Category:Chih-Hao Wang: Difference between revisions

Latest revision as of 03:45, 28 March 2025

Chih-Hao Wang

Executive Summary

Chih-Hao Wang is an inventor who has filed 6 patents. Their primary areas of innovation include SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (2 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (2 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (1 patents), and they have worked with companies such as Taiwan Semiconductor Manufacturing Company, Ltd. (6 patents). Their most frequent collaborators include (2 collaborations), (2 collaborations), (2 collaborations).

Patent Filing Activity

File:Chih-Hao Wang Monthly Patent Applications.png

Technology Areas

File:Chih-Hao Wang Top Technology Areas.png

List of Technology Areas

H01L29/42392 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
H01L29/78696 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
H01L27/088 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L21/82345 (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents
H01L21/823481 (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents
H01L29/41733 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L29/0665 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L29/263 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L29/401 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L29/41775 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01Q21/0043 ({Slotted waveguides (combination with horns): 1 patents
H01P3/16 (Dielectric waveguides, i.e. without a longitudinal conductor): 1 patents
H01Q1/3233 ({particular used as part of a sensor or in a security system, e.g. for automotive radar, navigation systems}): 1 patents
H01Q13/0233 ({Horns fed by a slotted waveguide array (biconical horns): 1 patents
H01L27/0886 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L21/02603 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L21/30604 (Chemical or electrical treatment, e.g. electrolytic etching (to form insulating layers): 1 patents
H01L21/308 (using masks (): 1 patents
H01L21/823412 (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents
H01L21/823431 (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents
H01L21/823456 (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents
H01L29/0673 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L29/0847 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L29/42376 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L29/66742 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L29/66795 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L29/7851 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L29/78618 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H10D62/116 (No explanation available): 1 patents
H10D30/014 (No explanation available): 1 patents
H10D30/031 (No explanation available): 1 patents
H10D30/43 (No explanation available): 1 patents
H10D30/6757 (No explanation available): 1 patents
H10D62/151 (No explanation available): 1 patents
H10D64/018 (No explanation available): 1 patents
H10D84/017 (No explanation available): 1 patents
H10D84/038 (No explanation available): 1 patents
H10D84/85 (No explanation available): 1 patents
H01L23/5226 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L21/76805 ({the opening being a via or contact hole penetrating the underlying conductor}): 1 patents
H01L21/76814 ({post-treatment or after-treatment, e.g. cleaning or removal of oxides on underlying conductors}): 1 patents
H01L21/76816 ({Aspects relating to the layout of the pattern or to the size of vias or trenches (layout of the interconnections per se): 1 patents
H01L21/76883 ({Post-treatment or after-treatment of the conductive material}): 1 patents
H10D30/6729 (No explanation available): 1 patents
H01L21/02063 ({during, before or after processing of insulating layers}): 1 patents
H10D84/83 (No explanation available): 1 patents

Companies

File:Chih-Hao Wang Top Companies.png

List of Companies

Taiwan Semiconductor Manufacturing Company, Ltd.: 6 patents

Collaborators

Kuo-Cheng Chiang (2 collaborations)
Huan-Chieh Su (2 collaborations)
Chun-Yuan Chen (2 collaborations)
Guan-Lin Chen (1 collaborations)
Jung-Chien Cheng (1 collaborations)
Shi Ning Ju (1 collaborations)
Shih-Chuan Chiu (1 collaborations)
Pei-Yu Wang (1 collaborations)
Cheng-Chi Chuang (1 collaborations)
Li-Zhen Yu (1 collaborations)
Chia-Hao Chang (1 collaborations)
Yu-Ming Lin (1 collaborations)
Kuo-Cheng CHIANG (1 collaborations)
Kuan-Ting Pan (1 collaborations)
Wang-Chun Huang (1 collaborations)
Ching-Wei Tsai (1 collaborations)
Kuan-Lun Cheng (1 collaborations)
Jung-Hung Chang (1 collaborations)
Shih-Cheng Chen (1 collaborations)
Tsung-Han Chuang (1 collaborations)
Wen-Ting Lan (1 collaborations)
Chia-Cheng Tsai (1 collaborations)
Sheng-Tsung Wang (1 collaborations)
Meng-Huan Jao (1 collaborations)

Subcategories

This category has the following 7 subcategories, out of 7 total.

