Category:Kohei SEYAMA
Kohei SEYAMA
Executive Summary
Kohei SEYAMA is an inventor who has filed 2 patents. Their primary areas of innovation include SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (1 patents), Soldering, e.g. brazing, or unsoldering ( (1 patents), SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM (making metal-coated products by extruding metal (1 patents), and they have worked with companies such as SHINKAWA LTD. (2 patents). Their most frequent collaborators include .
Patent Filing Activity
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Technology Areas
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List of Technology Areas
- H01L24/75 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- B23K1/0016 (Soldering, e.g. brazing, or unsoldering (): 1 patents
- B23K3/087 (SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM (making metal-coated products by extruding metal): 1 patents
- H01L2224/75984 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2224/75744 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2224/75755 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2224/7598 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- B23K2101/40 (SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM (making metal-coated products by extruding metal): 1 patents
- H01L21/681 (for positioning, orientation or alignment): 1 patents
- H01L21/67144 ({Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates}): 1 patents
- H01L21/67248 (Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components {; Apparatus not specifically provided for elsewhere (processes per se): 1 patents
Companies
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List of Companies
- SHINKAWA LTD.: 2 patents