Category:MING-YEN PAN

MING-YEN PAN

Executive Summary

MING-YEN PAN is an inventor who has filed 2 patents. Their primary areas of innovation include using {thick film techniques, e.g.} printing techniques to apply the conductive material {or similar techniques for applying conductive paste or ink patterns} (1 patents), Printed circuits structurally associated with non-printed electric components ({ (1 patents), PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS (1 patents), and they have worked with companies such as TONG HSING ELECTRONIC INDUSTRIES, LTD. (2 patents). Their most frequent collaborators include (2 collaborations), (2 collaborations), (2 collaborations).

Patent Filing Activity

File:MING-YEN PAN Monthly Patent Applications.png

Technology Areas

File:MING-YEN PAN Top Technology Areas.png

List of Technology Areas

• H05K3/12 (using {thick film techniques, e.g.} printing techniques to apply the conductive material {or similar techniques for applying conductive paste or ink patterns}): 1 patents
• H05K1/18 (Printed circuits structurally associated with non-printed electric components ({): 1 patents
• H05K2201/10984 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
• H10H20/857 (No explanation available): 1 patents
• H10H20/853 (No explanation available): 1 patents
• H10H20/0362 (No explanation available): 1 patents
• H10H20/0364 (No explanation available): 1 patents

Companies

File:MING-YEN PAN Top Companies.png

List of Companies

• TONG HSING ELECTRONIC INDUSTRIES, LTD.: 2 patents

Collaborators

• SHIH-HAN WU (2 collaborations)
• JHIH-WEI LAI (2 collaborations)
• JIAN-YU SHIH (2 collaborations)
• YU-HSIEN LIAO (1 collaborations)
• HAO-EN HUNG (1 collaborations)