1259]] (the substrate being other than a semiconductor body, e.g. an insulating body): 1 patents |
| * [[:Category:CPC_H10B41/27|H10B41/27]] (ELECTRONIC MEMORY DEVICES): 1 patents
| | * [[:Category:CPC_H10B99/00|H10B99/00]] (ELECTRONIC MEMORY DEVICES): 1 patents |
| * [[:Category:CPC_H10B41/35|H10B41/35]] (ELECTRONIC MEMORY DEVICES): 1 patents
| | * [[:Category:CPC_H10B12/315|H10B12/315]] (ELECTRONIC MEMORY DEVICES): 1 patents |
| * [[:Category:CPC_H10B43/23|H10B43/23]] (ELECTRONIC MEMORY DEVICES): 1 patents
| | * [[:Category:CPC_H10B12/033|H10B12/033]] (ELECTRONIC MEMORY DEVICES): 1 patents |
| * [[:Category:CPC_H10B51/50|H10B51/50]] (ELECTRONIC MEMORY DEVICES): 1 patents
| | * [[:Category:CPC_H10B12/05|H10B12/05]] (ELECTRONIC MEMORY DEVICES): 1 patents |
| * [[:Category:CPC_H01L21/84|H01L21/84]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| | * [[:Category:CPC_H10B12/50|H10B12/50]] (ELECTRONIC MEMORY DEVICES): 1 patents |
| * [[:Category:CPC_H10N50/01|H10N50/01]] (No explanation available): 1 patents
| |
| * [[:Category:CPC_G11C11/161|G11C11/161]] (using elements in which the storage effect is based on magnetic spin effect): 1 patents
| |
| * [[:Category:CPC_H01L21/76832|H01L21/76832]] ({Multiple layers}): 1 patents
| |
| * [[:Category:CPC_H01L21/7684|H01L21/7684]] (Applying interconnections to be used for carrying current between separate components within a device {comprising conductors and dielectrics}): 1 patents
| |
| * [[:Category:CPC_H01L21/76879|H01L21/76879]] ({by selective deposition of conductive material in the vias, e.g. selective C.V.D. on semiconductor material, plating (plating on semiconductors in general): 1 patents
| |
| * [[:Category:CPC_H10B61/00|H10B61/00]] (Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices): 1 patents | |
| * [[:Category:CPC_H10N50/80|H10N50/80]] (No explanation available): 1 patents
| |
| * [[:Category:CPC_H10N50/85|H10N50/85]] (No explanation available): 1 patents
| |
| * [[:Category:CPC_H01L23/5381|H01L23/5381]] (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({): 1 patents
| |
| * [[:Category:CPC_H01L21/4853|H01L21/4853]] (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 1 patents
| |
| * [[:Category:CPC_H01L21/4857|H01L21/4857]] (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 1 patents
| |
| * [[:Category:CPC_H01L21/486|H01L21/486]] (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 1 patents
| |
| * [[:Category:CPC_H01L23/49816|H01L23/49816]] (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate): 1 patents
| |
| * [[:Category:CPC_H01L23/49822|H01L23/49822]] ({Multilayer substrates (multilayer metallisation on monolayer substrate): 1 patents
| |
| * [[:Category:CPC_H01L23/49833|H01L23/49833]] (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate): 1 patents
| |
| * [[:Category:CPC_H01L23/49838|H01L23/49838]] (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate): 1 patents
| |
| * [[:Category:CPC_H01L23/5385|H01L23/5385]] (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({): 1 patents
| |
| * [[:Category:CPC_H01L23/5386|H01L23/5386]] (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({): 1 patents
| |
| * [[:Category:CPC_H01L24/16|H01L24/16]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| |
| * [[:Category:CPC_H01L25/162|H01L25/162]] (the devices being of types provided for in two or more different main groups of groups): 1 patents | |