C

► Chih-Hao Wang‎ (7 C)
► Ching-Wei Tsai‎ (4 C)

K

► Kuan-Lun Cheng‎ (5 C)
► Kuo-Cheng Chiang‎ (3 C)
► Kuo-Cheng CHIANG‎ (5 C)

S

► Sai-Hooi Yeong‎ (6 C)

Y

► Yu-Ming Lin‎ (6 C)

@@ Line 2: / Line 2: @@
 === Executive Summary ===
-Chih-Hao Wang is an inventor who has filed 13 patents. Their primary areas of innovation include {using a dummy, i.e. replacement gate in a process wherein at least a part of the final gate is self aligned to the dummy gate} (8 patents), to produce devices, e.g. integrated circuits, each consisting of a plurality of components (5 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (5 patents), and they have worked with companies such as Taiwan Semiconductor Manufacturing Co., Ltd. (13 patents). Their most frequent collaborators include [[Category:Kuan-Lun Cheng|Kuan-Lun Cheng]] (5 collaborations), [[Category:Kuo-Cheng Chiang|Kuo-Cheng Chiang]] (5 collaborations), [[Category:Huan-Chieh Su|Huan-Chieh Su]] (4 collaborations).
+Chih-Hao Wang is an inventor who has filed 6 patents. Their primary areas of innovation include SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (2 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (2 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (1 patents), and they have worked with companies such as Taiwan Semiconductor Manufacturing Company, Ltd. (6 patents). Their most frequent collaborators include [[Category:Kuo-Cheng Chiang|Kuo-Cheng Chiang]] (2 collaborations), [[Category:Huan-Chieh Su|Huan-Chieh Su]] (2 collaborations), [[Category:Chun-Yuan Chen|Chun-Yuan Chen]] (2 collaborations).
 === Patent Filing Activity ===
@@ Line 11: / Line 11: @@
 ==== List of Technology Areas ====
-* [[:Category:CPC_H01L29/66545|H01L29/66545]] ({using a dummy, i.e. replacement gate in a process wherein at least a part of the final gate is self aligned to the dummy gate}): 8 patents
+* [[:Category:CPC_H01L29/42392|H01L29/42392]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
-* [[:Category:CPC_H01L21/823431|H01L21/823431]] (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 5 patents
+* [[:Category:CPC_H01L29/78696|H01L29/78696]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
-* [[:Category:CPC_H01L29/42392|H01L29/42392]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 5 patents
+* [[:Category:CPC_H01L27/088|H01L27/088]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L29/78696|H01L29/78696]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 5 patents
+* [[:Category:CPC_H01L21/82345|H01L21/82345]] (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents
-* [[:Category:CPC_H01L27/0886|H01L27/0886]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents
+* [[:Category:CPC_H01L21/823481|H01L21/823481]] (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents
-* [[:Category:CPC_H01L21/823418|H01L21/823418]] (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 3 patents
+* [[:Category:CPC_H01L29/41733|H01L29/41733]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L21/823437|H01L21/823437]] (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 3 patents
-* [[:Category:CPC_H01L21/02603|H01L21/02603]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
-* [[:Category:CPC_H01L23/5286|H01L23/5286]] ({Geometry or} layout of the interconnection structure {(): 3 patents
-* [[:Category:CPC_H01L29/0673|H01L29/0673]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
-* [[:Category:CPC_H01L29/41733|H01L29/41733]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
-* [[:Category:CPC_H01L29/66553|H01L29/66553]] ({using self aligned silicidation, i.e. salicide  (formation of conductive layers comprising silicides): 3 patents
-* [[:Category:CPC_H01L29/66742|H01L29/66742]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
