Category:Chih-Hao WANG: Difference between revisions

Chih-Hao WANG

Executive Summary

Chih-Hao WANG is an inventor who has filed 10 patents. Their primary areas of innovation include SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (7 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (4 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (4 patents), and they have worked with companies such as Taiwan Semiconductor Manufacturing Co., Ltd. (9 patents), TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. (1 patents). Their most frequent collaborators include (7 collaborations), (4 collaborations), (4 collaborations).

Patent Filing Activity

File:Chih-Hao WANG Monthly Patent Applications.png

Technology Areas

File:Chih-Hao WANG Top Technology Areas.png

List of Technology Areas

• H01L29/42392 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 7 patents
• H01L29/0673 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents
• H01L29/66439 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents
• H01L29/78696 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents
• H01L29/775 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
• H01L29/66545 ({using a dummy, i.e. replacement gate in a process wherein at least a part of the final gate is self aligned to the dummy gate}): 3 patents
• H01L27/088 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
• H01L29/0665 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
• H01L29/66742 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
• H01L29/41775 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L21/76224 ({using trench refilling with dielectric materials (trench filling with polycristalline silicon): 2 patents
• H10D62/118 (No explanation available): 2 patents
• H01L21/0259 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L21/823412 (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 2 patents
• H01L21/823475 (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 2 patents
• H01L21/823481 (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 2 patents
• H01L29/41733 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L29/6656 ({using self aligned silicidation, i.e. salicide (formation of conductive layers comprising silicides): 2 patents
• H01L21/823807 (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents
• H01L21/823828 (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents
• H01L27/092 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L29/0653 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/764 (Making of isolation regions between components): 1 patents
• H01L29/0847 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/76229 (Dielectric regions {, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers}): 1 patents
• H01L29/4175 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L29/401 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L29/66553 ({using self aligned silicidation, i.e. salicide (formation of conductive layers comprising silicides): 1 patents
• H10D30/6735 (No explanation available): 1 patents
• H01L21/22 (Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; {Interactions between two or more impurities; Redistribution of impurities}): 1 patents
• H10D64/017 (No explanation available): 1 patents
• H01L23/535 (including internal interconnections, e.g. cross-under constructions {(internal lead connections): 1 patents
• H01L21/823418 (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents
• H01L21/28123 ({Lithography-related aspects, e.g. sub-lithography lengths; Isolation-related aspects, e.g. to solve problems arising at the crossing with the side of the device isolation; Planarisation aspects}): 1 patents
• H01L21/7682 (Applying interconnections to be used for carrying current between separate components within a device {comprising conductors and dielectrics}): 1 patents
• H01L21/823431 (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents
• H01L21/823437 (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents
• H01L29/41791 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L29/6681 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L29/785 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/823468 (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents
• H01L29/42364 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L29/4238 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L29/78618 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H10D84/834 (No explanation available): 1 patents
• H10D30/0243 (No explanation available): 1 patents
• H10D30/6211 (No explanation available): 1 patents
• H10D30/6215 (No explanation available): 1 patents
• H10D84/0128 (No explanation available): 1 patents
• H10D84/0158 (No explanation available): 1 patents
• H10D84/038 (No explanation available): 1 patents

Companies

File:Chih-Hao WANG Top Companies.png

List of Companies

• Taiwan Semiconductor Manufacturing Co., Ltd.: 9 patents
• TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.: 1 patents

Collaborators

• Kuo-Cheng CHIANG (7 collaborations)
• Chia-Hao CHANG (4 collaborations)
• Jia-Chuan YOU (4 collaborations)
• Huan-Chieh SU (2 collaborations)
• Chun-Yuan CHEN (2 collaborations)
• Chu-Yuan HSU (2 collaborations)
• Chung-Wei HSU (1 collaborations)
• Lung-Kun CHU (1 collaborations)
• Jia-Ni YU (1 collaborations)
• Chun-Fu LU (1 collaborations)
• Shih-Hao LAI (1 collaborations)
• Jung-Hung CHANG (1 collaborations)
• Shih-Cheng CHEN (1 collaborations)
• Chia-Hao YU (1 collaborations)
• Chia-Cheng TSAI (1 collaborations)
• Hsien-Chih HUANG (1 collaborations)
• Guan-Lin CHEN (1 collaborations)
• Shi Ning JU (1 collaborations)
• Lo-Heng CHANG (1 collaborations)
• Yu-Xuan HUANG (1 collaborations)
• Hou-Yu CHEN (1 collaborations)
• Jin CAI (1 collaborations)
• Zhi-Chang LIN (1 collaborations)
• Cheng-Chi CHUANG (1 collaborations)
• Tien-Lu LIN (1 collaborations)
• Yu-Ming LIN (1 collaborations)
• Li-Yang CHUANG (1 collaborations)