Category:Min-Hsun HSIEH

Min-Hsun HSIEH

Executive Summary

Min-Hsun HSIEH is an inventor who has filed 6 patents. Their primary areas of innovation include Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls (5 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (3 patents), including semiconductor components having potential barriers, specially adapted for light emission (2 patents), and they have worked with companies such as EPISTAR CORPORATION (5 patents), Epistar Corporation (1 patents). Their most frequent collaborators include (1 collaborations), (1 collaborations), (1 collaborations).

Patent Filing Activity

File:Min-Hsun HSIEH Monthly Patent Applications.png

Technology Areas

File:Min-Hsun HSIEH Top Technology Areas.png

List of Technology Areas

• H01L33/62 (Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls): 5 patents
• H01L2933/0066 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
• H01L27/156 (including semiconductor components having potential barriers, specially adapted for light emission): 2 patents
• H01L2933/0033 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L33/30 (containing only elements of Group III and Group V of the Periodic Table): 1 patents
• H01L33/0062 ({for devices with an active region comprising only III-V compounds}): 1 patents
• H01L24/13 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/03 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/05 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/11 ({Manufacturing methods (for bumps on insulating substrates): 1 patents
• H01L24/14 ({of a plurality of bump connectors}): 1 patents
• H01L2224/0347 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/03848 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/0401 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05557 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05624 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/11515 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/13016 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/13111 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/13144 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/1403 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L33/58 (Optical field-shaping elements): 1 patents
• H01L25/0753 (the devices being of a type provided for in group): 1 patents
• H01L33/60 (Reflective elements): 1 patents
• H01L33/0095 ({Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination}): 1 patents
• H01L22/22 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents

Companies

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List of Companies

• EPISTAR CORPORATION: 5 patents
• Epistar Corporation: 1 patents

Collaborators

• Yu-Tsu LEE (1 collaborations)
• Wei-Jen HSUEH (1 collaborations)
• Shih-An LIAO (1 collaborations)
• Jan-Way CHIEN (1 collaborations)
• Shau-Yi CHEN (1 collaborations)
• Tzu-Yuan LIN (1 collaborations)
• Wei-Chiang HU (1 collaborations)
• Pei-Hsuan LAN (1 collaborations)