-* [[:Category:CPC_H01L29/78618|H01L29/78618]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
-* [[:Category:CPC_H01L21/0337|H01L21/0337]] ({characterised by the process involved to create the mask, e.g. lift-off masks, sidewalls, or to modify the mask, e.g. pre-treatment, post-treatment}): 2 patents
-* [[:Category:CPC_H01L29/0649|H01L29/0649]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
-* [[:Category:CPC_H01L29/785|H01L29/785]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
-* [[:Category:CPC_H01L29/66636|H01L29/66636]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
-* [[:Category:CPC_H01L29/7848|H01L29/7848]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
-* [[:Category:CPC_H01L21/823412|H01L21/823412]] (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 2 patents
-* [[:Category:CPC_H01L21/823481|H01L21/823481]] (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 2 patents
-* [[:Category:CPC_H01L29/0653|H01L29/0653]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
-* [[:Category:CPC_H01L29/0847|H01L29/0847]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
-* [[:Category:CPC_H01L27/0924|H01L27/0924]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
-* [[:Category:CPC_H01L29/66795|H01L29/66795]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
-* [[:Category:CPC_H01L29/7851|H01L29/7851]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
-* [[:Category:CPC_H01L29/6656|H01L29/6656]] ({using self aligned silicidation, i.e. salicide  (formation of conductive layers comprising silicides): 2 patents
-* [[:Category:CPC_H01L21/02532|H01L21/02532]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
-* [[:Category:CPC_H01L21/30604|H01L21/30604]] (Chemical or electrical treatment, e.g. electrolytic etching  (to form insulating layers): 2 patents
-* [[:Category:CPC_H01L29/45|H01L29/45]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
-* [[:Category:CPC_H01L27/092|H01L27/092]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
-* [[:Category:CPC_H01L21/823468|H01L21/823468]] (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents
-* [[:Category:CPC_H01L21/7682|H01L21/7682]] (Applying interconnections to be used for carrying current between separate components within a device {comprising conductors and dielectrics}): 1 patents
-* [[:Category:CPC_H01L21/76805|H01L21/76805]] ({the opening being a via or contact hole penetrating the underlying conductor}): 1 patents
-* [[:Category:CPC_H01L21/76895|H01L21/76895]] (Applying interconnections to be used for carrying current between separate components within a device {comprising conductors and dielectrics}): 1 patents
-* [[:Category:CPC_H01L23/5329|H01L23/5329]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L21/823475|H01L21/823475]] (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents
-* [[:Category:CPC_H01L23/535|H01L23/535]] (including internal interconnections, e.g. cross-under constructions {(internal lead connections): 1 patents
-* [[:Category:CPC_H01L29/1037|H01L29/1037]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L29/6681|H01L29/6681]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L29/161|H01L29/161]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L29/165|H01L29/165]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L23/481|H01L23/481]] (Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements {; Selection of materials therefor}): 1 patents
-* [[:Category:CPC_H01L23/53295|H01L23/53295]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L29/66507|H01L29/66507]] ({providing different silicide thicknesses on the gate and on source or drain}): 1 patents
