Category:Jhon-Jhy LIAW

Jhon-Jhy LIAW

Executive Summary

Jhon-Jhy LIAW is an inventor who has filed 12 patents. Their primary areas of innovation include SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (6 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (6 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (6 patents), and they have worked with companies such as Taiwan Semiconductor Manufacturing Company, Ltd. (11 patents), TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (1 patents). Their most frequent collaborators include (2 collaborations), (2 collaborations), (2 collaborations).

Patent Filing Activity

File:Jhon-Jhy LIAW Monthly Patent Applications.png

Technology Areas

File:Jhon-Jhy LIAW Top Technology Areas.png

List of Technology Areas

• H01L29/775 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 6 patents
• H01L29/0673 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 6 patents
• H01L29/42392 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 6 patents
• H01L29/66439 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents
• H01L29/66545 ({using a dummy, i.e. replacement gate in a process wherein at least a part of the final gate is self aligned to the dummy gate}): 4 patents
• H10B10/12 (ELECTRONIC MEMORY DEVICES): 4 patents
• H01L27/092 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
• H01L29/0847 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L29/66553 ({using self aligned silicidation, i.e. salicide (formation of conductive layers comprising silicides): 2 patents
• G11C11/412 (using field-effect transistors only): 2 patents
• H01L21/823807 (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 2 patents
• H01L21/823878 (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 2 patents
• H01L21/823814 (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 2 patents
• H01L29/78696 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H10B10/125 (ELECTRONIC MEMORY DEVICES): 1 patents
• H01L21/823475 (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents
• H01L21/823481 (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents
• H01L27/088 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L29/41775 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H10D64/256 (No explanation available): 1 patents
• H01L23/5286 ({Geometry or} layout of the interconnection structure {(): 1 patents
• H10D30/43 (No explanation available): 1 patents
• H10D30/6735 (No explanation available): 1 patents
• H10D30/6757 (No explanation available): 1 patents
• H10D62/121 (No explanation available): 1 patents
• H10D84/85 (No explanation available): 1 patents
• H01L21/823871 (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents
• H01L27/11807 (Masterslice integrated circuits): 1 patents
• H01L27/0924 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L29/1037 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L29/1608 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L29/165 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L29/167 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L29/24 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L29/267 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L29/7848 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2027/11824 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2027/11831 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2027/11838 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/823842 (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents
• H01L27/1207 ({combined with devices in contact with the semiconductor body, i.e. bulk/SOI hybrid circuits}): 1 patents
• H01L21/84 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents

Companies

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List of Companies

• Taiwan Semiconductor Manufacturing Company, Ltd.: 11 patents
• TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.: 1 patents

Collaborators

• Ta-Chun LIN (2 collaborations)
• Yu-Lung TUNG (2 collaborations)
• Xiaodong WANG (2 collaborations)
• Dian-Sheng YU (1 collaborations)
• Kuo-Hua PAN (1 collaborations)
• Chia-He CHUNG (1 collaborations)
• Wei-Chih HOU (1 collaborations)
• Feng-Ming CHANG (1 collaborations)
• Chun-Jun LIN (1 collaborations)
• Kao-Ting LAI (1 collaborations)