Category:Wen Hung Huang

Wen Hung Huang

Executive Summary

Wen Hung Huang is an inventor who has filed 4 patents. Their primary areas of innovation include SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (2 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (2 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (2 patents), and they have worked with companies such as NXP B.V. (4 patents). Their most frequent collaborators include (4 collaborations), (3 collaborations), (2 collaborations).

Patent Filing Activity

File:Wen Hung Huang Monthly Patent Applications.png

Technology Areas

File:Wen Hung Huang Top Technology Areas.png

List of Technology Areas

• H01L24/19 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L24/20 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L24/73 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L24/13 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L2224/2101 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L2224/2105 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L2224/211 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L2224/214 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L2224/73101 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L24/11 ({Manufacturing methods (for bumps on insulating substrates): 2 patents
• H01L2224/13006 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/215 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/49861 ({Lead-frames fixed on or encapsulated in insulating substrates (): 1 patents
• H01L24/16 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/81 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/49838 (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate): 1 patents
• H01L21/4839 (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 1 patents
• H01L21/4882 (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 1 patents
• H01L23/3675 (Cooling facilitated by shape of device {(): 1 patents
• H01L2224/81203 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/81207 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/16245 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/49816 (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate): 1 patents
• H01L25/105 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/283 (Deposition of conductive or insulating materials for electrodes {conducting electric current}): 1 patents
• H01L21/78 (with subsequent division of the substrate into plural individual devices (cutting to change the surface-physical characteristics or shape of semiconductor bodies): 1 patents
• H01L24/03 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/05 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/0231 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/02331 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05558 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/3511 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/13027 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/11849 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents

Companies

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List of Companies

• NXP B.V.: 4 patents

Collaborators

• Kuan-Hsiang Mao (4 collaborations)
• Yufu Liu (3 collaborations)
• Che Ming Fang (2 collaborations)
• Tsung Nan Lo (1 collaborations)
• Chin Teck Siong (1 collaborations)
• Pey Fang Hiew (1 collaborations)
• Wen Yuan Chuang (1 collaborations)
• Sharon Huey Lin Tay (1 collaborations)