-* [[:Category:CPC_H01L21/76832|H01L21/76832]] ({Multiple layers}): 1 patents
-* [[:Category:CPC_H01L21/76834|H01L21/76834]] ({formation of thin insulating films on the sidewalls or on top of conductors  (): 1 patents
-* [[:Category:CPC_H01L21/02576|H01L21/02576]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L21/02579|H01L21/02579]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L21/31111|H01L21/31111]] ({by chemical means}): 1 patents
-* [[:Category:CPC_H01L21/76897|H01L21/76897]] ({Formation of self-aligned vias or contact plugs, i.e. involving a lithographically uncritical step  (self-aligned silicidation on field effect transistors): 1 patents
-* [[:Category:CPC_H01L21/823871|H01L21/823871]] (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents
-* [[:Category:CPC_H01L21/28518|H01L21/28518]] (from a gas or vapour, e.g. condensation): 1 patents
-* [[:Category:CPC_H01L21/823807|H01L21/823807]] (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents
-* [[:Category:CPC_H01L21/823814|H01L21/823814]] (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents
 * [[:Category:CPC_H01L29/0665|H01L29/0665]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L29/66818|H01L29/66818]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H01L29/263|H01L29/263]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L29/516|H01L29/516]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L21/0206|H01L21/0206]] ({during, before or after processing of insulating layers}): 1 patents
-* [[:Category:CPC_H01L21/823828|H01L21/823828]] (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents
-* [[:Category:CPC_H01L21/823857|H01L21/823857]] (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents
-* [[:Category:CPC_H01L29/42364|H01L29/42364]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L29/513|H01L29/513]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L29/517|H01L29/517]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L29/6684|H01L29/6684]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L29/78391|H01L29/78391]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L21/0262|H01L21/0262]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
 * [[:Category:CPC_H01L29/401|H01L29/401]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L29/6653|H01L29/6653]] ({using self aligned silicidation, i.e. salicide  (formation of conductive layers comprising silicides): 1 patents
+* [[:Category:CPC_H01L29/41775|H01L29/41775]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H01Q21/0043|H01Q21/0043]] ({Slotted waveguides  (combination with horns): 1 patents
+* [[:Category:CPC_H01P3/16|H01P3/16]] (Dielectric waveguides, i.e. without a longitudinal conductor): 1 patents
+* [[:Category:CPC_H01Q1/3233|H01Q1/3233]] ({particular used as part of a sensor or in a security system, e.g. for automotive radar, navigation systems}): 1 patents
+* [[:Category:CPC_H01Q13/0233|H01Q13/0233]] ({Horns fed by a slotted waveguide array  (biconical horns): 1 patents
+* [[:Category:CPC_H01L27/0886|H01L27/0886]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H01L21/02603|H01L21/02603]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H01L21/30604|H01L21/30604]] (Chemical or electrical treatment, e.g. electrolytic etching  (to form insulating layers): 1 patents
+* [[:Category:CPC_H01L21/308|H01L21/308]] (using masks  (): 1 patents
+* [[:Category:CPC_H01L21/823412|H01L21/823412]] (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents
+* [[:Category:CPC_H01L21/823431|H01L21/823431]] (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents
+* [[:Category:CPC_H01L21/823456|H01L21/823456]] (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents
