Category:Yohei YAMASHITA

Yohei YAMASHITA

Executive Summary

Yohei YAMASHITA is an inventor who has filed 3 patents. Their primary areas of innovation include SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (1 patents), {With simultaneous mechanical treatment, e.g. mechanico-chemical polishing} (1 patents), Bombardment with radiation {( (1 patents), and they have worked with companies such as Tokyo Electron Limited (3 patents). Their most frequent collaborators include (2 collaborations), (2 collaborations), (2 collaborations).

Patent Filing Activity

File:Yohei YAMASHITA Monthly Patent Applications.png

Technology Areas

File:Yohei YAMASHITA Top Technology Areas.png

List of Technology Areas

• H01L21/02532 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/30625 ({With simultaneous mechanical treatment, e.g. mechanico-chemical polishing}): 1 patents
• H01L21/268 (Bombardment with radiation {(): 1 patents
• B23K26/53 (SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM (making metal-coated products by extruding metal): 1 patents
• B24B7/228 ({for grinding thin, brittle parts, e.g. semiconductors, wafers (grinding edges of thin, brittle parts): 1 patents
• H01L21/304 (Mechanical treatment, e.g. grinding, polishing, cutting {(): 1 patents
• B23K2103/56 (SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM (making metal-coated products by extruding metal): 1 patents
• H01L24/80 ({Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected}): 1 patents
• H01L21/02164 ({the material being a silicon oxide, e.g. SiO): 1 patents
• H01L21/02271 ({deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition (): 1 patents
• H01L21/32053 (Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers (manufacture of electrodes): 1 patents
• H01L24/94 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/80006 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/80895 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/80896 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/94 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/2026 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents

Companies

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List of Companies

• Tokyo Electron Limited: 3 patents

Collaborators

• Panupong JAIPAN of Albany NY (US) (2 collaborations)
• Ilseok SON of Albany NY (US) (2 collaborations)
• Arkalgud SITARAM of Albany NY (US) (2 collaborations)
• Yasutaka MIZOMOTO (2 collaborations)
• Yoshihiro TSUTSUMI (2 collaborations)
• Yoshihiro KONDO (2 collaborations)
• Matthew BARON of Albany NY (US) (1 collaborations)
• Kandabara TAPILY of Albany NY (US) (1 collaborations)
• Hayato TANOUE (1 collaborations)
• Kevin RYAN of Albany NY (US) (1 collaborations)