| * [[:Category:CPC_H01L2224/16225|H01L2224/16225]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| |
| * [[:Category:CPC_H01L2924/1431|H01L2924/1431]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| |
| * [[:Category:CPC_H01L2924/1436|H01L2924/1436]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | |
| * [[:Category:CPC_H01L2924/1443|H01L2924/1443]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| |
| * [[:Category:CPC_H01L29/408|H01L29/408]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| |
| * [[:Category:CPC_H01L29/78648|H01L29/78648]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| |
| * [[:Category:CPC_H01L29/4908|H01L29/4908]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| |
| * [[:Category:CPC_H01L29/78603|H01L29/78603]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| |
| * [[:Category:CPC_H01L27/0705|H01L27/0705]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| |
| * [[:Category:CPC_H10B43/35|H10B43/35]] (ELECTRONIC MEMORY DEVICES): 1 patents
| |
| * [[:Category:CPC_H10B43/10|H10B43/10]] (ELECTRONIC MEMORY DEVICES): 1 patents | |
| * [[:Category:CPC_H10B43/20|H10B43/20]] (ELECTRONIC MEMORY DEVICES): 1 patents | |
| * [[:Category:CPC_H01L2924/1438|H01L2924/1438]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| |
| * [[:Category:CPC_H01L2924/145|H01L2924/145]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| |
| * [[:Category:CPC_G11C11/223|G11C11/223]] ({using MOS with ferroelectric gate insulating film}): 1 patents
| |
| * [[:Category:CPC_G11C11/2275|G11C11/2275]] ({Writing or programming circuits or methods}): 1 patents
| |
| * [[:Category:CPC_H01L27/11568|H01L27/11568]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| |
| * [[:Category:CPC_H01L27/11521|H01L27/11521]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| |
| * [[:Category:CPC_H01L27/228|H01L27/228]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
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| * [[:Category:CPC_H01L27/2436|H01L27/2436]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
| |
| * [[:Category:CPC_G11C16/08|G11C16/08]] (Address circuits; Decoders; Word-line control circuits): 1 patents
| |
| * [[:Category:CPC_G11C11/2257|G11C11/2257]] ({Word-line or row circuits}): 1 patents
| |
| * [[:Category:CPC_G11C11/1657|G11C11/1657]] ({Word-line or row circuits}): 1 patents
| |
| * [[:Category:CPC_G11C13/0028|G11C13/0028]] ({Word-line or row circuits}): 1 patents
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| === Companies === | | === Companies === |
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| ==== List of Companies ==== | | ==== List of Companies ==== |
| * Taiwan Semiconductor Manufacturing Company, Ltd.: 27 patents | | * Taiwan Semiconductor Manufacturing Company, Ltd.: 6 patents |
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| === Collaborators === | | === Collaborators === |
| * [[:Category:Hai-Ching Chen|Hai-Ching Chen]][[Category:Hai-Ching Chen]] (11 collaborations) | | * [[:Category:Katherine H. Chiang|Katherine H. Chiang]][[Category:Katherine H. Chiang]] (2 collaborations) |
| * [[:Category:Yu-Ming Lin|Yu-Ming Lin]][[Category:Yu-Ming Lin]] (8 collaborations)
| | * [[:Category:Kuo-Chang Chiang|Kuo-Chang Chiang]][[Category:Kuo-Chang Chiang]] (1 collaborations) |