+* [[:Category:CPC_H01L29/0673|H01L29/0673]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H01L29/0847|H01L29/0847]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H01L29/42376|H01L29/42376]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H01L29/66742|H01L29/66742]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H01L29/66795|H01L29/66795]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H01L29/7851|H01L29/7851]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H01L29/78618|H01L29/78618]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H10D62/116|H10D62/116]] (No explanation available): 1 patents
+* [[:Category:CPC_H10D30/014|H10D30/014]] (No explanation available): 1 patents
+* [[:Category:CPC_H10D30/031|H10D30/031]] (No explanation available): 1 patents
+* [[:Category:CPC_H10D30/43|H10D30/43]] (No explanation available): 1 patents
+* [[:Category:CPC_H10D30/6757|H10D30/6757]] (No explanation available): 1 patents
+* [[:Category:CPC_H10D62/151|H10D62/151]] (No explanation available): 1 patents
+* [[:Category:CPC_H10D64/018|H10D64/018]] (No explanation available): 1 patents
+* [[:Category:CPC_H10D84/017|H10D84/017]] (No explanation available): 1 patents
+* [[:Category:CPC_H10D84/038|H10D84/038]] (No explanation available): 1 patents
+* [[:Category:CPC_H10D84/85|H10D84/85]] (No explanation available): 1 patents
+* [[:Category:CPC_H01L23/5226|H01L23/5226]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H01L21/76805|H01L21/76805]] ({the opening being a via or contact hole penetrating the underlying conductor}): 1 patents
+* [[:Category:CPC_H01L21/76814|H01L21/76814]] ({post-treatment or after-treatment, e.g. cleaning or removal of oxides on underlying conductors}): 1 patents
+* [[:Category:CPC_H01L21/76816|H01L21/76816]] ({Aspects relating to the layout of the pattern or to the size of vias or trenches  (layout of the interconnections per se): 1 patents
+* [[:Category:CPC_H01L21/76883|H01L21/76883]] ({Post-treatment or after-treatment of the conductive material}): 1 patents
+* [[:Category:CPC_H10D30/6729|H10D30/6729]] (No explanation available): 1 patents
+* [[:Category:CPC_H01L21/02063|H01L21/02063]] ({during, before or after processing of insulating layers}): 1 patents
+* [[:Category:CPC_H10D84/83|H10D84/83]] (No explanation available): 1 patents
 === Companies ===
@@ Line 85: / Line 62: @@
 ==== List of Companies ====
-* Taiwan Semiconductor Manufacturing Co., Ltd.: 13 patents
+* Taiwan Semiconductor Manufacturing Company, Ltd.: 6 patents
 === Collaborators ===
-* [[:Category:Kuan-Lun Cheng|Kuan-Lun Cheng]][[Category:Kuan-Lun Cheng]] (5 collaborations)
+* [[:Category:Kuo-Cheng Chiang|Kuo-Cheng Chiang]][[Category:Kuo-Cheng Chiang]] (2 collaborations)
-* [[:Category:Kuo-Cheng Chiang|Kuo-Cheng Chiang]][[Category:Kuo-Cheng Chiang]] (5 collaborations)
+* [[:Category:Huan-Chieh Su|Huan-Chieh Su]][[Category:Huan-Chieh Su]] (2 collaborations)
-* [[:Category:Huan-Chieh Su|Huan-Chieh Su]][[Category:Huan-Chieh Su]] (4 collaborations)
+* [[:Category:Chun-Yuan Chen|Chun-Yuan Chen]][[Category:Chun-Yuan Chen]] (2 collaborations)
-* [[:Category:Cheng-Chi Chuang|Cheng-Chi Chuang]][[Category:Cheng-Chi Chuang]] (4 collaborations)
+* [[:Category:Guan-Lin Chen|Guan-Lin Chen]][[Category:Guan-Lin Chen]] (1 collaborations)
-* [[:Category:Zhi-Chang Lin|Zhi-Chang Lin]][[Category:Zhi-Chang Lin]] (3 collaborations)
+* [[:Category:Jung-Chien Cheng|Jung-Chien Cheng]][[Category:Jung-Chien Cheng]] (1 collaborations)
-* [[:Category:Li-Zhen Yu|Li-Zhen Yu]][[Category:Li-Zhen Yu]] (3 collaborations)
+* [[:Category:Shi Ning Ju|Shi Ning Ju]][[Category:Shi Ning Ju]] (1 collaborations)
-* [[:Category:Lin-Yu Huang|Lin-Yu Huang]][[Category:Lin-Yu Huang]] (3 collaborations)
+* [[:Category:Shih-Chuan Chiu|Shih-Chuan Chiu]][[Category:Shih-Chuan Chiu]] (1 collaborations)
