Category:Kosuke WADA

Kosuke WADA

Executive Summary

Kosuke WADA is an inventor who has filed 3 patents. Their primary areas of innovation include MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE (2 patents), Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion (1 patents), Binary compounds of nitrogen with metals, with silicon, or with boron, {or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron} (azides (1 patents), and they have worked with companies such as DENKA COMPANY LIMITED (3 patents). Their most frequent collaborators include (3 collaborations).

Patent Filing Activity

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Technology Areas

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List of Technology Areas

• C09K5/14 (MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE): 2 patents
• C09K5/00 (Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion): 1 patents
• C01B21/064 (Binary compounds of nitrogen with metals, with silicon, or with boron, {or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron} (azides): 1 patents
• C08K3/38 (Use of inorganic or non-macromolecular organic substances as compounding ingredients (paints, inks, varnishes, dyes, polishes, adhesives): 1 patents
• C08J5/18 (Manufacture of films or sheets): 1 patents
• C08J3/203 (WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES): 1 patents
• C01P2004/51 (Particles with a specific particle size distribution): 1 patents
• C01P2006/21 (Attrition-index or crushing strength of granulates): 1 patents
• C01P2004/50 (Agglomerated particles): 1 patents
• C01P2004/62 (INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS): 1 patents
• C01P2004/61 (INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS): 1 patents
• C01P2002/76 (by a space-group or by other symmetry indications): 1 patents
• C01P2006/32 (Thermal properties): 1 patents
• C08K2201/001 (Use of inorganic or non-macromolecular organic substances as compounding ingredients (paints, inks, varnishes, dyes, polishes, adhesives): 1 patents
• C08K2003/385 (Use of inorganic or non-macromolecular organic substances as compounding ingredients (paints, inks, varnishes, dyes, polishes, adhesives): 1 patents
• C08K2201/005 (Use of inorganic or non-macromolecular organic substances as compounding ingredients (paints, inks, varnishes, dyes, polishes, adhesives): 1 patents
• C08J2383/04 (WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES): 1 patents

Companies

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List of Companies

• DENKA COMPANY LIMITED: 3 patents

Collaborators

• Kiyotaka FUJI (3 collaborations)