Category:Osamu KAKUTANI

Osamu KAKUTANI

Executive Summary

Osamu KAKUTANI is an inventor who has filed 2 patents. Their primary areas of innovation include SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (2 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (2 patents), {using a wire connector (wire bonding in general (1 patents), and they have worked with companies such as SHINKAWA LTD. (2 patents). Their most frequent collaborators include (1 collaborations), (1 collaborations).

Patent Filing Activity

File:Osamu KAKUTANI Monthly Patent Applications.png

Technology Areas

File:Osamu KAKUTANI Top Technology Areas.png

List of Technology Areas

• H01L24/78 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L2224/78753 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L24/85 ({using a wire connector (wire bonding in general): 1 patents
• H01L2224/78001 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/78304 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/78353 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/78702 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/85123 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/8518 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/859 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/40 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• B23K20/004 (Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating): 1 patents
• B23K20/106 (SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM (making metal-coated products by extruding metal): 1 patents
• B23K2101/40 (SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM (making metal-coated products by extruding metal): 1 patents
• H01L2224/78621 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/78701 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents

Companies

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List of Companies

• SHINKAWA LTD.: 2 patents

Collaborators

• Shigeru HAYATA (1 collaborations)
• Toru MAEDA (1 collaborations)