Category:Hiroshi MORIKAZU

Hiroshi MORIKAZU

Executive Summary

Hiroshi MORIKAZU is an inventor who has filed 7 patents. Their primary areas of innovation include taking account of the properties of the material involved (2 patents), Removing material ( (2 patents), Bombardment with radiation {( (2 patents), and they have worked with companies such as DISCO CORPORATION (7 patents). Their most frequent collaborators include (5 collaborations), (5 collaborations), (5 collaborations).

Patent Filing Activity

File:Hiroshi MORIKAZU Monthly Patent Applications.png

Technology Areas

File:Hiroshi MORIKAZU Top Technology Areas.png

List of Technology Areas

• B23K26/40 (taking account of the properties of the material involved): 2 patents
• B23K26/364 (Removing material (): 2 patents
• H01L21/268 (Bombardment with radiation {(): 2 patents
• H01L21/304 (Mechanical treatment, e.g. grinding, polishing, cutting {(): 2 patents
• H01L21/6835 ({using temporarily an auxiliary support}): 2 patents
• B23K26/0622 (SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM (making metal-coated products by extruding metal): 2 patents
• B23K26/36 (Removing material (): 2 patents
• B23K26/082 (Devices involving relative movement between laser beam and workpiece): 1 patents
• B23K26/0665 (by using masks): 1 patents
• B23K2101/42 (SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM (making metal-coated products by extruding metal): 1 patents
• H01L21/67092 ({Apparatus for mechanical treatment (or grinding or cutting, see the relevant groups in subclasses): 1 patents
• H01L2221/68327 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/7813 (with subsequent division of the substrate into plural individual devices (cutting to change the surface-physical characteristics or shape of semiconductor bodies): 1 patents
• H01L21/6838 (for supporting or gripping (for conveying): 1 patents
• H01L2221/68386 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents

Companies

File:Hiroshi MORIKAZU Top Companies.png

List of Companies

• DISCO CORPORATION: 7 patents

Collaborators

• Naotoshi KIRIHARA (5 collaborations)
• Yohei KANEKO (5 collaborations)
• Kentaro ODANAKA (5 collaborations)
• Yuki SUTO (2 collaborations)
• Tasuku KOYANAGI (2 collaborations)
• Masato TERAJIMA (2 collaborations)
• Junya MIMURA (2 collaborations)