Category:Hong Yu of Clifton Park NY (US)

Hong Yu of Clifton Park NY (US)

Executive Summary

Hong Yu of Clifton Park NY (US) is an inventor who has filed 8 patents. Their primary areas of innovation include SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (3 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (3 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (2 patents), and they have worked with companies such as GlobalFoundries U.S. Inc. (6 patents), GLOBALFOUNDRIES U.S. Inc. (2 patents). Their most frequent collaborators include (3 collaborations), (3 collaborations), (2 collaborations).

Patent Filing Activity

File:Hong Yu of Clifton Park NY (US) Monthly Patent Applications.png

Technology Areas

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List of Technology Areas

• H01L29/66795 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
• H01L29/7851 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
• H01L29/735 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L29/6656 ({using self aligned silicidation, i.e. salicide (formation of conductive layers comprising silicides): 2 patents
• H01L29/66545 ({using a dummy, i.e. replacement gate in a process wherein at least a part of the final gate is self aligned to the dummy gate}): 2 patents
• H01L29/0808 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L29/0821 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L29/1008 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L29/165 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L29/6625 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L29/0847 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/823807 (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents
• H01L21/823814 (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents
• H01L21/823864 (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents
• H01L29/41783 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L29/42364 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/31144 ({using masks}): 1 patents
• H01L29/7846 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/76229 (Dielectric regions {, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers}): 1 patents
• H01L27/092 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/76224 ({using trench refilling with dielectric materials (trench filling with polycristalline silicon): 1 patents
• H01L21/823878 (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents
• H01L23/528 ({Geometry or} layout of the interconnection structure {(): 1 patents
• H01L27/0207 ({Geometrical layout of the components, e.g. computer aided design; custom LSI, semi-custom LSI, standard cell technique}): 1 patents
• H01L27/0623 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L29/66871 ({Processes wherein the final gate is made after the formation of the source and drain regions in the active layer, e.g. dummy-gate processes}): 1 patents
• H01L29/732 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L27/2445 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L29/66242 ({Heterojunction transistors [HBT] (with an active layer made of a group 13/15 material): 1 patents
• H01L29/7371 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L45/1233 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L45/16 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/28123 ({Lithography-related aspects, e.g. sub-lithography lengths; Isolation-related aspects, e.g. to solve problems arising at the crossing with the side of the device isolation; Planarisation aspects}): 1 patents
• H01L29/1037 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L29/4983 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/823431 (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents
• H01L21/823468 (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents

Companies

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List of Companies

• GlobalFoundries U.S. Inc.: 6 patents
• GLOBALFOUNDRIES U.S. Inc.: 2 patents

Collaborators

• Alexander Derrickson of Saratoga Springs NY (US) (3 collaborations)
• James P. Mazza of Saratoga Springs NY (US) (3 collaborations)
• Anton V. Tokranov of Halfmoon NY (US) (2 collaborations)
• David Charles Pritchard of Schenectady NY (US) (2 collaborations)
• Navneet K. Jain of Milpitas CA (US) (2 collaborations)
• Venkatesh Gopinath of Fremont CA (US) (2 collaborations)
• John J. Pekarik of Underhill VT (US) (2 collaborations)
• Vibhor Jain of Essex Junction VT (US) (2 collaborations)
• Judson R. Holt of Ballston Lake NY (US) (1 collaborations)
• Jianwei PENG of Clifton Park NY (US) (1 collaborations)
• Eric Scott Kozarsky of Gansevoort NY (US) (1 collaborations)
• Elizabeth A. Strehlow of Cleveland GA (US) (1 collaborations)
• Vitor A. Vulcano Rossi of Saratoga Springs NY (US) (1 collaborations)
• David Pritchard of Glenville NY (US) (1 collaborations)
• Romain H.A. Feuillette of Williston VT (US) (1 collaborations)
• Saloni Chaurasia of Leander TX (US) (1 collaborations)
• Jagar Singh of Clifton Park NY (US) (1 collaborations)