Category:Chingju Lin

Chingju Lin

Executive Summary

Chingju Lin is an inventor who has filed 5 patents. Their primary areas of innovation include SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (3 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (3 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (3 patents), and they have worked with companies such as Stroke Precision Advanced Engineering Co., Ltd. (5 patents). Their most frequent collaborators include (2 collaborations), (1 collaborations), (1 collaborations).

Patent Filing Activity

File:Chingju Lin Monthly Patent Applications.png

Technology Areas

File:Chingju Lin Top Technology Areas.png

List of Technology Areas

• H01L24/75 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
• H01L24/81 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
• H01L2224/81224 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
• H01L25/167 (the devices being of types provided for in two or more different main groups of groups): 2 patents
• H01L2224/75314 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L2224/7555 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L2224/81005 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L2224/81201 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L2224/81815 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L25/0753 (the devices being of a type provided for in group): 2 patents
• H01L24/80 ({Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected}): 2 patents
• H01L2224/80224 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L2924/12041 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L2224/75263 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L2224/75262 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L33/486 ({adapted for surface mounting}): 1 patents
• H01L21/67115 ({mainly by radiation}): 1 patents
• H01L21/6835 ({using temporarily an auxiliary support}): 1 patents
• H01L2221/68363 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/80006 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/16 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/16145 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• B23K1/0053 (Soldering, e.g. brazing, or unsoldering (): 1 patents
• B23K1/0056 (Soldering, e.g. brazing, or unsoldering (): 1 patents
• B23K2101/40 (SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM (making metal-coated products by extruding metal): 1 patents
• H01L2224/75283 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/75705 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/7598 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/8023 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/80815 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/81191 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/81192 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/8123 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents

Companies

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List of Companies

• Stroke Precision Advanced Engineering Co., Ltd.: 5 patents

Collaborators

• Sheng-Che Huang (2 collaborations)
• Chien-Shou Liao (1 collaborations)
• Shao-Wei Huang (1 collaborations)
• Yu-Min Huang (1 collaborations)
• Sheng Che Huang (1 collaborations)
• Wei-Hao Wang (1 collaborations)