Category:Tomoaki INOKUCHI

Tomoaki INOKUCHI

Executive Summary

Tomoaki INOKUCHI is an inventor who has filed 9 patents. Their primary areas of innovation include No explanation available (4 patents), No explanation available (2 patents), No explanation available (2 patents), and they have worked with companies such as KABUSHIKI KAISHA TOSHIBA (9 patents). Their most frequent collaborators include (8 collaborations), (8 collaborations), (8 collaborations).

Patent Filing Activity

File:Tomoaki INOKUCHI Monthly Patent Applications.png

Technology Areas

File:Tomoaki INOKUCHI Top Technology Areas.png

List of Technology Areas

• H10D64/117 (No explanation available): 4 patents
• H10D30/871 (No explanation available): 2 patents
• H10D30/668 (No explanation available): 2 patents
• H10D64/64 (No explanation available): 2 patents
• H10D84/811 (No explanation available): 2 patents
• H01L29/408 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L29/407 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L29/7813 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• G06F30/12 (characterised by design entry means specially adapted for CAD, e.g. graphical user interfaces [GUI] specially adapted for CAD): 1 patents
• H01L23/367 (Cooling facilitated by shape of device {(): 1 patents
• H01L23/3107 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/49811 ({Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads (): 1 patents
• H01L23/5384 ({Conductive vias through the substrate with or without pins, e.g. buried coaxial conductors (): 1 patents
• H01L23/5385 (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({): 1 patents
• H01L24/32 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L25/0655 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/32245 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/528 ({Geometry or} layout of the interconnection structure {(): 1 patents
• H01L23/53242 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H10B99/22 (ELECTRONIC MEMORY DEVICES): 1 patents
• H10D1/665 (No explanation available): 1 patents
• H10D30/635 (No explanation available): 1 patents
• H10D62/126 (No explanation available): 1 patents
• H10D64/647 (No explanation available): 1 patents
• H10D62/127 (No explanation available): 1 patents
• H10D84/146 (No explanation available): 1 patents
• H10B63/34 (ELECTRONIC MEMORY DEVICES): 1 patents
• H10N70/826 (No explanation available): 1 patents
• H10N70/841 (No explanation available): 1 patents
• H01L24/48 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H10D1/47 (No explanation available): 1 patents
• H10D1/692 (No explanation available): 1 patents
• H01L2224/4813 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/1205 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/1207 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/13091 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/30107 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H10D86/201 (No explanation available): 1 patents
• H10D30/873 (No explanation available): 1 patents
• H10D89/10 (No explanation available): 1 patents

Companies

File:Tomoaki INOKUCHI Top Companies.png

List of Companies

• KABUSHIKI KAISHA TOSHIBA: 9 patents

Collaborators

• Taichi FUKUDA (8 collaborations)
• Yusuke KOBAYASHI (8 collaborations)
• Hiro GANGI (8 collaborations)
• Shotaro BABA (7 collaborations)
• Hiroki NEMOTO (4 collaborations)
• Tatsunori SAKANO (4 collaborations)
• Tatsuo SHIMIZU (3 collaborations)
• Kento ADACHI (2 collaborations)
• Satoshi YOSHIDA (2 collaborations)
• Tatsuya NISHIWAKI (2 collaborations)
• Yasunori TAGUCHI (1 collaborations)