Category:Chih-Hao Wang

Chih-Hao Wang

Executive Summary

Chih-Hao Wang is an inventor who has filed 6 patents. Their primary areas of innovation include SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (2 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (2 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (1 patents), and they have worked with companies such as Taiwan Semiconductor Manufacturing Company, Ltd. (6 patents). Their most frequent collaborators include (2 collaborations), (2 collaborations), (2 collaborations).

Patent Filing Activity

File:Chih-Hao Wang Monthly Patent Applications.png

Technology Areas

File:Chih-Hao Wang Top Technology Areas.png

List of Technology Areas

• H01L29/42392 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L29/78696 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L27/088 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/82345 (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents
• H01L21/823481 (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents
• H01L29/41733 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L29/0665 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L29/263 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L29/401 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L29/41775 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01Q21/0043 ({Slotted waveguides (combination with horns): 1 patents
• H01P3/16 (Dielectric waveguides, i.e. without a longitudinal conductor): 1 patents
• H01Q1/3233 ({particular used as part of a sensor or in a security system, e.g. for automotive radar, navigation systems}): 1 patents
• H01Q13/0233 ({Horns fed by a slotted waveguide array (biconical horns): 1 patents
• H01L27/0886 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/02603 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/30604 (Chemical or electrical treatment, e.g. electrolytic etching (to form insulating layers): 1 patents
• H01L21/308 (using masks (): 1 patents
• H01L21/823412 (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents
• H01L21/823431 (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents
• H01L21/823456 (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents
• H01L29/0673 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L29/0847 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L29/42376 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L29/66742 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L29/66795 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L29/7851 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L29/78618 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H10D62/116 (No explanation available): 1 patents
• H10D30/014 (No explanation available): 1 patents
• H10D30/031 (No explanation available): 1 patents
• H10D30/43 (No explanation available): 1 patents
• H10D30/6757 (No explanation available): 1 patents
• H10D62/151 (No explanation available): 1 patents
• H10D64/018 (No explanation available): 1 patents
• H10D84/017 (No explanation available): 1 patents
• H10D84/038 (No explanation available): 1 patents
• H10D84/85 (No explanation available): 1 patents
• H01L23/5226 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/76805 ({the opening being a via or contact hole penetrating the underlying conductor}): 1 patents
• H01L21/76814 ({post-treatment or after-treatment, e.g. cleaning or removal of oxides on underlying conductors}): 1 patents
• H01L21/76816 ({Aspects relating to the layout of the pattern or to the size of vias or trenches (layout of the interconnections per se): 1 patents
• H01L21/76883 ({Post-treatment or after-treatment of the conductive material}): 1 patents
• H10D30/6729 (No explanation available): 1 patents
• H01L21/02063 ({during, before or after processing of insulating layers}): 1 patents
• H10D84/83 (No explanation available): 1 patents

Companies

File:Chih-Hao Wang Top Companies.png

List of Companies

• Taiwan Semiconductor Manufacturing Company, Ltd.: 6 patents

Collaborators

• Kuo-Cheng Chiang (2 collaborations)
• Huan-Chieh Su (2 collaborations)
• Chun-Yuan Chen (2 collaborations)
• Guan-Lin Chen (1 collaborations)
• Jung-Chien Cheng (1 collaborations)
• Shi Ning Ju (1 collaborations)
• Shih-Chuan Chiu (1 collaborations)
• Pei-Yu Wang (1 collaborations)
• Cheng-Chi Chuang (1 collaborations)
• Li-Zhen Yu (1 collaborations)
• Chia-Hao Chang (1 collaborations)
• Yu-Ming Lin (1 collaborations)
• Kuo-Cheng CHIANG (1 collaborations)
• Kuan-Ting Pan (1 collaborations)
• Wang-Chun Huang (1 collaborations)
• Ching-Wei Tsai (1 collaborations)
• Kuan-Lun Cheng (1 collaborations)
• Jung-Hung Chang (1 collaborations)
• Shih-Cheng Chen (1 collaborations)
• Tsung-Han Chuang (1 collaborations)
• Wen-Ting Lan (1 collaborations)
• Chia-Cheng Tsai (1 collaborations)
• Sheng-Tsung Wang (1 collaborations)
• Meng-Huan Jao (1 collaborations)