Category:Sitao HUO
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Sitao HUO
Executive Summary
Sitao HUO is an inventor who has filed 8 patents. Their primary areas of innovation include the devices being of a type provided for in group (8 patents), Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls (3 patents), Optical field-shaping elements (2 patents), and they have worked with companies such as Tianma Advanced Display Technology Institute (Xiamen) Co., Ltd. (7 patents), TIANMA ADVANCED DISPLAY TECHNOLOGY INSTITUTE (XIAMEN) CO., LTD. (1 patents). Their most frequent collaborators include (1 collaborations).
Patent Filing Activity
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Technology Areas
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List of Technology Areas
- H01L25/0753 (the devices being of a type provided for in group): 8 patents
- H01L33/62 (Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls): 3 patents
- H01L33/58 (Optical field-shaping elements): 2 patents
- H01L27/156 (including semiconductor components having potential barriers, specially adapted for light emission): 2 patents
- G02B5/045 (Prisms): 1 patents
- H01L25/167 (the devices being of types provided for in two or more different main groups of groups): 1 patents
- H01L33/382 ({the electrode extending partially in or entirely through the semiconductor body}): 1 patents
- H01L21/6835 ({using temporarily an auxiliary support}): 1 patents
- H01L2221/68318 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2221/68377 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L33/54 (having a particular shape): 1 patents
- H01L33/08 (with a plurality of light emitting regions, e.g. laterally discontinuous light emitting layer or photoluminescent region integrated within the semiconductor body (): 1 patents
- H01L33/38 (with a particular shape): 1 patents
- H01L33/0093 ({Wafer bonding; Removal of the growth substrate}): 1 patents
- H01L33/0095 ({Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination}): 1 patents
- H01L2933/0033 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L23/544 (Marks applied to semiconductor devices {or parts}, e.g. registration marks, {alignment structures, wafer maps (test patterns for characterising or monitoring manufacturing processes): 1 patents
- H01L2223/54426 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L33/44 (characterised by the coatings, e.g. passivation layer or anti-reflective coating): 1 patents
- H01L33/025 ({Physical imperfections, e.g. particular concentration or distribution of impurities}): 1 patents
- H01L33/24 (of the light emitting region, e.g. non-planar junction): 1 patents
- H01L33/06 (within the light emitting region, e.g. quantum confinement structure or tunnel barrier): 1 patents
- H01L33/385 ({the electrode extending at least partially onto a side surface of the semiconductor body}): 1 patents
- H01L33/10 (with a light reflecting structure, e.g. semiconductor Bragg reflector): 1 patents
Companies
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List of Companies
- Tianma Advanced Display Technology Institute (Xiamen) Co., Ltd.: 7 patents
- TIANMA ADVANCED DISPLAY TECHNOLOGY INSTITUTE (XIAMEN) CO., LTD.: 1 patents
Collaborators
- Feifei AN (1 collaborations)