Category:Yohei YAMASHITA: Difference between revisions

Revision as of 02:23, 31 March 2025

Yohei YAMASHITA

Executive Summary

Yohei YAMASHITA is an inventor who has filed 3 patents. Their primary areas of innovation include SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (1 patents), {With simultaneous mechanical treatment, e.g. mechanico-chemical polishing} (1 patents), Bombardment with radiation {( (1 patents), and they have worked with companies such as Tokyo Electron Limited (3 patents). Their most frequent collaborators include (2 collaborations), (2 collaborations), (2 collaborations).

Patent Filing Activity

File:Yohei YAMASHITA Monthly Patent Applications.png

Technology Areas

File:Yohei YAMASHITA Top Technology Areas.png

List of Technology Areas

H01L21/02532 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L21/30625 ({With simultaneous mechanical treatment, e.g. mechanico-chemical polishing}): 1 patents
H01L21/268 (Bombardment with radiation {(): 1 patents
B23K26/53 (SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM (making metal-coated products by extruding metal): 1 patents
B24B7/228 ({for grinding thin, brittle parts, e.g. semiconductors, wafers (grinding edges of thin, brittle parts): 1 patents
H01L21/304 (Mechanical treatment, e.g. grinding, polishing, cutting {(): 1 patents
B23K2103/56 (SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM (making metal-coated products by extruding metal): 1 patents
H01L24/80 ({Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected}): 1 patents
H01L21/02164 ({the material being a silicon oxide, e.g. SiO): 1 patents
H01L21/02271 ({deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition (): 1 patents
H01L21/32053 (Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers (manufacture of electrodes): 1 patents
H01L24/94 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/80006 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/80895 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/80896 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/94 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2924/2026 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents

Companies

File:Yohei YAMASHITA Top Companies.png

List of Companies

Tokyo Electron Limited: 3 patents

Collaborators

Panupong JAIPAN of Albany NY (US) (2 collaborations)
Ilseok SON of Albany NY (US) (2 collaborations)
Arkalgud SITARAM of Albany NY (US) (2 collaborations)
Yasutaka MIZOMOTO (2 collaborations)
Yoshihiro TSUTSUMI (2 collaborations)
Yoshihiro KONDO (2 collaborations)
Matthew BARON of Albany NY (US) (1 collaborations)
Kandabara TAPILY of Albany NY (US) (1 collaborations)
Hayato TANOUE (1 collaborations)
Kevin RYAN of Albany NY (US) (1 collaborations)

Subcategories

This category has the following 5 subcategories, out of 5 total.

K

► Kan SAITO‎ (4 C)

Y

► Yohei YAMASHITA‎ (5 C)

