Category:Yohei YAMASHITA

Yohei YAMASHITA

Executive Summary

Yohei YAMASHITA is an inventor who has filed 9 patents. Their primary areas of innovation include Bombardment with radiation {( (5 patents), {Apparatus for mechanical treatment (or grinding or cutting, see the relevant groups in subclasses (2 patents), Mechanical treatment, e.g. grinding, polishing, cutting {( (2 patents), and they have worked with companies such as Tokyo Electron Limited (9 patents). Their most frequent collaborators include (5 collaborations), (4 collaborations), (2 collaborations).

Patent Filing Activity

File:Yohei YAMASHITA Monthly Patent Applications.png

Technology Areas

File:Yohei YAMASHITA Top Technology Areas.png

List of Technology Areas

• H01L21/268 (Bombardment with radiation {(): 5 patents
• H01L21/67092 ({Apparatus for mechanical treatment (or grinding or cutting, see the relevant groups in subclasses): 2 patents
• H01L21/304 (Mechanical treatment, e.g. grinding, polishing, cutting {(): 2 patents
• B23K26/361 (Removing material (): 2 patents
• B23K2103/56 (SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM (making metal-coated products by extruding metal): 2 patents
• H01L21/67115 ({mainly by radiation}): 2 patents
• H01L21/76256 (Dielectric regions {, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers}): 1 patents
• B23K26/53 (SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM (making metal-coated products by extruding metal): 1 patents
• H01L21/02164 ({the material being a silicon oxide, e.g. SiO): 1 patents
• H01L21/02238 ({the layer being a laminate, i.e. composed of sublayers, e.g. stacks of alternating high-k metal oxides (adhesion layers or buffer layers): 1 patents
• B23K2101/40 (SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM (making metal-coated products by extruding metal): 1 patents
• H01L25/50 ({Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group): 1 patents
• H01L21/67132 ({Apparatus for placing on an insulating substrate, e.g. tape}): 1 patents
• H01L21/6835 ({using temporarily an auxiliary support}): 1 patents
• H01L25/0652 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2221/68309 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2221/68327 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2221/68368 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2221/68381 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• B23K26/352 (for surface treatment): 1 patents
• B23K26/082 (Devices involving relative movement between laser beam and workpiece): 1 patents
• H01L21/6831 (for supporting or gripping (for conveying): 1 patents
• B23K26/0823 (Devices involving relative movement between laser beam and workpiece): 1 patents
• B23K26/083 (Devices involving relative movement between laser beam and workpiece): 1 patents
• B23K26/18 (using absorbing layers on the workpiece, e.g. for marking or protecting purposes): 1 patents
• B23K26/402 (involving non-metallic material, e.g. isolators): 1 patents
• H01L21/447 (involving the application of pressure, e.g. thermo-compression bonding): 1 patents
• H01L21/67144 ({Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates}): 1 patents
• H01L21/78 (with subsequent division of the substrate into plural individual devices (cutting to change the surface-physical characteristics or shape of semiconductor bodies): 1 patents
• H01L21/6836 ({Wafer tapes, e.g. grinding or dicing support tapes (adhesive tapes in general): 1 patents
• H01L21/02035 ({Shaping}): 1 patents
• H01L21/67207 (Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components {; Apparatus not specifically provided for elsewhere (processes per se): 1 patents
• H01L21/67288 (Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components {; Apparatus not specifically provided for elsewhere (processes per se): 1 patents
• H01L21/02013 ({Grinding, lapping}): 1 patents
• H01L21/02019 ({Chemical etching}): 1 patents
• H01L22/20 ({Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps}): 1 patents
• B23K26/032 (SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM (making metal-coated products by extruding metal): 1 patents
• B24B7/22 (MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING (grinding of gear teeth): 1 patents

Companies

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List of Companies

• Tokyo Electron Limited: 9 patents

Collaborators

• Hayato TANOUE (5 collaborations)
• Yasutaka MIZOMOTO (4 collaborations)
• Kento ARAKI (2 collaborations)
• Gousuke SHIRAISHI (2 collaborations)
• Yoshihiro KAWAGUCHI (1 collaborations)
• Yoshihisa MATSUBARA (1 collaborations)
• Yoshihiro TSUTSUMI (1 collaborations)
• Susumu HAYAKAWA (1 collaborations)