Category:Yong LIU of Cumberland Foreside ME (US)

Yong LIU of Cumberland Foreside ME (US)

Executive Summary

Yong LIU of Cumberland Foreside ME (US) is an inventor who has filed 4 patents. Their primary areas of innovation include SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (4 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (4 patents), Cooling facilitated by shape of device {( (2 patents), and they have worked with companies such as SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC (4 patents). Their most frequent collaborators include (2 collaborations), (2 collaborations), (1 collaborations).

Patent Filing Activity

File:Yong LIU of Cumberland Foreside ME (US) Monthly Patent Applications.png

Technology Areas

File:Yong LIU of Cumberland Foreside ME (US) Top Technology Areas.png

List of Technology Areas

• H01L23/3735 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents
• H01L24/32 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents
• H01L23/3675 (Cooling facilitated by shape of device {(): 2 patents
• H01L21/565 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H05K7/2089 (Modifications to facilitate cooling, ventilating, or heating): 2 patents
• H01L2224/32245 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L2224/84801 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L2924/13055 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L24/33 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L23/3107 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/52 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/49575 (Lead-frames {or other flat leads (): 1 patents
• H01L23/49524 (Lead-frames {or other flat leads (): 1 patents
• H01L23/49551 (Lead-frames {or other flat leads (): 1 patents
• H01L23/49562 (Lead-frames {or other flat leads (): 1 patents
• H01L2224/40245 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/4871 (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 1 patents
• H01L24/83 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/83815 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/32237 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/49838 (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate): 1 patents
• H01L23/367 (Cooling facilitated by shape of device {(): 1 patents
• H01L24/29 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/30 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents

Companies

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List of Companies

• SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC: 4 patents

Collaborators

• Liangbiao CHEN of Scarborough ME (US) (2 collaborations)
• Tzu-Hsuan CHENG of Scarborough ME (US) (2 collaborations)
• Stephen ST. GERMAIN of Gilbert AZ (US) (1 collaborations)
• Roger ARBUTHNOT of Mesa AZ (US) (1 collaborations)
• Leo GU (1 collaborations)
• Sixin JI (1 collaborations)
• Jie CHANG (1 collaborations)
• Keunhyuk LEE (1 collaborations)
• Yusheng LIN of Phoenix AZ (US) (1 collaborations)
• Jerome TEYSSEYRE of Scottsdale AZ (US) (1 collaborations)