| * [[:Category:Wu-Wei Tsai|Wu-Wei Tsai]][[Category:Wu-Wei Tsai]] (6 collaborations)
| | * [[:Category:Katherine Chiang|Katherine Chiang]][[Category:Katherine Chiang]] (1 collaborations) |
| * [[:Category:Sheng-Chih Lai|Sheng-Chih Lai]][[Category:Sheng-Chih Lai]] (6 collaborations)
| | * [[:Category:Chen-Jun Wu|Chen-Jun Wu]][[Category:Chen-Jun Wu]] (1 collaborations) |
| * [[:Category:Feng-Cheng Yang|Feng-Cheng Yang]][[Category:Feng-Cheng Yang]] (5 collaborations)
| | * [[:Category:Yun-Feng Kao|Yun-Feng Kao]][[Category:Yun-Feng Kao]] (1 collaborations) |
| * [[:Category:Po-Ting Lin|Po-Ting Lin]][[Category:Po-Ting Lin]] (4 collaborations)
| | * [[:Category:Sheng-Chih Lai|Sheng-Chih Lai]][[Category:Sheng-Chih Lai]] (1 collaborations) |
| * [[:Category:Yu-Ming Hsiang|Yu-Ming Hsiang]][[Category:Yu-Ming Hsiang]] (4 collaborations)
| | * [[:Category:Li-Shyue Lai|Li-Shyue Lai]][[Category:Li-Shyue Lai]] (1 collaborations) |
| * [[:Category:Yan-Yi Chen|Yan-Yi Chen]][[Category:Yan-Yi Chen]] (4 collaborations)
| |
| * [[:Category:Kuo-Chang Chiang|Kuo-Chang Chiang]][[Category:Kuo-Chang Chiang]] (4 collaborations) | |
| * [[:Category:Song-Fu Liao|Song-Fu Liao]][[Category:Song-Fu Liao]] (3 collaborations)
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| * [[:Category:Yu-Wei Jiang|Yu-Wei Jiang]][[Category:Yu-Wei Jiang]] (3 collaborations)
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| * [[:Category:Chien-Hua Huang|Chien-Hua Huang]][[Category:Chien-Hua Huang]] (2 collaborations)
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| * [[:Category:Chia-Yu Ling|Chia-Yu Ling]][[Category:Chia-Yu Ling]] (2 collaborations)
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| * [[:Category:Kai-Wen Cheng|Kai-Wen Cheng]][[Category:Kai-Wen Cheng]] (2 collaborations)
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| * [[:Category:Sai-Hooi Yeong|Sai-Hooi Yeong]][[Category:Sai-Hooi Yeong]] (2 collaborations)
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| * [[:Category:Han-Ting Tsai|Han-Ting Tsai]][[Category:Han-Ting Tsai]] (2 collaborations)
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| * [[:Category:Ya-Ling Lee|Ya-Ling Lee]][[Category:Ya-Ling Lee]] (2 collaborations)
| |
| * [[:Category:Wei-Chih Wen|Wei-Chih Wen]][[Category:Wei-Chih Wen]] (2 collaborations)
| |
| * [[:Category:Katherine H CHIANG|Katherine H CHIANG]][[Category:Katherine H CHIANG]] (2 collaborations) | |
| * [[:Category:Pin-Cheng Hsu|Pin-Cheng Hsu]][[Category:Pin-Cheng Hsu]] (2 collaborations)
| |
| * [[:Category:Yen-Chieh Huang|Yen-Chieh Huang]][[Category:Yen-Chieh Huang]] (2 collaborations)
| |
| * [[:Category:Chieh-Fang Chen|Chieh-Fang Chen]][[Category:Chieh-Fang Chen]] (2 collaborations)
| |
| * [[:Category:Chen-Jun Wu|Chen-Jun Wu]][[Category:Chen-Jun Wu]] (2 collaborations) | |
| * [[:Category:Yi-Cheng Chu|Yi-Cheng Chu]][[Category:Yi-Cheng Chu]] (1 collaborations) | |
| * [[:Category:Katherine H. CHIANG|Katherine H. CHIANG]][[Category:Katherine H. CHIANG]] (1 collaborations) | |
| * [[:Category:Rainer Yen-Chieh Huang|Rainer Yen-Chieh Huang]][[Category:Rainer Yen-Chieh Huang]] (1 collaborations) | |
| * [[:Category:Chien-Hao Huang|Chien-Hao Huang]][[Category:Chien-Hao Huang]] (1 collaborations) | | * [[:Category:Chien-Hao Huang|Chien-Hao Huang]][[Category:Chien-Hao Huang]] (1 collaborations) |
