Category:Elad Mentovich: Difference between revisions

Elad Mentovich

Executive Summary

Elad Mentovich is an inventor who has filed 7 patents. Their primary areas of innovation include CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS (systems for controlling or regulating non-electric variables (1 patents), {comprising thermal management} (1 patents), HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT (fluid heaters having heat generating means and heat transferring means (1 patents), and they have worked with companies such as NVIDIA CORPORATION (5 patents), Nvidia Corporation (2 patents). Their most frequent collaborators include (3 collaborations), (3 collaborations), (3 collaborations).

Patent Filing Activity

File:Elad Mentovich Monthly Patent Applications.png

Technology Areas

File:Elad Mentovich Top Technology Areas.png

List of Technology Areas

• G05B13/0265 (CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS (systems for controlling or regulating non-electric variables): 1 patents
• G06F1/206 ({comprising thermal management}): 1 patents
• F28D15/046 (HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT (fluid heaters having heat generating means and heat transferring means): 1 patents
• F28D15/0266 (HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT (fluid heaters having heat generating means and heat transferring means): 1 patents
• F28D2021/0029 (HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT (fluid heaters having heat generating means and heat transferring means): 1 patents
• G06F30/13 (Architectural design, e.g. computer-aided architectural design [CAAD] related to design of buildings, bridges, landscapes, production plants or roads): 1 patents
• G06F30/27 (using machine learning, e.g. artificial intelligence, neural networks, support vector machines [SVM] or training a model): 1 patents
• H01L23/576 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/3107 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/538 (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({): 1 patents
• H01L23/573 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/16 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/32 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/73 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L25/0657 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L25/162 (the devices being of types provided for in two or more different main groups of groups): 1 patents
• H01L2224/16145 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/16225 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/32145 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/32225 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/73204 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2225/06513 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2225/06517 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2225/06596 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/191 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H05K1/181 (Printed circuits structurally associated with non-printed electric components ({): 1 patents
• H05K1/0275 ({Security details, e.g. tampering prevention or detection}): 1 patents
• H05K1/0293 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
• H05K3/1283 (using {thick film techniques, e.g.} printing techniques to apply the conductive material {or similar techniques for applying conductive paste or ink patterns}): 1 patents
• H05K3/284 ({for encapsulating mounted components (): 1 patents
• H05K7/20272 (Modifications to facilitate cooling, ventilating, or heating): 1 patents
• G06F1/20 (Cooling means): 1 patents
• G06T11/00 (2D [Two Dimensional] image generation): 1 patents
• H04L43/045 (for graphical visualisation of monitoring data): 1 patents

Companies

File:Elad Mentovich Top Companies.png

List of Companies

• NVIDIA CORPORATION: 5 patents
• Nvidia Corporation: 2 patents

Collaborators

• Siddha Ganju of Santa Clara CA (US) (3 collaborations)
• Ryan Albright of Beaverton OR (US) (3 collaborations)
• Tahir Cader of Spokane Valley WA (US) (3 collaborations)
• Ron Chao of San Diego CA (US) (3 collaborations)
• Dongji Xie of Gilroy CA (US) (2 collaborations)
• Jeff Whitmer of San Jose CA (US) (1 collaborations)
• Ron CHAO of San Diego CA (US) (1 collaborations)
• Harrison Sangwha Kim of Morgan Hill CA (US) (1 collaborations)
• Mark North of Lancaster PA (US) (1 collaborations)
• Xinwei Lu (1 collaborations)
• Fei Zhang (1 collaborations)
• Yunseok Kim of Pleasanton CA (US) (1 collaborations)
• David Haley of Beaverton OR (US) (1 collaborations)
• Yuezhan Steven Zhu of San Jose CA (US) (1 collaborations)
• Lei Huang (1 collaborations)
• Aastha Jhunjhunwala of Santa Clara CA (US) (1 collaborations)
• Srikanth Cherukuri of Santa Clara CA (US) (1 collaborations)
• David Copeland of Nederland CO (US) (1 collaborations)
• Srikanth Cherukuri of Belmont CA (US) (1 collaborations)
• Yoram Zer (1 collaborations)
• Ashrut Ambastha (1 collaborations)
• Jeremy Rodriguez of Santa Cruz CA (US) (1 collaborations)
• Lior Ofer (1 collaborations)