@@ Line 2: / Line 2: @@
 === Executive Summary ===
-Yohei YAMASHITA is an inventor who has filed 9 patents. Their primary areas of innovation include Bombardment with radiation {( (5 patents), {Apparatus for mechanical treatment  (or grinding or cutting, see the relevant groups in subclasses (2 patents), Mechanical treatment, e.g. grinding, polishing, cutting {( (2 patents), and they have worked with companies such as Tokyo Electron Limited (9 patents). Their most frequent collaborators include [[Category:Hayato TANOUE|Hayato TANOUE]] (5 collaborations), [[Category:Yasutaka MIZOMOTO|Yasutaka MIZOMOTO]] (4 collaborations), [[Category:Kento ARAKI|Kento ARAKI]] (2 collaborations).
+Yohei YAMASHITA is an inventor who has filed 3 patents. Their primary areas of innovation include SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (1 patents), {With simultaneous mechanical treatment, e.g. mechanico-chemical polishing} (1 patents), Bombardment with radiation {( (1 patents), and they have worked with companies such as Tokyo Electron Limited (3 patents). Their most frequent collaborators include [[Category:Panupong JAIPAN of Albany NY (US)|Panupong JAIPAN of Albany NY (US)]] (2 collaborations), [[Category:Ilseok SON of Albany NY (US)|Ilseok SON of Albany NY (US)]] (2 collaborations), [[Category:Arkalgud SITARAM of Albany NY (US)|Arkalgud SITARAM of Albany NY (US)]] (2 collaborations).
 === Patent Filing Activity ===
@@ Line 11: / Line 11: @@
 ==== List of Technology Areas ====
-* [[:Category:CPC_H01L21/268|H01L21/268]] (Bombardment with radiation {(): 5 patents
+* [[:Category:CPC_H01L21/02532|H01L21/02532]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L21/67092|H01L21/67092]] ({Apparatus for mechanical treatment  (or grinding or cutting, see the relevant groups in subclasses): 2 patents
+* [[:Category:CPC_H01L21/30625|H01L21/30625]] ({With simultaneous mechanical treatment, e.g. mechanico-chemical polishing}): 1 patents
-* [[:Category:CPC_H01L21/304|H01L21/304]] (Mechanical treatment, e.g. grinding, polishing, cutting {(): 2 patents
+* [[:Category:CPC_H01L21/268|H01L21/268]] (Bombardment with radiation {(): 1 patents
-* [[:Category:CPC_B23K26/361|B23K26/361]] (Removing material  (): 2 patents
-* [[:Category:CPC_B23K2103/56|B23K2103/56]] (SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM  (making metal-coated products by extruding metal): 2 patents
-* [[:Category:CPC_H01L21/67115|H01L21/67115]] ({mainly by radiation}): 2 patents
-* [[:Category:CPC_H01L21/76256|H01L21/76256]] (Dielectric regions {, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers}): 1 patents
 * [[:Category:CPC_B23K26/53|B23K26/53]] (SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM  (making metal-coated products by extruding metal): 1 patents
+* [[:Category:CPC_B24B7/228|B24B7/228]] ({for grinding thin, brittle parts, e.g. semiconductors, wafers  (grinding edges of thin, brittle parts): 1 patents
+* [[:Category:CPC_H01L21/304|H01L21/304]] (Mechanical treatment, e.g. grinding, polishing, cutting {(): 1 patents
+* [[:Category:CPC_B23K2103/56|B23K2103/56]] (SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM  (making metal-coated products by extruding metal): 1 patents
+* [[:Category:CPC_H01L24/80|H01L24/80]] ({Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected}): 1 patents
 * [[:Category:CPC_H01L21/02164|H01L21/02164]] ({the material being a silicon oxide, e.g. SiO): 1 patents
-* [[:Category:CPC_H01L21/02238|H01L21/02238]] ({the layer being a laminate, i.e. composed of sublayers, e.g. stacks of alternating high-k metal oxides  (adhesion layers or buffer layers): 1 patents
+* [[:Category:CPC_H01L21/02271|H01L21/02271]] ({deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition  (): 1 patents
-* [[:Category:CPC_B23K2101/40|B23K2101/40]] (SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM  (making metal-coated products by extruding metal): 1 patents
+* [[:Category:CPC_H01L21/32053|H01L21/32053]] (Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers  (manufacture of electrodes): 1 patents
-* [[:Category:CPC_H01L25/50|H01L25/50]] ({Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group): 1 patents
+* [[:Category:CPC_H01L24/94|H01L24/94]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L21/67132|H01L21/67132]] ({Apparatus for placing on an insulating substrate, e.g. tape}): 1 patents
+* [[:Category:CPC_H01L2224/80006|H01L2224/80006]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L21/6835|H01L21/6835]] ({using temporarily an auxiliary support}): 1 patents
+* [[:Category:CPC_H01L2224/80895|H01L2224/80895]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L25/0652|H01L25/0652]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H01L2224/80896|H01L2224/80896]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L2221/68309|H01L2221/68309]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H01L2224/94|H01L2224/94]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L2221/68327|H01L2221/68327]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H01L2924/2026|H01L2924/2026]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L2221/68368|H01L2221/68368]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L2221/68381|H01L2221/68381]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_B23K26/352|B23K26/352]] (for surface treatment): 1 patents