| * [[:Category:Gao-Ming Wu|Gao-Ming Wu]][[Category:Gao-Ming Wu]] (1 collaborations) | | * [[:Category:Chia-Yu Ling|Chia-Yu Ling]][[Category:Chia-Yu Ling]] (1 collaborations) |
| | * [[:Category:Katherine H CHIANG|Katherine H CHIANG]][[Category:Katherine H CHIANG]] (1 collaborations) |
| | * [[:Category:Chieh-Fang Chen|Chieh-Fang Chen]][[Category:Chieh-Fang Chen]] (1 collaborations) |
| | * [[:Category:Feng-Cheng Yang|Feng-Cheng Yang]][[Category:Feng-Cheng Yang]] (1 collaborations) |
| | * [[:Category:I-Che Lee|I-Che Lee]][[Category:I-Che Lee]] (1 collaborations) |
| | * [[:Category:Huai-Ying Huang|Huai-Ying Huang]][[Category:Huai-Ying Huang]] (1 collaborations) |
| | * [[:Category:Yen-Chieh Huang|Yen-Chieh Huang]][[Category:Yen-Chieh Huang]] (1 collaborations) |
| * [[:Category:Wei-Gang Chiu|Wei-Gang Chiu]][[Category:Wei-Gang Chiu]] (1 collaborations) | | * [[:Category:Wei-Gang Chiu|Wei-Gang Chiu]][[Category:Wei-Gang Chiu]] (1 collaborations) |
| * [[:Category:Ming-Yi Yang|Ming-Yi Yang]][[Category:Ming-Yi Yang]] (1 collaborations) | | * [[:Category:Kai-Wen Cheng|Kai-Wen Cheng]][[Category:Kai-Wen Cheng]] (1 collaborations) |
| * [[:Category:Yin-Hao Wu|Yin-Hao Wu]][[Category:Yin-Hao Wu]] (1 collaborations)
| | * [[:Category:Yu-Ming Lin|Yu-Ming Lin]][[Category:Yu-Ming Lin]] (1 collaborations) |
| * [[:Category:Yu-Chuan Shih|Yu-Chuan Shih]][[Category:Yu-Chuan Shih]] (1 collaborations)
| |
| * [[:Category:Chun-Chieh Lu|Chun-Chieh Lu]][[Category:Chun-Chieh Lu]] (1 collaborations)
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| * [[:Category:Neil Quinn Murray|Neil Quinn Murray]][[Category:Neil Quinn Murray]] (1 collaborations)
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| * [[:Category:Katherine H. Chiang|Katherine H. Chiang]][[Category:Katherine H. Chiang]] (1 collaborations)
| |
| * [[:Category:Yen-Chung Ho|Yen-Chung Ho]][[Category:Yen-Chung Ho]] (1 collaborations)
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| * [[:Category:Yu-Feng Yin|Yu-Feng Yin]][[Category:Yu-Feng Yin]] (1 collaborations)
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| * [[:Category:Min-Kun Dai|Min-Kun Dai]][[Category:Min-Kun Dai]] (1 collaborations)
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| * [[:Category:Hsin-Yu LAI|Hsin-Yu LAI]][[Category:Hsin-Yu LAI]] (1 collaborations)
| |
| * [[:Category:Hung-Chang Sun|Hung-Chang Sun]][[Category:Hung-Chang Sun]] (1 collaborations)
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| * [[:Category:TsuChing Yang|TsuChing Yang]][[Category:TsuChing Yang]] (1 collaborations)
| |
| * [[:Category:Wen-Ling Lu|Wen-Ling Lu]][[Category:Wen-Ling Lu]] (1 collaborations)
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| * [[:Category:Ya-Yun Cheng|Ya-Yun Cheng]][[Category:Ya-Yun Cheng]] (1 collaborations)
| |
| * [[:Category:Yi-Ching Liu|Yi-Ching Liu]][[Category:Yi-Ching Liu]] (1 collaborations) | |
| * [[:Category:Sun-Yi Chang|Sun-Yi Chang]][[Category:Sun-Yi Chang]] (1 collaborations)
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|
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| [[Category:Chung-Te Lin]] | | [[Category:Chung-Te Lin]] |
| [[Category:Inventors]] | | [[Category:Inventors]] |
| [[Category:Inventors filing patents with Taiwan Semiconductor Manufacturing Company, Ltd.]] | | [[Category:Inventors filing patents with Taiwan Semiconductor Manufacturing Company, Ltd.]] |