-* [[:Category:Shi Ning Ju|Shi Ning Ju]][[Category:Shi Ning Ju]] (3 collaborations)
+* [[:Category:Pei-Yu Wang|Pei-Yu Wang]][[Category:Pei-Yu Wang]] (1 collaborations)
-* [[:Category:Kuo-Cheng Ching|Kuo-Cheng Ching]][[Category:Kuo-Cheng Ching]] (2 collaborations)
+* [[:Category:Cheng-Chi Chuang|Cheng-Chi Chuang]][[Category:Cheng-Chi Chuang]] (1 collaborations)
-* [[:Category:Chia-Hao Chang|Chia-Hao Chang]][[Category:Chia-Hao Chang]] (2 collaborations)
+* [[:Category:Li-Zhen Yu|Li-Zhen Yu]][[Category:Li-Zhen Yu]] (1 collaborations)
-* [[:Category:Jia-Ni Yu|Jia-Ni Yu]][[Category:Jia-Ni Yu]] (2 collaborations)
+* [[:Category:Chia-Hao Chang|Chia-Hao Chang]][[Category:Chia-Hao Chang]] (1 collaborations)
-* [[:Category:Guan-Lin Chen|Guan-Lin Chen]][[Category:Guan-Lin Chen]] (2 collaborations)
-* [[:Category:Kuo-Cheng CHING|Kuo-Cheng CHING]][[Category:Kuo-Cheng CHING]] (1 collaborations)
-* [[:Category:Chun-Yuan Chen|Chun-Yuan Chen]][[Category:Chun-Yuan Chen]] (1 collaborations)
 * [[:Category:Yu-Ming Lin|Yu-Ming Lin]][[Category:Yu-Ming Lin]] (1 collaborations)
-* [[:Category:Lung-Kun Chu|Lung-Kun Chu]][[Category:Lung-Kun Chu]] (1 collaborations)
+* [[:Category:Kuo-Cheng CHIANG|Kuo-Cheng CHIANG]][[Category:Kuo-Cheng CHIANG]] (1 collaborations)
-* [[:Category:Mao-Lin Huang|Mao-Lin Huang]][[Category:Mao-Lin Huang]] (1 collaborations)
+* [[:Category:Kuan-Ting Pan|Kuan-Ting Pan]][[Category:Kuan-Ting Pan]] (1 collaborations)
-* [[:Category:Chung-Wei Hsu|Chung-Wei Hsu]][[Category:Chung-Wei Hsu]] (1 collaborations)
+* [[:Category:Wang-Chun Huang|Wang-Chun Huang]][[Category:Wang-Chun Huang]] (1 collaborations)
-* [[:Category:Chih-Chao Chou|Chih-Chao Chou]][[Category:Chih-Chao Chou]] (1 collaborations)
+* [[:Category:Ching-Wei Tsai|Ching-Wei Tsai]][[Category:Ching-Wei Tsai]] (1 collaborations)
+* [[:Category:Kuan-Lun Cheng|Kuan-Lun Cheng]][[Category:Kuan-Lun Cheng]] (1 collaborations)
+* [[:Category:Jung-Hung Chang|Jung-Hung Chang]][[Category:Jung-Hung Chang]] (1 collaborations)
+* [[:Category:Shih-Cheng Chen|Shih-Cheng Chen]][[Category:Shih-Cheng Chen]] (1 collaborations)
+* [[:Category:Tsung-Han Chuang|Tsung-Han Chuang]][[Category:Tsung-Han Chuang]] (1 collaborations)
 * [[:Category:Wen-Ting Lan|Wen-Ting Lan]][[Category:Wen-Ting Lan]] (1 collaborations)
-* [[:Category:Jui-Chien Huang|Jui-Chien Huang]][[Category:Jui-Chien Huang]] (1 collaborations)
+* [[:Category:Chia-Cheng Tsai|Chia-Cheng Tsai]][[Category:Chia-Cheng Tsai]] (1 collaborations)
-* [[:Category:Shih-Cheng Chen|Shih-Cheng Chen]][[Category:Shih-Cheng Chen]] (1 collaborations)
+* [[:Category:Sheng-Tsung Wang|Sheng-Tsung Wang]][[Category:Sheng-Tsung Wang]] (1 collaborations)
-* [[:Category:Jung-Hung Chang|Jung-Hung Chang]][[Category:Jung-Hung Chang]] (1 collaborations)
+* [[:Category:Meng-Huan Jao|Meng-Huan Jao]][[Category:Meng-Huan Jao]] (1 collaborations)
-* [[:Category:Lo-Heng Chang|Lo-Heng Chang]][[Category:Lo-Heng Chang]] (1 collaborations)
-* [[:Category:Jia-Chuan You|Jia-Chuan You]][[Category:Jia-Chuan You]] (1 collaborations)
-* [[:Category:Min Cao|Min Cao]][[Category:Min Cao]] (1 collaborations)
-* [[:Category:Pei-Yu Wang|Pei-Yu Wang]][[Category:Pei-Yu Wang]] (1 collaborations)
-* [[:Category:Sai-Hooi Yeong|Sai-Hooi Yeong]][[Category:Sai-Hooi Yeong]] (1 collaborations)
-* [[:Category:Ching-Wei Tsai|Ching-Wei Tsai]][[Category:Ching-Wei Tsai]] (1 collaborations)
-* [[:Category:Wei-Hao Wu|Wei-Hao Wu]][[Category:Wei-Hao Wu]] (1 collaborations)
 [[Category:Chih-Hao Wang]]
 [[Category:Inventors]]
-[[Category:Inventors filing patents with Taiwan Semiconductor Manufacturing Co., Ltd.]]
+[[Category:Inventors filing patents with Taiwan Semiconductor Manufacturing Company, Ltd.]]