-* [[:Category:CPC_B23K26/082|B23K26/082]] (Devices involving relative movement between laser beam and workpiece): 1 patents
-* [[:Category:CPC_H01L21/6831|H01L21/6831]] (for supporting or gripping  (for conveying): 1 patents
-* [[:Category:CPC_B23K26/0823|B23K26/0823]] (Devices involving relative movement between laser beam and workpiece): 1 patents
-* [[:Category:CPC_B23K26/083|B23K26/083]] (Devices involving relative movement between laser beam and workpiece): 1 patents
-* [[:Category:CPC_B23K26/18|B23K26/18]] (using absorbing layers on the workpiece, e.g. for marking or protecting purposes): 1 patents
-* [[:Category:CPC_B23K26/402|B23K26/402]] (involving non-metallic material, e.g. isolators): 1 patents
-* [[:Category:CPC_H01L21/447|H01L21/447]] (involving the application of pressure, e.g. thermo-compression bonding): 1 patents
-* [[:Category:CPC_H01L21/67144|H01L21/67144]] ({Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates}): 1 patents
-* [[:Category:CPC_H01L21/78|H01L21/78]] (with subsequent division of the substrate into plural individual devices  (cutting to change the surface-physical characteristics or shape of semiconductor bodies): 1 patents
-* [[:Category:CPC_H01L21/6836|H01L21/6836]] ({Wafer tapes, e.g. grinding or dicing support tapes  (adhesive tapes in general): 1 patents
-* [[:Category:CPC_H01L21/02035|H01L21/02035]] ({Shaping}): 1 patents
-* [[:Category:CPC_H01L21/67207|H01L21/67207]] (Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components {; Apparatus not specifically provided for elsewhere  (processes per se): 1 patents
-* [[:Category:CPC_H01L21/67288|H01L21/67288]] (Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components {; Apparatus not specifically provided for elsewhere  (processes per se): 1 patents
-* [[:Category:CPC_H01L21/02013|H01L21/02013]] ({Grinding, lapping}): 1 patents
-* [[:Category:CPC_H01L21/02019|H01L21/02019]] ({Chemical etching}): 1 patents
-* [[:Category:CPC_H01L22/20|H01L22/20]] ({Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps}): 1 patents
-* [[:Category:CPC_B23K26/032|B23K26/032]] (SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM  (making metal-coated products by extruding metal): 1 patents
-* [[:Category:CPC_B24B7/22|B24B7/22]] (MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING  (grinding of gear teeth): 1 patents
 === Companies ===
@@ Line 54: / Line 33: @@
 ==== List of Companies ====
-* Tokyo Electron Limited: 9 patents
+* Tokyo Electron Limited: 3 patents
 === Collaborators ===
-* [[:Category:Hayato TANOUE|Hayato TANOUE]][[Category:Hayato TANOUE]] (5 collaborations)
+* [[:Category:Panupong JAIPAN of Albany NY (US)|Panupong JAIPAN of Albany NY (US)]][[Category:Panupong JAIPAN of Albany NY (US)]] (2 collaborations)
-* [[:Category:Yasutaka MIZOMOTO|Yasutaka MIZOMOTO]][[Category:Yasutaka MIZOMOTO]] (4 collaborations)
+* [[:Category:Ilseok SON of Albany NY (US)|Ilseok SON of Albany NY (US)]][[Category:Ilseok SON of Albany NY (US)]] (2 collaborations)
-* [[:Category:Kento ARAKI|Kento ARAKI]][[Category:Kento ARAKI]] (2 collaborations)
+* [[:Category:Arkalgud SITARAM of Albany NY (US)|Arkalgud SITARAM of Albany NY (US)]][[Category:Arkalgud SITARAM of Albany NY (US)]] (2 collaborations)
-* [[:Category:Gousuke SHIRAISHI|Gousuke SHIRAISHI]][[Category:Gousuke SHIRAISHI]] (2 collaborations)
+* [[:Category:Yasutaka MIZOMOTO|Yasutaka MIZOMOTO]][[Category:Yasutaka MIZOMOTO]] (2 collaborations)
-* [[:Category:Yoshihiro KAWAGUCHI|Yoshihiro KAWAGUCHI]][[Category:Yoshihiro KAWAGUCHI]] (1 collaborations)
+* [[:Category:Yoshihiro TSUTSUMI|Yoshihiro TSUTSUMI]][[Category:Yoshihiro TSUTSUMI]] (2 collaborations)
-* [[:Category:Yoshihisa MATSUBARA|Yoshihisa MATSUBARA]][[Category:Yoshihisa MATSUBARA]] (1 collaborations)
+* [[:Category:Yoshihiro KONDO|Yoshihiro KONDO]][[Category:Yoshihiro KONDO]] (2 collaborations)
-* [[:Category:Yoshihiro TSUTSUMI|Yoshihiro TSUTSUMI]][[Category:Yoshihiro TSUTSUMI]] (1 collaborations)
+* [[:Category:Matthew BARON of Albany NY (US)|Matthew BARON of Albany NY (US)]][[Category:Matthew BARON of Albany NY (US)]] (1 collaborations)
-* [[:Category:Susumu HAYAKAWA|Susumu HAYAKAWA]][[Category:Susumu HAYAKAWA]] (1 collaborations)
+* [[:Category:Kandabara TAPILY of Albany NY (US)|Kandabara TAPILY of Albany NY (US)]][[Category:Kandabara TAPILY of Albany NY (US)]] (1 collaborations)
+* [[:Category:Hayato TANOUE|Hayato TANOUE]][[Category:Hayato TANOUE]] (1 collaborations)
+* [[:Category:Kevin RYAN of Albany NY (US)|Kevin RYAN of Albany NY (US)]][[Category:Kevin RYAN of Albany NY (US)]] (1 collaborations)
 [[Category:Yohei YAMASHITA]]
 [[Category:Inventors]]
 [[Category:Inventors filing patents with Tokyo Electron Limited]]