Category:Chung-Shi Liu

Chung-Shi Liu

Executive Summary

Chung-Shi Liu is an inventor who has filed 6 patents. Their primary areas of innovation include Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate (3 patents), {Multilayer substrates (multilayer metallisation on monolayer substrate (3 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (2 patents), and they have worked with companies such as Taiwan Semiconductor Manufacturing Company, Ltd. (6 patents). Their most frequent collaborators include (5 collaborations), (4 collaborations), (2 collaborations).

Patent Filing Activity

File:Chung-Shi Liu Monthly Patent Applications.png

Technology Areas

File:Chung-Shi Liu Top Technology Areas.png

List of Technology Areas

• H01L23/49838 (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate): 3 patents
• H01L23/49822 ({Multilayer substrates (multilayer metallisation on monolayer substrate): 3 patents
• H01L24/16 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L23/5386 (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({): 2 patents
• H01L23/49816 (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate): 2 patents
• H01L25/0655 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• G02B6/4202 (Coupling light guides with opto-electronic elements): 1 patents
• G02B6/4274 (Coupling light guides with opto-electronic elements): 1 patents
• H01L21/7684 (Applying interconnections to be used for carrying current between separate components within a device {comprising conductors and dielectrics}): 1 patents
• H01L2224/16055 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/16112 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/16148 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/19033 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/49833 (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate): 1 patents
• H01L23/5385 (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({): 1 patents
• H01L2224/16235 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/1434 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/1811 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/182 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• G02B6/4214 (Coupling light guides with opto-electronic elements): 1 patents
• H01L21/266 (using masks {(): 1 patents
• H01L21/76254 (Dielectric regions {, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers}): 1 patents
• H01L23/3185 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/5226 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/5283 ({Geometry or} layout of the interconnection structure {(): 1 patents
• H01L23/53228 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/5383 ({Multilayer substrates (): 1 patents
• H01L24/09 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/17 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L25/50 ({Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group): 1 patents
• H05K1/0271 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
• H05K1/0298 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
• H01L2224/02373 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/20 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/565 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/568 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/3128 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/4006 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/19 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2023/4031 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2023/405 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2023/4087 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/211 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents

Companies

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List of Companies

• Taiwan Semiconductor Manufacturing Company, Ltd.: 6 patents

Collaborators

• Chen-Hua Yu (5 collaborations)
• Hao-Yi Tsai (4 collaborations)
• Chung-Ming Weng (2 collaborations)
• Cheng-Chieh Hsieh (2 collaborations)
• Hung-Yi Kuo (2 collaborations)
• Tsung-Yuan Yu (2 collaborations)
• Hua-Kuei Lin (2 collaborations)
• Tin-Hao Kuo (2 collaborations)
• Hsiu-Jen Lin (1 collaborations)
• Ming-Che Ho (1 collaborations)
• Yu-Hsiang Hu (1 collaborations)
• Chewn-Pu Jou (1 collaborations)
• Cheng-Tse Tang (1 collaborations)
• Chien-Hsun Chen (1 collaborations)
• Chien-Hsun Lee (1 collaborations)
• Jiun-Yi Wu (1 collaborations)
• Shou-Yi Wang (1 collaborations)
• Tsung-Ding Wang (1 collaborations)
• Che-Hsiang Hsu (1 collaborations)
• Su-Chun Yang (1 collaborations)
• Jui Hsuan Tsai (1 collaborations)
• Jih-Churng Twu (1 collaborations)
• Yu-Chia Lai (1 collaborations)
• Po-Yuan Teng (1 collaborations)